JPH0224625B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial Application Field) The present invention relates to an apparatus for soldering electrical components such as ICs.

(Prior Art) Recently, so-called flat package type ICs, as shown in FIG. 6, have come into widespread use. This IC 1 has a flat rectangular main body 2 with a large number of pin-shaped terminals 3 protruding from the four sides around the periphery.

Conventionally, when pre-soldering each terminal 3 of such an IC 1, for example, as shown in Japanese Unexamined Patent Publication No. 55-115394, holding stands are provided radially on a turntable, and a jig is attached to this holding stand. The turntable is mounted rotatably, a fluxing device, a soldering bath, etc. are arranged around the turntable, a flat package type IC is mounted on the jig, and the IC is moved by the rotation of the turntable. ,I C
The soldering process is performed by rotating the terminals and sequentially applying the necessary steps to the terminals on each side.

(Problem to be solved by the invention) In the case of the above conventional device, the IC is attached to the jig of each holding table.
The IC is attached one by one by suction, etc., and the IC is rotated to emboss each side one by one.
Soldering the terminals on each side of a large number of ICs is time-consuming.

SUMMARY OF THE INVENTION An object of the present invention is to solve these problems and to enable efficient soldering of a large number of objects to be soldered, each having a plurality of sides to be soldered.

[Structure of the invention]

(Means for Solving the Problems) The present invention includes a turntable 13 that rotates intermittently in a horizontal plane, a holder 14 provided radially on the turntable 13, and a holder 14 provided radially on the turntable 13.
a jig 41 which is rotatably attached to a soldering object 1 having soldering parts 3 on a plurality of sides and rotates so as to convert the soldering parts 3 facing downward; Fluxing devices 15a and 1 are sequentially arranged around the turntable 13 and below the moving part of the holder 14.
5b, preheating devices 16a, 16b and solder bath 1
7a, 17b, the jig 41 has a plurality of support rods 43, 43a attached and detached between the end plates 42 at both ends, and a plurality of support rods 43, 43a are attached and detached from each other at intervals and inside the jig 41. A support plate 44 is provided protruding along the inside of each support rod 43, 43a, and a corner of the object 1 to be soldered is engaged with the tip of each holding plate 44. A plurality of engagement grooves 46 that support each other
are formed at predetermined intervals, and the holding body 14
It is removably attached to the

(Function) In the present invention, the object 1 to be soldered having the parts 3 to be soldered on a plurality of sides is mounted on the jig 41, and the jig 41 is attached to the holder 14 and soldered on one side while moving. Next, by rotating the jig and soldering other sides, the parts 3 to be soldered on each side of the object 1 to be soldered are successively soldered one side at a time. , a large number of objects 1 to be soldered are engaged with and attached to the engagement grooves 46 in the support plate 44 of each support rod 43, 43a of the jig 41, and each side of the large number of objects 1 to be soldered is soldered. The parts are soldered one after another.

(Example) Hereinafter, an example of the present invention will be described with reference to the drawings.

In FIG. 1, 11 is a base, and this base 11
A circular turntable 13 is rotatably supported at the upper center of the turntable 13 via a rotating shaft 12, and a pair of holders 14 are provided radially on both sides of the turntable 13. Then, the turntable 13 is intermittently rotated in one direction by a predetermined angle in a horizontal plane via the rotating shaft 12 by a drive device (not shown), and the holder 14 is moved.
In the illustrated embodiment, the holder 14 is positioned sequentially from the No. 1 position to the No. 24 position. Further, the turntable 13 can also be rotated in the opposite direction.

Further, the turntable 1 is mounted on the base 11.
Two sets of jet fluxing devices 15 are installed below the movable portion of the holder 14 around the holder 14.
a, 15b, preheating devices 16a, 16b, vertically movable immersion type solder baths 17a, 17b, jet type cleaning device 18, cold air drying device 19, and hot air drying device 20 are arranged in this order.

As shown in FIG. 2, each holder 14 has a support frame 21 attached to the outer peripheral edge of the turntable 13, and guide shafts 22 on both sides of the support frame 21.
is erected, and arms 2 are attached to the guide shafts 22 on both sides of the guide shafts 22.
Both sides of the base of the arm 23 are supported to be able to move up and down, and an air cylinder device 24 attached to the upper center of the support frame 21 is connected to the center of the base of the arm 23. The arm 23 is configured to move up and down a predetermined height along the guide shaft 22.

A fixed abutment 25 is provided at the middle lower part of the arm 23, a rotary body 26 is rotatably provided on the fixed abutment 25, and a square engagement hole 27 is formed in the center of the rotary body 26. At the same time, the rotating body 2
6 is connected to a rotating shaft 28, and a sprocket wheel 29 is attached to this rotating shaft 28. Further, a stepping motor 30 is attached to the upper part of the arm 23, and a rotating shaft 31 of this motor 30 is attached to the upper part of the arm 23.
A sprocket foil 32 is fixed to the sprocket foil 32, and the sprocket foil 32 and the sprocket foil 2
An endless chain 33 is stretched between the sprocket wheel 32, the chain 33, and the sprocket wheel 29 from the rotating shaft 31 by the drive of the motor 30.
The rotating body 26 is rotated by a predetermined angle via the rotating shaft 28.

A movable support 35 is supported at the tip of the arm 23 via rods 34 on both sides so that it can move forward and backward, and an engagement hole 36 in the lower part of the movable support 35 corresponds to the engagement hole 27 of the fixed support 25. is formed, and a presser screw 37 is screwed into each rod 34 from the upper part of the arm 23, so that the movable support 35 is moved back and forth via the rod 34 and fixed by the presser screw 37.

41 is a jig, and as shown in FIGS. 3 to 5, this jig 41 has four support rods 43, 43a spaced apart from each other by a predetermined distance between end plates 42 at both ends, and has internally A support plate 44 is provided protruding along the inside of each of the support rods 43, 43a, and an engagement portion 45 having a triangular cross section is formed at the tip of the support plate 44. A plurality of engagement grooves 46 are formed in this engagement portion 45 at predetermined intervals. Further, a shaft portion 47 with a small diameter is formed at both ends of the one support rod 43a,
A fixing screw 48 is screwed into the outer end of this shaft portion 47, and the shaft portion 47 is engaged with a fitting groove 49 formed in the end plate 42, and by tightening and loosening the fixing screw 48, the support rod 43a is fixed. is the fitting groove 4
9 cannot be inserted or removed. In addition,
As shown in FIG. 3, each support rod 43, 43a
If it is long, a reinforcing plate 50 is attached to the middle part. Further, an engagement hole 27 of the rotating body 26 and a movable support 35 are provided on the sides of the central part of both the end plates 42.
Engagement shafts 51 and 52 that engage with the engagement holes 36 are provided in a protruding manner.

Next, the operation will be explained.

An object to be soldered having parts to be soldered on a plurality of sides is, for example, terminals 3 on each side of an IC 1 having terminals 3 on four sides of the main body 2, as shown in FIG.
The case of pre-soldering will be explained.

One support rod 43a of the jig 41 is removed, and each corner of the main body 2 of the IC 1 is inserted and engaged into the corresponding engagement groove 46 of the engagement portion 45 of the support plate 44 of the three support rods 43. Then, the support rod 43a is attached and fixed, and the corners of the main body 2 of the IC1 are also engaged with the respective engagement grooves 46 of the support plate 44 of the support rod 43a, and a large number of IC1
are supported in parallel.

And the jig 41 that supported this large number of IC1
The engagement shaft 51 at one end is engaged with the engagement hole 27 of the rotating body 26 via the angular surface, and the movable support 35
to the arm 23 side and insert the engagement shaft 52 at the other end of the jig 41 into the engagement hole 36 of the movable support 35.
The rod 34 of the movable support 35 is fixed with a presser screw 37, and the jig 41 is attached to the arm 23 of the holder 14.

In this way, as shown in FIG. 1, the IC is
1 is attached so that the terminal 3 on one side faces downward. Then, the holder 14 is sequentially moved by the intermittent rotation of the turntable 13, the arm 23 is lowered at the fluxing position (No. 3), and the terminal 3 facing downward is fluxed by the fluxing device 15a. is,
Arm 23 rises again.

Next, the holder 14 is at the preheating position (No. 4)
When moving to , the terminal 3 that has been fluxed first is preheated by the preheating device 16a. Furthermore, when the holding body 14 is moved to the next soldering device (No. 5),
The solder bath 17a rises, and the terminals 3, which have been fluxed and preheated, are returned to the solder bath 17a.

Then, the turntable 13 is rotated in the opposite direction, and the holder 14 is moved to the fluxing position (No. 3).
Go back to. Here, the jig 41 is rotated by a quarter of a rotation via the rotating body 26 by driving the motor 30, and the terminals 3 on the other side are positioned below. Then, in the same manner as above, by rotating the turntable 13 in one direction again, each terminal 3 facing downward is fluxed.
Preheated and soldered.

Then, by rotating the turntable 13 in one direction, the holder 14 is sent to the next fluxing position (No. 15), where the jig 41 is rotated a quarter of the way, and a new side facing downward is moved. The flux applying device 1 is applied to the terminal 3 of the terminal 3 by vertical movement of the arm 23.
Fluxing by 5b, preheating by preheating device 16b at the next preheating position (No. 16),
Soldering is performed using the solder bath 17b at the next soldering position (No. 17), and the turntable 13 is further rotated in the opposite direction to move back to the fluxing position (No. 15), and the jig 41 is further rotated. The terminals 3 on the new side are turned downward and fluxed, and then the turntable 13 is rotated in one direction to preheat and
Soldering is performed.

In this way, the IC1 mounted on the jig 41
The terminals 3 on the four sides are sequentially soldered, and when the turntable 13 rotates in one direction and reaches the cleaning position (No. 19 to No. 21), the arm 23 is lowered and the jig 41 is It is continuously rotated and washed with washing water by a washing device 18, and further,
The jig 41 rotates continuously and moves to the drying position (No. 22
~ No. 23), the jig 41 is dried by the cold air drying device 19 and the hot air drying device 20, and at the take-out position (No. 24), the jig 41 stops rotating and the arm 23 returns to the upper position. 41 is taken out to the outside.

In the above operation, the jigs 41 are alternately attached and detached from the pair of holders 14, and the operations are simultaneously performed by the two sets of fluxing devices 15a, 15b, preheating devices 16a, 16b, and solder baths 17a, 17b.

In addition, in implementation, the number of holders 14 is not limited to two, but three or more may be provided, and if the soldering part of the soldering object has multiple sides other than four sides, The number of support rods 43, 43a of the jig 41 may be increased or decreased to correspond to the surface to be soldered.

〔Effect of the invention〕

According to the present invention, a large number of objects to be soldered having portions to be soldered on a plurality of sides are engaged with and attached to engagement grooves in a support plate of each support rod of a jig, and the objects to be soldered are By attaching a jig that supports the solder to the holder, soldering one side as the turntable rotates, and then rotating the jig to solder the other side, a large number of soldered objects can be soldered. The parts to be soldered on each side of the accessory can be efficiently soldered simultaneously and continuously one side at a time.

[Brief explanation of drawings]

The figures show one embodiment of the present invention, in which Fig. 1 is a plan view of a soldering device, Fig. 2 is a perspective view with a part of its holder cut away, and Fig. 3 is a part of a jig. FIG. 4 is a sectional view of the part shown in FIG. 3, FIG. 5 is an enlarged sectional view of a part of the jig, and FIG. 6 is a perspective view of the soldered object. 1... IC as an object to be soldered, 3... Terminal as a part to be soldered, 13... Turntable, 14... Holder, 15a, 15b... Fluxing device, 16a, 16b... Preheating device ,
17a, 17b...Solder bath, 41...Jig, 4
2... End plate, 43, 43a... Support rod, 44
...Support plate, 46...Engagement groove.

Claims (1)

[Claims] 1. A turntable that rotates intermittently in a horizontal plane, a holder provided radially on the turntable, and a rotatably attached to the holder and soldered on multiple sides. a jig that rotates so as to attach an object to be soldered having a part thereon and convert the part to be soldered facing downward; In the soldering device equipped with a fluxing device, a preheating device, and a soldering bath, the above-mentioned jig has a plurality of support rods, at least one of which is removably attached between the end plates at both ends, and which are spaced apart from each other. A support plate is provided protruding along the inside of each support rod, and a corner of the object to be soldered is engaged with the tip of each support plate. A soldering device characterized in that a plurality of engaging grooves are formed at predetermined intervals and are detachably attached to the holding body.