JPH0224554U - - Google Patents
Info
- Publication number
- JPH0224554U JPH0224554U JP10133288U JP10133288U JPH0224554U JP H0224554 U JPH0224554 U JP H0224554U JP 10133288 U JP10133288 U JP 10133288U JP 10133288 U JP10133288 U JP 10133288U JP H0224554 U JPH0224554 U JP H0224554U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- view
- caps
- leads
- sectional
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011521 glass Substances 0.000 claims description 2
- 239000008188 pellet Substances 0.000 claims description 2
- 239000002184 metal Substances 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Landscapes
- Details Of Resistors (AREA)
Description
第１図は本考案の一実施例にかかる電子部品の
断面図、第２図は同実施例の電子部品をプリント
基板に搭載した状態を示す斜視図、第３図は本考
案の他の実施例における電子部品の断面図、第４
図は従来の軸状電子部品のプリント基板への搭載
状態の説明面図、第５図は従来のリードレス電子
部品のプリント基板への搭載状態の説明図、第６
図は従来の軸状電子部品とその封着治具とを示す
断面図、第７図は従来のリードレス電子部品とそ
の封着治具とを示す断面図である。
３……リード、３ａ……リード根元部、４……
半導体ペレツト、６……ガラス、７……導電性キ
ヤツプ（金属製キヤツプ）、９……部品本体、１
３……導電性キヤツプ（金属環）。
FIG. 1 is a cross-sectional view of an electronic component according to an embodiment of the present invention, FIG. 2 is a perspective view showing the electronic component of the same embodiment mounted on a printed circuit board, and FIG. 3 is another embodiment of the present invention. Cross-sectional view of electronic components in example, 4th
The figure is an explanatory plan view of a conventional shaft-shaped electronic component mounted on a printed circuit board, FIG. 5 is an explanatory diagram of a conventional leadless electronic component mounted on a printed circuit board, and FIG.
The figure is a sectional view showing a conventional shaft-shaped electronic component and its sealing jig, and FIG. 7 is a sectional view showing a conventional leadless electronic component and its sealing jig. 3...Lead, 3a...Lead base, 4...
Semiconductor pellet, 6... Glass, 7... Conductive cap (metal cap), 9... Component body, 1
3... Conductive cap (metal ring).
Claims (1)
両端より突出するリードの根元部に導電性キヤツ
プを挿着し、該リードの上記キヤツプより突出し
た部分を切除してなる電子部品。 An electronic component made by inserting conductive caps into the bases of leads protruding from both ends of a component body in which electronic component pellets are sealed in glass, and cutting off the portions of the leads that protrude from the caps.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10133288U JPH0224554U (en) | 1988-07-29 | 1988-07-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10133288U JPH0224554U (en) | 1988-07-29 | 1988-07-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0224554U true JPH0224554U (en) | 1990-02-19 |
Family
ID=31330226
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10133288U Pending JPH0224554U (en) | 1988-07-29 | 1988-07-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0224554U (en) |
-
1988
- 1988-07-29 JP JP10133288U patent/JPH0224554U/ja active Pending
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