JPH0225879U - - Google Patents
Info
- Publication number
- JPH0225879U JPH0225879U JP10479688U JP10479688U JPH0225879U JP H0225879 U JPH0225879 U JP H0225879U JP 10479688 U JP10479688 U JP 10479688U JP 10479688 U JP10479688 U JP 10479688U JP H0225879 U JPH0225879 U JP H0225879U
- Authority
- JP
- Japan
- Prior art keywords
- plate
- knuckle
- prober
- guide
- mounting plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007689 inspection Methods 0.000 claims description 4
- 239000000523 sample Substances 0.000 claims description 2
- 239000000919 ceramic Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
- Testing Electric Properties And Detecting Electric Faults (AREA)
- Tests Of Electronic Circuits (AREA)
Description
第1図aおよびbは、この考案による配線基板
検査用プローバの押圧機構の実施例における構造
図で図aは水平および垂直断面図、図bは第1図
に対する部分斜視図、第2図a,bおよびcは、
PGA基板の構造とその検査用プローバの配置お
よび構造図、第3図は、従来のプローバ押圧機構
の構造の垂直断面図である。
1……ピングリツドアレイ(PGA)配線基板
、1a……セラミツクスベース、1b……ピンア
レイ、1c……IC搭載部、2……プローバ、2
a……プローブピン、2b……スプリング、3…
…試験装置、3a……ケーブル、4……ベース盤
、4a……支持板、5……ガイドレール、6……
基板装着具、7……移動板、8……シリンダ部、
8a……エアシリンダ、8b……ロツド、8c…
…取り付け板、8d……ナツクル板、9……作業
空間、10……シリンダガイド、10a,11a
……嵌合溝、11……ナツクルガイド。
Figures 1a and 1b are structural diagrams of an embodiment of the pressing mechanism of the prober for wiring board inspection according to this invention. Figure a is a horizontal and vertical sectional view, Figure b is a partial perspective view of Figure 1, and Figure 2a is a , b and c are
FIG. 3 is a vertical sectional view of the structure of a conventional prober pressing mechanism. 1... Pin grid array (PGA) wiring board, 1a... Ceramics base, 1b... Pin array, 1c... IC mounting section, 2... Prober, 2
a...Probe pin, 2b...Spring, 3...
...Test device, 3a... Cable, 4... Base board, 4a... Support plate, 5... Guide rail, 6...
Board mounting tool, 7... Moving plate, 8... Cylinder part,
8a...Air cylinder, 8b...Rod, 8c...
...Mounting plate, 8d...Knuckle plate, 9...Work space, 10...Cylinder guide, 10a, 11a
...Fitting groove, 11...Natsukuru guide.
Claims (1)
ドレールを固定し、該ガイドレールに沿つて移動
する移動板にプローバを固定し、エアシリンダに
押圧された該移動板により、該プローバのプロー
ブピンを配線基板の配線に押接して該配線を検査
する検査装置において、上記エアシリンダと該シ
リンダのロツドの有効長を上記押圧に必要な最小
限とし、上記エアシリンダの底部に取り付け板と
上記ロツドの先端にナツクル板をそれぞれ設け、
上記支持板と上記移動板に、該取り付け板と該ナ
ツクル板を着脱自由に嵌入できるシリンダガイド
およびナツクルガイドをそれぞれ設けたことを特
徴とする、配線基板検査プローバの押圧機構。 (2) 上記取り付け板およびナツクル板の形状は
、それぞれ適当な厚さを有する方形とし、上記シ
リンダガイドおよびナツクルガイドは、該取り付
け板およびナツクル板が嵌合するコの字の形状の
嵌合溝を有し、上方より該取り付け板とナツクル
板を該嵌合溝に嵌入する、請求項1記載の配線基
板検査プローバの押圧機構。[Claims for Utility Model Registration] (1) A guide rail is fixed to support plates erected at both ends of a base board, a prober is fixed to a movable plate that moves along the guide rail, and the prober is pressed by an air cylinder. In an inspection device for inspecting wiring by pressing probe pins of the prober against wiring of a wiring board using the movable plate, the effective length of the air cylinder and the rod of the cylinder is set to the minimum necessary for the pressing, and the A mounting plate is provided at the bottom of the air cylinder and a knuckle plate is provided at the tip of the above rod.
A pressing mechanism for a wiring board inspection prober, characterized in that the supporting plate and the movable plate are each provided with a cylinder guide and a knuckle guide into which the mounting plate and the knuckle plate can be freely inserted and removed. (2) The shape of the mounting plate and the knuckle plate are rectangular with appropriate thickness, and the cylinder guide and the knuckle guide have a U-shaped fitting groove into which the mounting plate and the knuckle plate fit. 2. The pressing mechanism for a wiring board inspection prober according to claim 1, further comprising: a pressing mechanism for fitting the mounting plate and the knuckle plate into the fitting groove from above.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10479688U JPH0225879U (en) | 1988-08-08 | 1988-08-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10479688U JPH0225879U (en) | 1988-08-08 | 1988-08-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0225879U true JPH0225879U (en) | 1990-02-20 |
Family
ID=31336833
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10479688U Pending JPH0225879U (en) | 1988-08-08 | 1988-08-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0225879U (en) |
-
1988
- 1988-08-08 JP JP10479688U patent/JPH0225879U/ja active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH0463084U (en) | ||
| JPS6438573U (en) | ||
| JPH083516B2 (en) | Test head for semiconductor device and test method | |
| CN222144732U (en) | Concrete quality detection device for building engineering | |
| CN216816735U (en) | Positioning tool for PCB electrical property test | |
| JPH0327367U (en) | ||
| JPS63187073U (en) | ||
| JPS6259846U (en) | ||
| JPH0138531Y2 (en) | ||
| JPH0283477U (en) | ||
| JPH01131179U (en) | ||
| JPS6176367U (en) | ||
| JPS63185572U (en) | ||
| JPH0372304U (en) | ||
| JPS61205005U (en) | ||
| JPH0421842U (en) | ||
| JPH0645905Y2 (en) | Circuit board inspection device having XY unit | |
| JPS63129873U (en) | ||
| JPH0161676U (en) | ||
| JPH0478579U (en) | ||
| JPS61117832U (en) | ||
| JPS63167273U (en) | ||
| JPS6440069U (en) | ||
| JPS63155078U (en) | ||
| JPH01144870U (en) |