JPH0224559U - - Google Patents

Info

Publication number
JPH0224559U
JPH0224559U JP1988103064U JP10306488U JPH0224559U JP H0224559 U JPH0224559 U JP H0224559U JP 1988103064 U JP1988103064 U JP 1988103064U JP 10306488 U JP10306488 U JP 10306488U JP H0224559 U JPH0224559 U JP H0224559U
Authority
JP
Japan
Prior art keywords
output terminal
emitter
electrode
collector
support plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1988103064U
Other languages
Japanese (ja)
Other versions
JPH0627957Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988103064U priority Critical patent/JPH0627957Y2/en
Publication of JPH0224559U publication Critical patent/JPH0224559U/ja
Application granted granted Critical
Publication of JPH0627957Y2 publication Critical patent/JPH0627957Y2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H10W72/5475—Dispositions of multiple bond wires multiple bond wires connected to common bond pads at both ends of the wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Wire Bonding (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本考案の一実施例のパワートランジス
タの要部平面図、第２図は従来のパワートランジ
スタの要部平面図である。 １：トランジスタチツプ、２１：エミツタ出力
端子、２２：ベース出力端子、２３：コレクタ出
力端子、３１，３２，３３：帯状銅配線、４１，
４２，４３：Ａｌ線、５：チツプ支持板。 FIG. 1 is a plan view of a main part of a power transistor according to an embodiment of the present invention, and FIG. 2 is a plan view of a main part of a conventional power transistor. 1: Transistor chip, 21: Emitter output terminal, 22: Base output terminal, 23: Collector output terminal, 31, 32, 33: Strip copper wiring, 41,
42, 43: Al wire, 5: Chip support plate.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 下面にコレクタ電極、上面にエミツタおよびベ
ース電極を有するトランジスタチツプのコレクタ
電極が金属支持板上に固着され、エミツタ電極は
エミツタ出力端子と、ベース電極はベース出力端
子と、金属支持板はコレクタ出力端子とそれぞれ
複数の同一材料の導線によつて接続され、その際
金属支持板とコレクタ出力端子とを接続する導線
の総断面積がエミツタ電極とエミツタ出力端子と
を接続する導線の総断面積より小さいことを特徴
とするパワートランジスタ。 A collector electrode of a transistor chip having a collector electrode on the lower surface and an emitter and base electrode on the upper surface is fixed on a metal support plate, the emitter electrode serves as an emitter output terminal, the base electrode serves as a base output terminal, and the metal support plate serves as a collector output terminal. and are respectively connected by a plurality of conductive wires made of the same material, in which case the total cross-sectional area of the conductive wires connecting the metal support plate and the collector output terminal is smaller than the total cross-sectional area of the conductive wires connecting the emitter electrode and the emitter output terminal. A power transistor characterized by:
JP1988103064U 1988-08-03 1988-08-03 Power transistor Expired - Fee Related JPH0627957Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988103064U JPH0627957Y2 (en) 1988-08-03 1988-08-03 Power transistor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988103064U JPH0627957Y2 (en) 1988-08-03 1988-08-03 Power transistor

Publications (2)

Publication Number Publication Date
JPH0224559U true JPH0224559U (en) 1990-02-19
JPH0627957Y2 JPH0627957Y2 (en) 1994-07-27

Family

ID=31333545

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988103064U Expired - Fee Related JPH0627957Y2 (en) 1988-08-03 1988-08-03 Power transistor

Country Status (1)

Country Link
JP (1) JPH0627957Y2 (en)

Also Published As

Publication number Publication date
JPH0627957Y2 (en) 1994-07-27

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees