JPH02258395A - Preparation of ic card - Google Patents

Abstract

PURPOSE:To prepare an IC card easily in a mass production system by positioning a film sheet having an IC module adhered and fixed thereto in the cavity of a mold and injecting a synthetic resin in said cavity to integrally form a synthetic resin plate before releasing the synthetic resin plate from the film sheet along with the IC module. CONSTITUTION:IC modules 21 are bonded and fixed to a long film sheet 41 at a predetermined interval so that an insulating substrate 25 is brought into contact with the film sheet 41 and moved to the predetermined position of a fixed mold 35 to be temporarily stopped and a movable mold 31 is allowed to fall to perform clamping and a synthetic resin is injected in a cavity 33 to form the flat plate-shaped synthetic resin plate 45 integrated with the IC modules 21 on the upper surface of the film sheet 41. Thereafter, the movable mold 31 is raised to release the synthetic resin plate 45 from the film 41 to prepare the flat plate-shaped synthetic resin plate 45 integrated with the IC modules 2. By the above mentioned method, an IC card can be easily prepared in a mass production system.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a method of manufacturing an IC card incorporating an IC module.

[Prior Art] Today, IC cards with built-in IC chips such as microcomputers and memory are being put into practical use.Since these IC cards have a larger storage capacity than conventional magnetic stripe cards, they are used for various purposes. It is being considered for use in

In this IC card, an IC chip 23 is mounted on an insulating substrate 25 as shown in FIG. IC with synthetic resin to cover IC chip 23 etc.
An IC module 21 with a sealed chip 23 is often used, and as shown in FIG.
An IC card board 15 made of vinyl chloride or the like having a through hole 16 of approximately the same size as the IC card board 5 is separately manufactured, and the IC module 21 is inserted into the through hole 1B of the IC card board 5, as shown in FIG. As shown in FIG. 2, after filling the area around the IC module 21 with a buffer 13 such as epoxy resin or silicone resin and fixing the IC module 21 to the IC card board 15, approximately 0.0 mm is applied to the front and back sides of the IC card board 15. It is manufactured by fusing an oversheet 18 having a thickness of about 1 ms.

Incidentally, a small hole 19 is provided in a part of the oversheet 18 on the back surface, and an IC module 2 provided on the back surface of the insulating substrate 25 is provided.
The electrode 29 of No. 1 is exposed on the back surface of the IC card IO.

In another manufacturing method, an IC chip 23 is mounted on an insulating substrate 25, and an IC module 21 in which the IC chip 23, thin metal wires 27, etc. are exposed is mounted on an IC card substrate 1.
The IC module 217 is inserted into the through hole 16 of the IC card substrate 15, and the through hole IB is filled with synthetic resin to seal the IC chip 23 and the thin metal wire 27. In addition, the IC module 21 is placed in a jig having an IC card-shaped space, a synthetic resin is injected into the space, and the synthetic resin is irradiated with ultraviolet rays. Should the resin be cured?

Alternatively, by heating the injected synthetic resin, the resin is cured to create an IC card 10 with a built-in IC module 21.
(for example, JP-A No. 60-217491)
There is also

[Problems to be Solved by the Invention] A method of pre-forming an IC card substrate, inserting an IC module into a through hole of the IC card substrate, and fixing the IC module to the IC card substrate with filled resin is It has been difficult to improve mass productivity because the manufacturing process involves a wide variety of processes, including manufacturing, inserting and fixing the IC module, and surface treatment to remove unevenness from the filled resin.

In addition, in a manufacturing method in which the IC module is placed in the empty H portion of the jig and then molten synthetic resin is injected into the space, the IC
The module is simply placed in the jig, and the IC
The module has a thickness of about 0.5 ts, and is an extremely small plate-like body with length and width of more than 1 cm, so if the resin injection speed is high, the position of the IC module may shift. It was difficult to improve mass productivity.

[! ! Means for Solving the Problem] The present invention fixes 116 IC modules to a film sheet, and fixes the film sheet between a fixed mold and a movable mold, and then inserts the IC module into the cavity of the mold. A flat synthetic resin plate is formed integrally with the IC module so as to cover the IC module by positioning the synthetic resin plate inside the IC module and injecting synthetic resin into the cavity. If the IC card is peeled off from the film sheet and the IC module is embedded, or if a film sheet with through holes is used and the IC module is adhered to the through hole position, the injection molded synthetic resin board is integrated with the film sheet. A card-shaped flat plate having a predetermined size is punched out from the synthetic resin plate as it is, and an IC card with a built-in IC module is made.

[Function] The present invention adhesively fixes an IC module to a film sheet, and positions and fixes the IC module in the mold by sandwiching the film sheet between a fixed mold and a movable mold. By positioning, it is possible to position the IC module within the mold, and the positioning of the IC module becomes easy.

In addition, since the IC module is adhesively fixed to the film sheet and the film sheet is sandwiched between the molds, the IC module can be easily fixed in a predetermined position within the mold, and the IC module can be easily fixed in a predetermined position within the mold. The position of the IC-f3 Joule does not move even when performing injection molding where resin is injected at high speed.
By injection molding, a flat synthetic resin plate integrated with the IC module can be easily and quickly molded around the IC module.

Furthermore, by peeling the injection molded synthetic resin plate from the film sheet, it is possible to manufacture an IC card in which an IC module is embedded using the synthetic resin plate as an IC card substrate, and also to make an IC card of an appropriate size from the synthetic resin plate. An IC card with a built-in IC module can be manufactured by simply punching out a plate-like body.

[Example] In the first example of the present invention, as shown in FIG. 1, first, an IC module 21 is adhesively fixed to a long film sheet 41 at a predetermined interval. Incidentally, when bonding this IC module 21, the insulating substrate 25 with the electrode 29 provided on the back surface is bonded and fixed so as to be in contact with the film sheet 41. Then, the film sheet 41 to which the IC module 21 is adhesively fixed is placed on the fixed mold 35 as shown in FIG. 2, and the film sheet 41 is sent. The film sheet 41 is moved to a predetermined position on the fixed mold 35.
The feed of the third Fi! is temporarily stopped, the movable metal fi 31 placed above the fixed mold 35 is lowered, and the third Fi! As shown in J, the fixed mold 35 and the movable mold 531 clamp and fix the film sheet 41 to clamp the film sheet.
The IC module 21 adhesively fixed to the movable mold 31
IC module 21 is fixed at a predetermined position in cavity 33 of
A synthetic resin is filled above and around the IC module 21, and a flat synthetic resin plate 45 integral with the IC module 21 is formed on the upper surface of the film sheet 41, as shown in FIG.

The cavity 33 formed in the movable mold 31 has a depth of 0.78 layers, a width of 54 layers, and a length of 85.5 m+.
The intestine is formed into a shape having a size equal to the size of the IC card 10.

In this way, by injecting molten resin into the cavity 33 of the mold and forming a synthetic resin plate 45 having the same size as the IC card IO on the upper surface of the film sheet 41 by injection molding,
IC module 21 so as to cover IC module 21
After molding a flat synthetic resin plate 45 integrated with the IC, the movable mold 31 is raised to open the mold, and then the synthetic resin plate 45 is peeled off from the film sheet 41.
A flat synthetic resin plate 45 integrated with the module 21 is manufactured.

Therefore, this synthetic resin board 45 has the back surface of the synthetic resin board 45 and the insulating substrate 251s surface of the IC module 21 on the same plane, and has the IC module 21 buried therein, as shown in FIG. IC module 21 on the back side of
The IC card 10 is manufactured with the electrode 28 exposed.

In this embodiment, as described above, the film sheet (41) is fixed with the fixed metal (5).
! 35 and the movable mold 31, and the IC module 21 is adhesively fixed to the upper surface of the film sheet 41 which is clamped and fixed.
The IC module 21 can be reliably fixed in the mold via the film seam 41, and injection molding in which synthetic resin is injected into the mold at high speed is possible. Synthetic resin plate 4 that leaves only minute gate marks at the edges and has smooth upper and lower surfaces.
Since the synthetic resin plate 45 can be produced as an IC card 10 by peeling it from the film sheet 41, IC cards 10 can be easily mass-produced.

In addition, through holes 4 are formed in the film seam) 41 at predetermined intervals.
3, and the through hole 43 is made slightly smaller in size than the insulating substrate 25 of the IC module 21.
As shown in FIG. 6, the IC module 21 is placed at the position of the through hole 43, and the periphery of the insulating substrate 25 is adhered to the peripheral part of the through hole 43 in the film sheet (41). It may also be fixed to the film sheet 41 with adhesive.

When the through holes 43 are provided in the film sheet 41 in this way and the IC module 21 is bonded to the film sheet 41 using only the peripheral portion of the insulating substrate 25, the injection molded synthetic resin plate 45 is peeled off from the film sheet 41. At this time, the electrode 29 exposed on the back side of the IC card IO is connected to the IC module 2.
1 and film sheet 41 can be prevented from being soiled by the adhesive used to bond them together.

In yet another embodiment, a long film sheet 41 having through holes 43 slightly smaller than the insulating substrate 25 arranged at predetermined intervals is used, and the IC module 21 is adhesively fixed at the positions of the through holes 43. When molding the synthetic resin plate 45 by injection molding, the shape of the cavity 33 formed in the movable metal YJ31 is set to a depth equal to the thickness of the IC card 1G minus the thickness of the film sheet 41, and, Cavity 3
The width and length of the card 3 are slightly larger than the width and length of the IC card 10.

Using the movable mold 31 having such a cavity 33, IC
When the synthetic resin plate 45, which is slightly thinner and has a slightly larger plane than the card IO, is injection molded on the upper surface of the film sheet 41, the IC card 10 is transferred from the synthetic resin plate 45 and the film sheet 41 while remaining integrated with the film sheet 41.
By punching out a plate-shaped body having a size of , it is possible to manufacture an IC card 10 having a film sheet 41 as an oversheet on the back side and incorporating an IC module 21, as shown in FIG.

In addition, when punching, please use IC module 2! Place the synthetic resin plate 4 so that the position is the predetermined position of the IC card 10.
5. Determine the punching location in step 5, and punch out so as not to include any remaining gate marks on the injection molded product.

An IC card l is made from the synthetic resin plate 45 injection-molded in this way.
The method of punching out the O allows the protruding portion of the injection mold gate remaining on the synthetic resin plate 45 to be removed by the punching operation, so the upper and lower surfaces are flat and the periphery is also smooth. IC cards 10 having the above structure can be easily mass-produced.

In addition, when removing the synthetic resin plate 45 from the film sheet 41, by printing on the top surface of the film sheet 41 in advance, the required printing can be transferred to the back surface of the IC card 1o. IC card 1G from resin plate 45
When punching out the IC card 10, by printing on the top or back side of the film sheet 41 in advance, it is possible to easily mass-produce the IC card 10 with the required printing on the back side.

Further, in the above embodiment, the IC modules 2! are arranged at equal intervals on the long film sheet 41! Although the IC module 21 is transferred into the mold by adhering and fixing the long film sheet 41, the film sheet 41 to be used is not limited to the long film sheet 41. One IC module 21 is adhesively fixed to each film sheet having an appropriate length and width, and each film sheet is placed in a fixed mold 3.
5 and the movable mold 31, the IC module 21 is fixed in the mold and clamped, and the synthetic resin plate 45 integrated with the IC module 21 is injection molded onto the film sheet. It can also be molded.

[Effects of the Invention] The present invention securely fixes the IC module in the mold by sandwiching the film sheet to which the IC module is adhered between a fixed mold and a movable mold. There is no risk of the IC module moving even when injected with
Therefore, it is possible to mold a flat synthetic resin plate integrated with the IC module around the IC module using injection molding in which the synthetic resin flows into the mold at high speed.

Then, the IC module is fixed in a predetermined position within the mold,
Since a synthetic resin plate integral with the IC module is molded by injection molding, the synthetic resin plate is peeled off from the film sheet to make the upper and lower surfaces smooth, and the IC module is buried in a predetermined position.

Moreover, IC cards with electrodes exposed on the bottom surface can be easily mass-produced.

In addition, an IC module is glued to the hole position of a film sheet having a through hole, a synthetic resin plate is formed on the upper surface of the film sheet by injection molding, and an IC card is formed while the synthetic resin plate is integrated with the film sheet. The method of punching out the shape from a synthetic resin plate allows punching to leave the gate part that remains in the injection molded product, so the top and bottom surfaces are smooth and the shape is a flat plate with no irregularities on the periphery. Moreover, IC cards with built-in IC modules in predetermined positions can be easily mass-produced.

[Brief explanation of drawings]

Figure 1 shows the IC module adhered to the film sheet, Figure 2 shows the relationship between the film sheet and the mold, and Figure 3 shows the IC module fixed in the mold. FIG. 4 is a diagram showing a state in which a synthetic resin plate is molded on a film sheet, FIG. 5 is a perspective view showing the back side of an IC card, and FIGS. 6A and B are other embodiments. FIG. 7 is a cross-sectional side view of an IC card according to another embodiment, and FIG.
FIG. 9 is a diagram showing a conventional IC card board, and FIG. 10 is a diagram showing an example of a conventional IC card. 18=oversheet, 21=IC module, 23=IC chip, 25=insulating substrate, 2
8=: electrode, 31=movable mold, 33=empty cavity, 35=
Fixed mold, 41=film sheet, 43=: through hole,
45=Synthetic resin board.

Claims (2)

[Claims] (1) An IC module is adhesively fixed on the upper surface of a film sheet, the IC module is positioned at a predetermined position in a mold, and the film sheet is fixed so as to be sandwiched between a fixed mold and a movable mold. After that, the IC module glued onto the film sheet is fixed at a predetermined position in the cavity of the mold, and then synthetic resin is injected into the mold and applied onto the top surface of the film sheet. A method for manufacturing an IC card, which comprises molding a flat synthetic resin plate that covers an IC module, and then peeling the synthetic resin plate together with the IC module from a film sheet. (2) A through hole is formed in the film sheet, and the through hole is
The IC module is adhesively fixed at the position of the through hole by gluing the periphery of the through hole to the periphery of the insulating substrate of the IC module so that the size is slightly smaller than the insulating substrate of the module, and the film sheet is placed on the fixing mold. By sending I
The film sheet is clamped and fixed between the fixed mold and the movable mold by positioning the C module at a predetermined position in the cavity of the movable mold and clamping the movable mold so as to press it against the film sheet. A synthetic resin is injected into the cavity of the movable mold to form a flat synthetic resin plate covering the IC module on the upper surface of the film sheet, and an IC card is formed from the synthetic resin plate and the film sheet integrated with the synthetic resin plate. A method for manufacturing an IC card, which is characterized by punching.