JPH02256253A - Semiconductor inspecting apparatus - Google Patents

Abstract

PURPOSE:To simplify the conveying mechanism of trays and to improve throughput by providing individual tray holding parts which hold a tray whose inspection is finished and a tray which is to be processed at the next time on one tray conveying mechanism at the same time. CONSTITUTION:When a tray 3a is heated to a specified temperature, a tray mounting stage 11 is lifted. The tray 3a is held with the clampling mechanism of a holding part 41 for tray input. At this time, an inspecting stage 14 on which a tray 3b whose inspection is finished is moved to a part beneath a holding part 42 for tray output. At the same time, the processed tray 36 on the inspecting stage 14 is held with the holding part 42 for tray output. After the inspected tray 3b and the tray 3a which is to be processed at the next time are held with the tray holding parts 41 and 42, a Lotless cylinder 48 is driven. A sliding plate 47 is moved to the side of an outputting station 18. In this way, the throughput is improved, and the constitution of the apparatus can be made simple.

Description

[Detailed description of the invention] [Purpose of the invention] (Industrial application field) The present invention relates to a semiconductor inspection device.

(Prior Art) Conventionally, in the process of inspecting the electrical characteristics of packaged semiconductor devices, since there are a wide variety of semiconductor device packages, a dedicated inspection device (IC handler) is required for each type of package. In response to the recent trend toward high-mix, low-volume production of semiconductor devices, a universal handler has been developed that can measure semiconductor devices of many shapes with a single unit by replacing the measuring unit. has been done.

A one-tray type is known as a form of supplying semiconductor elements to such a universal handler.

This one-tray type IC handler has a tray with a large number of device storage sections, for example, arranged in a grid pattern, in which packaged semiconductor devices, such as QFPSSOPs, are stored, and probes installed in the test head of the IC handler. It is constructed so that each semiconductor element on the tray is sequentially brought into contact with an inspection terminal such as a needle to be inspected.

In addition, in recent years, IC handlers that can measure high and low temperatures have been developed in order to test semiconductor devices at predetermined test temperatures, such as in high and low temperature environments.
As a handler, a so-called high-low temperature type IC handler is known, which is configured to house an inspection section in a high-temperature/low-temperature chamber and perform a series of tests within this chamber.

The tray transport system in this high-temperature IC handler uses a tray transport mechanism to transport the tray from a trace stocker, etc. to a loading station in the chamber onto an inspection table in the inspection department, where it is loaded after a series of tests are completed. , the tray on the inspection table is again transported to the unloading station by the tray transporting mechanism, and then transported out of the chamber. That is, the tray conveyance system in the conventional IC handler is configured to repeatedly perform the following operations: carry-in station -> inspection table -> carry-out station - carry-in' station.

This high-low temperature type IC handler automates the inspection section and tray transport system, and shortens the heating and cooling time of inspection trays in order to support unmanned manufacturing processes and improve throughput. ing.

(Problems to be Solved by the Invention) However, there is a need for an IC handler with further improved throughput, and there is also a need to simplify the overall configuration of the device.

For example, in the tray transport system of conventional high-temperature inspection equipment, while the trays that have been inspected are being transported to the unloading station, the next processing tray in the loading station is in a standby state, which reduces the overall throughput of the equipment. There was a problem that the

In addition, if we tried to solve this problem by installing dedicated transport systems between the loading station and the inspection table and between the inspection table and the unloading station, the mechanism would become complicated and the cost of the equipment would increase. There was a problem.

The present invention has been made in view of the above-mentioned conventional circumstances, and it is an object of the present invention to provide a semiconductor inspection device with improved throughput and a simple device configuration.

[Structure of the Invention] (Means for Solving the Problems) A semiconductor inspection apparatus of the present invention sequentially transports a storage container containing a plurality of semiconductor elements to an inspection section by a transport mechanism, and tests each semiconductor element in the storage container. The semiconductor testing device for testing various electrical characteristics is characterized in that the transport mechanism is configured to simultaneously hold and transport a storage container that has been tested and a storage container for the next test.

The semiconductor testing device of the present invention also includes placing a tray on which a plurality of semiconductor devices are mounted on a test table in a high-temperature or low-temperature chamber, and bringing the test terminal into contact with the electrode terminal of each of the semiconductor devices at a predetermined test temperature. In a semiconductor inspection apparatus that performs inspection, a preheating/cooling mechanism for preheating or cooling a tray carried into the chamber to a predetermined temperature, and a preheating/cooling mechanism built in the inspection table for maintaining the tray at a predetermined inspection temperature are provided. a heating/cooling mechanism, and a holding part for holding a tray on the preheating/cooling mechanism and a tray on the inspection table, respectively, and a tray transfer between the preheating/cooling mechanism and the inspection table and the inspection table. and a tray transfer mechanism that simultaneously transfers trays between other parts.

(Function) According to the semiconductor inspection device of the above-described invention, it is possible to simplify the device configuration and improve throughput.

(Example) Hereinafter, an example in which the present invention is applied to a high-temperature type semiconductor inspection device will be described with reference to the drawings.

FIG. 1 is a plan view showing the semiconductor inspection apparatus of the embodiment, and the second
The figure is a side view in the A direction of FIG. 1.

A high temperature chamber 1 containing an inspection section is covered with a heat insulating wall 2 made of a heat resistant material, for example, a stainless steel material.
A tray 3 containing semiconductor elements is placed outside the high temperature chamber 1.
A trace stocker 4 containing a large number of stages is provided.

The tray 3 used in this embodiment is, for example, about 255+ made of stainless steel or aluminum material, as shown in FIG.
Accommodating grooves 33 for accommodating independent semiconductor elements 32 in a grid of 4 rows and 5 columns are formed on the surface of a rectangular tray main body 31 measuring 210 mm x 1 Oma+ in thickness.

Each tray 3 accommodated in the trace stocker 4 is taken out one by one by the take-out mechanism 5 in the trace stocker 4, and is transported into the high temperature chamber 1 through the entrance 6 provided in the heat insulating wall 2. The tray is automatically placed on the tray mounting table 8 of the thermal station 7. The tray mounting table 8 of the first thermal station 7 has a built-in heater mechanism, such as a silicon rubber heater, to raise the temperature of the mounted tray 3 to a temperature close to the inspection setting temperature, for example, 150°C.

The tray 3 heated to a predetermined temperature at the first thermal station 7 is transferred to the tray mounting table 20 of the second thermal station 10 by a transfer mechanism, for example, an air cylinder 9.

Tray mounting table 1 of this second thermal station 10
1 also has a built-in heater mechanism like the tray mounting table 8 of the first thermal station 7, which raises the temperature of the mounted tray 3 to a predetermined temperature or maintains the temperature raised by the first thermal station 7. Heat tray 3 so that

These first and second thermal stations 7.10 constitute a tray preheating mechanism 12.

At the second thermal station 10, a predetermined temperature, e.g.
The tray 3 heated to 00°C is held by the tray loading holder 41 of the tray transport mechanism 13 disposed above the second thermal station 10, and is placed on the tray loading table 8.11 of the tray preheating mechanism 12. The sample is transported onto an inspection table 14 in an inspection section that has a built-in heating mechanism.

The inspection table 14 includes a three-dimensional movement mechanism such as an X stage 15,
The probe needle (not shown) is mounted on a three-dimensional movement mechanism consisting of a Y stage 16 and a Z stage (elevating mechanism) 17, and each terminal of the semiconductor element 32 in the tray 3 is moved based on a predetermined inspection procedure. The tray 3 is moved so that it comes into contact with the trays sequentially.

In the drive control of the three-dimensional movement mechanism of this embodiment, if the semiconductor elements 32 on the tray 3 are to be inspected one by one by contacting the probe needle, the inspection table 14 is moved at each arrangement pitch L1 or L2 of the semiconductor elements 32. The drive is controlled so that it advances.

Further, when a plurality of semiconductor devices are inspected using a probe needle capable of simultaneous measurement, drive control is performed so that the tray 3 moves for each group of semiconductor devices. For example, when using a probe needle that can simultaneously determine Al1 for one row of semiconductor devices on the tray 3, the pitch L is set so that the tray 3 moves row by row.
The drive is controlled by 2. In this way, the driving of the examination table 14 is as follows:
It is controlled in accordance with the configuration of the inspection terminal such as a probe needle.

The tray 3 on which all the semiconductor devices 32 have been measured is transported to the lower part of the tray transport mechanism 13 by the x-y-z stage 15, 16, 17. 42 and transported to the unloading station 18.

The tray conveyed to the carry-out station 18 is carried out of the heat-insulating chamber 1 through a carry-out port 19 provided in the heat-insulating wall 2 by a discharge mechanism such as an air pusher (not shown). This unloading station 18 is equipped with a dew condensation prevention mechanism (not shown) that sprays dry gas, such as dry nitrogen, onto the tray in order to prevent dew condensation on the surface of the tray 3 due to the temperature difference inside and outside the insulation chamber 1 when the tray is unloaded. It is being

The tray 3 thus carried out outside the heat insulating chamber 1 is transported to the next processing step, but in this embodiment, a sorter mechanism 20 is disposed on the side of the heat insulating chamber.
0 to select the semiconductor elements 32 in the tray 3.

The sorter mechanism 20 takes out the desired semiconductor devices in the tray 3 using a transfer arm 21 equipped with a take-out mechanism, such as a vacuum chuck mechanism, and transfers them to a plurality of devices arranged corresponding to each type of semiconductor device. There are some that are configured to be accommodated in the conveyor line 22.

By the way, the tray transport mechanism 13 has a tray carrying-in holding part 41 and a tray carrying-out holding part 42 suspended therein.
Next processing tray 3a on second thermal station 10
It is configured such that the operation of transferring the inspection table 3b onto the inspection table 14 and the operation of transferring the inspection completion tray 3b on the inspection table 13 to the carry-out station 18 can be performed simultaneously.

Hereinafter, a more detailed configuration of this tray conveyance mechanism 22 will be explained with reference to FIG. 4.

A groove 43 is bored in the upper heat insulating wall 2a of the heat insulating chamber 1 to mount a transport mechanism that connects the upper part of the second thermal station 10 and the upper part of the unloading station 18. A base plate 44 of the transport mechanism 13 is fitted. The base plate 44 includes
A rectangular slide groove 45 is bored along the longitudinal direction, and slide mechanisms such as LM guide mechanisms 46 are provided on the base plates on both sides of the slide groove 45, respectively. The tray carrying-in holding part 41 and the tray carrying-out holding part 42 are then moved to the heat insulating chamber 1 at a predetermined interval, for example, 3251nlll, via this LM guide mechanism 46.
A slide plate 47 suspended from the side is attached. Each tray holder 41, 42 may have any structure as long as it can securely hold the tray. In this example,
Tray 3a.

3b from both sides of the tray holding plate 41a142 with an L-shaped cross section.
A clamping mechanism was used to clamp and hold the device. This clamp mechanism is provided on the tray holding plates 4]a, 42a and the base plate 44, and is provided on the tray holding plate 41a,
, 42a, etc., including a clamp drive mechanism (not shown).

The slide plate 47 is connected to a telescoping mechanism provided on the base plate 44, for example, a rotless cylinder 48, and by the telescoping action of the rotless cylinder 48, the LM
It is configured to move left and right in the figure along a guide mechanism 46.

Further, at both ends of one side of the LM guide mechanism 46, a stroke limit switch 49 is provided which defines the slide stroke of the slide plate 47 and has a shock absorbing function.
By adjusting the distance between 9, the stroke of the slide plate 47 can be adjusted to 2J. In the present embodiment, this slide stroke is set to 1, that is, 325 square meters, which is the same as the interval between the tray holding parts 41 and 42.

The operation of the tray transport mechanism 13 having such a configuration will be described below.

When the tray 3a on the second thermal station 10 is heated to a predetermined temperature, the tray mounting table 11 of the second thermal station 10 is raised. At this time, the slide plate 47 of the tray conveyance mechanism 13 has moved so that the tray loading holder 41 is positioned above the second thermal station 10 (on the right side in the figure), and the tray 3a has been raised by the tray mounting table 11. is gripped by the clamp mechanism of the tray loading holding section 41. At this time, the tray unloading holding part 4
2, the inspection table 23 of the inspection section on which the trays 3b that have been inspected are mounted is moving, and at the same time as the tray carry-in holding section 41 operates, the processed trays 3a on the inspection table 14 are moved.
is held by the tray unloading holder 42.

In this way, the inspected tray 3b and the tray 3 for next processing are
After the trays 41 and 42 are held by the respective tray holders 41 and 42, the rotless cylinder 48 is driven to move the slide plate 47 to the unloading station 18 side (left side in the figure). The movement stroke β1 of the slide plate 47 and each tray holding portion 41.
42 and the intervals between each station 10.18 and the inspection table 14 are at equal pitches. There is a holding part 4 for carrying out the tray.
2 will be placed respectively. After that, the trays 3a and 3b are transferred to the tray mounting tables of the inspection table 14 and the unloading station 18, respectively, and then the slide plate 47 is moved in the opposite direction again until the inspection of the trays on the inspection table 14 is completed. Wait in this state, and repeat the above operation after the inspection is completed.

By providing separate tray holding sections 41 and 42 for simultaneously holding the inspection-finished tray 3b and the next processing tray 3a in one tray transport mechanism 13 in this way, the tray transport mechanism is simplified, and moreover, it is possible to simplify the tray transport mechanism while the tray is being unloaded. Since the waiting time for carrying in the next processing tray is eliminated, the transportation time can be shortened, and the throughput of the apparatus can be improved.

In this way, the semiconductor testing device of this embodiment eliminates the waiting time during tray transportation and the waiting time for the tray to heat up to the set testing temperature, streamlining the series of testing operations and improving the throughput of the device. do. Further, since the conveyance of inspected trays and the conveyance of trays for the next inspection can be carried out simultaneously by one tray conveyance mechanism, the configuration of the tray conveyance system is simplified.

By the way, the present invention is not limited to an inspection device that performs high-temperature measurements as in the above embodiment, but can also be applied to an inspection device that performs low-temperature measurements, and can be applied to any one-tray type semiconductor inspection device. Applicable.

[Effects of the Invention] As described above, according to the semiconductor testing device of the present invention, it is possible to realize a semiconductor testing device with improved throughput and a simplified device configuration.

[Brief explanation of drawings]

FIG. 1 is a plan view showing the configuration of a semiconductor inspection apparatus according to an embodiment of the present invention, FIG. 2 is a side view in the A direction of FIG. 1, FIG. 3 is a plan view showing the configuration of a tray, and FIG. FIG. 2 is a plan view, a front view, and a side sectional view showing the configuration of a tray conveyance mechanism according to an embodiment. 1... High temperature chamber, 2... Heat insulation wall,
3... Tray 7... First thermal station, 8... Tray mounting stand, 10...
...Second thermal station, 11...
・Tray mounting table, 13...Tray transport mechanism, 1
4...Inspection table, 32...Semiconductor element,
41... Holding part for carrying in the tray, 42...
・Tray unloading holding part, 44...Base plate, 45...Slide groove 45.46...
・LM guide mechanism, 47...Slide plate, 48
...Rotless cylinder.

Claims (2)

[Claims] (1) In a semiconductor inspection device that sequentially transports a storage container containing a plurality of semiconductor elements to an inspection section by a transport mechanism and tests various electrical characteristics of each semiconductor element in the storage container, the transport mechanism is for testing. A semiconductor inspection device characterized in that it is configured to hold and transport a finished storage container and a storage container for the next test at the same time. (2) Semiconductor inspection equipment that performs inspection by placing a tray loaded with a plurality of semiconductor elements on an inspection table in a high-temperature or low-temperature chamber and bringing the inspection terminal into contact with the electrode terminal of each of the semiconductor elements at a predetermined inspection temperature. a preheating/cooling mechanism for preheating or cooling the tray carried into the chamber to a predetermined temperature; a heating/cooling mechanism built into the inspection table for maintaining the tray at a predetermined inspection temperature; It has a holding part that holds a tray on the preheating/cooling mechanism and a tray on the inspection table, respectively, and transfers the tray between the preheating/cooling mechanism and the inspection table, and between the inspection table and other parts. A semiconductor inspection device comprising a tray transfer mechanism that simultaneously performs tray transfer.