JPH0224501U - - Google Patents

Info

Publication number
JPH0224501U
JPH0224501U JP10281688U JP10281688U JPH0224501U JP H0224501 U JPH0224501 U JP H0224501U JP 10281688 U JP10281688 U JP 10281688U JP 10281688 U JP10281688 U JP 10281688U JP H0224501 U JPH0224501 U JP H0224501U
Authority
JP
Japan
Prior art keywords
circuit board
electronic component
resin
white
utility
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10281688U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP10281688U priority Critical patent/JPH0224501U/ja
Publication of JPH0224501U publication Critical patent/JPH0224501U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Details Of Resistors (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Description

【図面の簡単な説明】
第１図は本考案の一実施例の斜視図、第２図は
従来例の斜視図、第３図は表示を施すための印盤
の一例を示す斜視図である。 図において、１１は樹脂モールド型電子部品、
１２はリード端子、１３は樹脂モールド材、１３
ａは上面、「ＸＹ−０１２」は表示を示す。

Claims (1)

    【実用新案登録請求の範囲】
  1. 回路基板上に表面実装される樹脂モールド型電
    子部品であつて、回路基板に対する取付け面と対
    向する面が白色または銀色にされていることを特
    徴とする樹脂モールド型電子部品。
JP10281688U 1988-08-03 1988-08-03 Pending JPH0224501U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10281688U JPH0224501U (ja) 1988-08-03 1988-08-03

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10281688U JPH0224501U (ja) 1988-08-03 1988-08-03

Publications (1)

Publication Number Publication Date
JPH0224501U true JPH0224501U (ja) 1990-02-19

Family

ID=31333073

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10281688U Pending JPH0224501U (ja) 1988-08-03 1988-08-03

Country Status (1)

Country Link
JP (1) JPH0224501U (ja)

Similar Documents

Publication Publication Date Title
JPH0546928Y2 (ja)
JPH0224501U (ja)
JPH0328742U (ja)
JPH01139442U (ja)
JPS6316178U (ja)
JPH02138457U (ja)
JPH0160570U (ja)
JPH03113833U (ja)
JPH01153667U (ja)
JPS63180988U (ja)
JPH0295201U (ja)
JPS6113921U (ja) チツプ形コンデンサ
JPH03128952U (ja)
JPH0345U (ja)
JPS63177005U (ja)
JPH0379444U (ja)
JPS629195U (ja)
JPH0392047U (ja)
JPH01146537U (ja)
JPS6127272U (ja) モ−ルドフラツトパツケ−ジ
JPH01119169U (ja)
JPH02114940U (ja)
JPH0298699U (ja)
JPH01123373U (ja)
JPS6033448U (ja) プラスチックモ−ルド型集積回路素子