JPH0224546U - - Google Patents
Info
- Publication number
- JPH0224546U JPH0224546U JP1988101652U JP10165288U JPH0224546U JP H0224546 U JPH0224546 U JP H0224546U JP 1988101652 U JP1988101652 U JP 1988101652U JP 10165288 U JP10165288 U JP 10165288U JP H0224546 U JPH0224546 U JP H0224546U
- Authority
- JP
- Japan
- Prior art keywords
- heater plate
- vacuum
- holes
- vacuum pump
- vacuum holes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
- H10W72/07178—Means for aligning
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988101652U JPH0224546U (cs) | 1988-07-29 | 1988-07-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988101652U JPH0224546U (cs) | 1988-07-29 | 1988-07-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0224546U true JPH0224546U (cs) | 1990-02-19 |
Family
ID=31330839
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988101652U Pending JPH0224546U (cs) | 1988-07-29 | 1988-07-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0224546U (cs) |
-
1988
- 1988-07-29 JP JP1988101652U patent/JPH0224546U/ja active Pending