JPH0224557U - - Google Patents
Info
- Publication number
- JPH0224557U JPH0224557U JP10239888U JP10239888U JPH0224557U JP H0224557 U JPH0224557 U JP H0224557U JP 10239888 U JP10239888 U JP 10239888U JP 10239888 U JP10239888 U JP 10239888U JP H0224557 U JPH0224557 U JP H0224557U
- Authority
- JP
- Japan
- Prior art keywords
- lead
- view
- package
- plan
- surface mount
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案の実施例を示す平面図、第２図
は第１図のリード固定部分の拡大図、第３図は第
２図のＡ−Ａ線断面図、第４図は従来例を示す平
面図である。
図において、１は表面実装部品、２はパツケー
ジ、３はリード、３１は斜辺部、３２は固定部を
示す。
Fig. 1 is a plan view showing an embodiment of the present invention, Fig. 2 is an enlarged view of the lead fixing part in Fig. 1, Fig. 3 is a sectional view taken along line A-A in Fig. 2, and Fig. 4 is a conventional example. FIG. In the figure, 1 is a surface mount component, 2 is a package, 3 is a lead, 31 is an oblique side portion, and 32 is a fixing portion.
Claims (1)
辺部３１を有して、該リード３の先端に平面視楔
形の固定部３２を形成してなることを特徴とする
表面実装部品。 A surface mount component characterized in that a lead 3 protruding from a package 2 has an oblique side portion 31 at its periphery, and a fixing portion 32 shaped like a wedge in plan view is formed at the tip of the lead 3.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10239888U JPH0224557U (en) | 1988-08-03 | 1988-08-03 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10239888U JPH0224557U (en) | 1988-08-03 | 1988-08-03 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0224557U true JPH0224557U (en) | 1990-02-19 |
Family
ID=31332274
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10239888U Pending JPH0224557U (en) | 1988-08-03 | 1988-08-03 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0224557U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013229435A (en) * | 2012-04-25 | 2013-11-07 | Toshiba Corp | Connection structure for microwave circuit, and microwave module |
-
1988
- 1988-08-03 JP JP10239888U patent/JPH0224557U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013229435A (en) * | 2012-04-25 | 2013-11-07 | Toshiba Corp | Connection structure for microwave circuit, and microwave module |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH0258368U (en) | ||
| JPS60139750U (en) | blister packaging | |
| JPS61112650U (en) | ||
| JPH0390872U (en) | ||
| JPS6139740U (en) | makeup cover | |
| JPS62201942U (en) | ||
| JPH0291351U (en) | ||
| JPS6299998U (en) | ||
| JPH0178047U (en) | ||
| JPH0258344U (en) | ||
| JPS61152396U (en) | ||
| JPH0211336U (en) | ||
| JPS6294648U (en) | ||
| JPS62180941U (en) | ||
| JPH0226234U (en) | ||
| JPS6454327U (en) | ||
| JPS6374493U (en) | ||
| JPH02108430U (en) | ||
| JPS59132450U (en) | End cap attachment structure for resin molding | |
| JPH022509U (en) | ||
| JPS5883316U (en) | bucket conveyor | |
| JPS63131144U (en) | ||
| JPS6273776U (en) | ||
| JPS6191631U (en) | ||
| JPH01143130U (en) |