JPH0226816U - - Google Patents

Info

Publication number
JPH0226816U
JPH0226816U JP10555088U JP10555088U JPH0226816U JP H0226816 U JPH0226816 U JP H0226816U JP 10555088 U JP10555088 U JP 10555088U JP 10555088 U JP10555088 U JP 10555088U JP H0226816 U JPH0226816 U JP H0226816U
Authority
JP
Japan
Prior art keywords
resin molded
circuit
components
electronic
lead frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10555088U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP10555088U priority Critical patent/JPH0226816U/ja
Publication of JPH0226816U publication Critical patent/JPH0226816U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図ａ及びｂは夫々本考案を適用した発振回
路の一実施例を示す平面図及びＡ―Ａ断面図、第
２図は従来の無基板樹脂モールド電子回路の一例
を示す平面図である。 １……リードフレーム、４……圧電デバイス、
６……接地線。 1A and 1B are a plan view and an AA sectional view showing an embodiment of an oscillation circuit to which the present invention is applied, respectively, and FIG. 2 is a plan view showing an example of a conventional substrate-less resin molded electronic circuit. . 1...Lead frame, 4...Piezoelectric device,
6...Grounding wire.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] リードフレームに形成した回路パターン上に電
子部品を接続した後樹脂モールドしてチツプ化す
る無基板樹脂モールド電子回路に於いて、周辺回
路部品と共に実装すべき圧電デバイスを内蔵した
パツケージの一部を前記回路パターン接地線の延
長部にて固定したことを特徴とする無基板樹脂モ
ールド電子回路の実装構造。 In substrateless resin molded electronic circuits, in which electronic components are connected to circuit patterns formed on a lead frame and then resin molded to form chips, a part of the package containing a piezoelectric device to be mounted together with peripheral circuit components is described above. A mounting structure for a non-substrate resin molded electronic circuit, characterized in that it is fixed by an extension of a circuit pattern grounding wire.
JP10555088U 1988-08-10 1988-08-10 Pending JPH0226816U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10555088U JPH0226816U (en) 1988-08-10 1988-08-10

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10555088U JPH0226816U (en) 1988-08-10 1988-08-10

Publications (1)

Publication Number Publication Date
JPH0226816U true JPH0226816U (en) 1990-02-21

Family

ID=31338265

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10555088U Pending JPH0226816U (en) 1988-08-10 1988-08-10

Country Status (1)

Country Link
JP (1) JPH0226816U (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62139347A (en) * 1985-12-13 1987-06-23 Matsushima Kogyo Co Ltd Metal lead frame for packaging resin-sealed type semiconductor

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62139347A (en) * 1985-12-13 1987-06-23 Matsushima Kogyo Co Ltd Metal lead frame for packaging resin-sealed type semiconductor

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