JPH0225467U - - Google Patents
Info
- Publication number
- JPH0225467U JPH0225467U JP10396888U JP10396888U JPH0225467U JP H0225467 U JPH0225467 U JP H0225467U JP 10396888 U JP10396888 U JP 10396888U JP 10396888 U JP10396888 U JP 10396888U JP H0225467 U JPH0225467 U JP H0225467U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- convex portion
- planar dimension
- support
- adhesive layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000012790 adhesive layer Substances 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 4
Landscapes
- Packages (AREA)
- Packaging Frangible Articles (AREA)
- Belt Conveyors (AREA)
Description
第１図Ａは本考案の一実施例を示す上面図、第
１図Ｂは第１図Ａにおけるｂ―ｂ断面図、第２図
は本考案の別実施例を示す説明図、第３図並びに
第４図はそれぞれ本考案の他の別実施例を示す説
明図、第５図は第４図の実施例における電子部品
の脱離状態を示す説明図、第６図、第７図、並び
に第８図はそれぞれ従来例を示す説明図である。
図において、１……は搬送用支持体、３……は
凸部、４……は接着層、５……は電子部品である
。
FIG. 1A is a top view showing one embodiment of the present invention, FIG. 1B is a sectional view taken along line bb in FIG. 1A, FIG. 2 is an explanatory diagram showing another embodiment of the present invention, and FIG. FIG. 4 is an explanatory diagram showing another embodiment of the present invention, FIG. 5 is an explanatory diagram showing a detached state of electronic components in the embodiment of FIG. 4, FIGS. 6 and 7, and FIG. FIG. 8 is an explanatory diagram showing a conventional example. In the figure, 1... is a transport support, 3... is a convex portion, 4... is an adhesive layer, and 5... is an electronic component.
Claims (1)
い平面寸法で、かつ高さが支持体の厚みの１〜５
０倍の凸部を成形し、該凸部に接着層を介して電
子部品を固着したことを特徴とする電子部品搬送
帯。 The transport support has a planar dimension approximately equal to the planar dimension of the electronic component, and a height of 1 to 5 times the thickness of the support.
An electronic component conveying belt characterized in that a convex portion of 0 times is formed and an electronic component is fixed to the convex portion via an adhesive layer.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10396888U JPH069986Y2 (en) | 1988-08-04 | 1988-08-04 | Electronic component carrier |
| KR1019890012051A KR900005862A (en) | 1988-02-26 | 1989-08-24 | Carrier for Electronic Parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10396888U JPH069986Y2 (en) | 1988-08-04 | 1988-08-04 | Electronic component carrier |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0225467U true JPH0225467U (en) | 1990-02-20 |
| JPH069986Y2 JPH069986Y2 (en) | 1994-03-16 |
Family
ID=31335269
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10396888U Expired - Lifetime JPH069986Y2 (en) | 1988-02-26 | 1988-08-04 | Electronic component carrier |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH069986Y2 (en) |
-
1988
- 1988-08-04 JP JP10396888U patent/JPH069986Y2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH069986Y2 (en) | 1994-03-16 |
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