JPH02268986A - Manufacture of top-lay clad material - Google Patents
Manufacture of top-lay clad materialInfo
- Publication number
- JPH02268986A JPH02268986A JP8773789A JP8773789A JPH02268986A JP H02268986 A JPH02268986 A JP H02268986A JP 8773789 A JP8773789 A JP 8773789A JP 8773789 A JP8773789 A JP 8773789A JP H02268986 A JPH02268986 A JP H02268986A
- Authority
- JP
- Japan
- Prior art keywords
- adherend
- lead frame
- inlay
- roll
- dummy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000463 material Substances 0.000 title claims abstract description 196
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 24
- 238000005096 rolling process Methods 0.000 claims abstract description 23
- 239000002184 metal Substances 0.000 claims abstract description 7
- 229910052751 metal Inorganic materials 0.000 claims abstract description 7
- 239000000758 substrate Substances 0.000 claims description 28
- 238000005253 cladding Methods 0.000 claims description 13
- 238000000034 method Methods 0.000 claims description 10
- 229910045601 alloy Inorganic materials 0.000 claims description 3
- 239000000956 alloy Substances 0.000 claims description 3
- 238000005219 brazing Methods 0.000 abstract description 19
- 238000003825 pressing Methods 0.000 abstract description 6
- 239000000945 filler Substances 0.000 abstract description 5
- 238000003466 welding Methods 0.000 abstract description 5
- 229910000679 solder Inorganic materials 0.000 description 44
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 229910052739 hydrogen Inorganic materials 0.000 description 4
- 229910000640 Fe alloy Inorganic materials 0.000 description 3
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- 238000000137 annealing Methods 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 239000010687 lubricating oil Substances 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 229910017944 Ag—Cu Inorganic materials 0.000 description 1
- 101100440985 Danio rerio crad gene Proteins 0.000 description 1
- 101100440987 Mus musculus Cracd gene Proteins 0.000 description 1
- 101100467905 Mus musculus Rdh16 gene Proteins 0.000 description 1
- 206010067482 No adverse event Diseases 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Landscapes
- Pressure Welding/Diffusion-Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
利用産業分野
この発明は、リードフレーム等の基板材の所要位置にＡ
ｇろう等の被着材を凸状に圧接したトップレイクラッド
材の製造方法に係り、従来容易に製造できるインレイク
ラツド材を素材として、凹部溝付ダミー材を介して一対
の平ロールで圧延するか、凹部溝付ロールを用いて圧延
することにより、簡単に精度よく、被着材の焼き付、剥
がれや膨れ等の表面性状不良を発生させることなく、被
着材の圧接位置決め及び凸部形状性を良好にし安定して
量産できるトップレイクラッド材の製造方法に関する。[Detailed Description of the Invention] Field of Application This invention applies to
The method of manufacturing top lay cladding material, in which adherend materials such as g-braze are pressed into a convex shape, involves rolling inlay cladding material, which can be easily produced in the past, with a pair of flat rolls through a dummy material with grooves. Alternatively, by rolling using a roll with grooves and grooves, it is possible to easily and precisely position the adherend and press the protrusions without causing surface defects such as burning, peeling, or blistering of the adherend. The present invention relates to a method for manufacturing top lay clad material that has good shape properties and can be stably mass-produced.
背景技術
半導体パッケージの端子として用いられるリードフレー
ム材は、パッケージにろう付けするため、Ａｇろうを予
め着設したものが使用される。BACKGROUND ART Lead frame materials used as terminals of semiconductor packages are used to have Ag solder attached in advance in order to be brazed to the package.
従来、微小なリードフレームをプレス加工により製造す
るための素材として、第４図ａ図に示す如き、リードフ
レーム材（１）とＡｇろう（２）とのインレイクラツド
材が使用されていた。Conventionally, as a material for manufacturing minute lead frames by press working, an inlay clad material of lead frame material (1) and Ag solder (2) as shown in FIG. 4a has been used.
すなわち、圧延により帯状のリードフレーム材（１）の
中央溝部に、同一平坦面となるようＡｇろう（２）を埋
設した形状を有し、これから所要形状に打抜加工するこ
とにより、頭部にＡｇろう（２）を着設した所要のリー
ドフレームが得られる（第４図す図参照）。That is, it has a shape in which the Ag solder (2) is embedded in the central groove of a strip-shaped lead frame material (1) by rolling so that it has the same flat surface, and by punching it into the desired shape, the head part is formed. A required lead frame with Ag solder (2) attached thereto is obtained (see FIG. 4).
ところで、リードフレーム材の厚みは、現在０．２５ｍ
ｍが主流であるが、０．１〜０．１５ｍｍへとより薄板
化しつつある。By the way, the thickness of the lead frame material is currently 0.25m.
m is the mainstream, but it is becoming thinner to 0.1 to 0.15 mm.
従って薄板化すると、前記のインレイクラツド材から得
られたリードフレームは、第４図Ｃ図に示す如く、ろう
付は後に、ろう材を着設していた部分に凹みができるこ
ととなり、特に折曲げ強度の点で不利となる。Therefore, when thinning the lead frame obtained from the above-mentioned inlay clad material, as shown in FIG. This is disadvantageous in terms of bending strength.
例えば、第３図に示す如きクワッドタイプ等のフラット
パッケージ（３）用のリードフレーム（４）は、ろう付
は後に折曲げられるため、所要の折曲げ強度を確保する
必要があり、かかる用途に薄板化した従来のインレイク
ラツド材を用いることはできない。For example, the lead frame (4) for a flat package (3) such as a quad type as shown in Fig. 3 is bent after brazing, so it is necessary to ensure the required bending strength. Conventional thinned inlay clad materials cannot be used.
そこで、第５図ａ、ｂ図に示す如きリードフレーム材（
１）上にＡｇろう（２）を載せたトップレイクラッド材
を、ｂ図に示すリードフレームに加工して用いると、同
Ｃ図に示す如く、フラットパッケージにろう付は後の折
曲げ時の強度に問題を生じないと考えられる。Therefore, the lead frame material (as shown in Figures 5a and 5b) (
1) When the top lay clad material with the Ag solder (2) placed on it is processed into the lead frame shown in Figure B, the brazing to the flat package will occur when the flat package is bent later, as shown in Figure C. It is thought that there will be no problem with strength.
しかし、第５図ａの如きリードフレーム用トップレイク
ラッド材を、工業的に容易にかつ安定して供給すること
ができないため、薄肉化した基板の各リード毎にＡｇろ
うを仮止めして、パッケージにろう付けを実施していた
。However, since it is not possible to industrially easily and stably supply the top layer clad material for lead frames as shown in Figure 5a, Ag solder is temporarily attached to each lead of the thinned board. The package was brazed.
従来技術の問題点
かかるトップレイクランド材を得る方法として、Ａｇろ
うの圧接予定側に凹部溝を有するロールを用い、圧接予
定位置とは反対側に平ロールを用い、リードフレーム基
板上にＡｇろうをクラッドできると考えられるが、ロー
ル溝部よりロール潤滑油が圧接界面に回りこみ、Ａｇろ
うの剥離や膨れが生じるため、品質に問題が生じる。Problems with the Prior Art As a method of obtaining such a top Lakeland material, a roll having a concave groove on the side where the Ag solder is to be pressed is used, a flat roll is used on the opposite side from the planned pressing position, and the Ag solder is placed on the lead frame substrate. However, roll lubricating oil flows from the roll groove to the press contact interface, causing peeling and blistering of the Ag solder, resulting in quality problems.
また、Ａｇろう側のロール溝部で局部的に過大な押圧力
を生じ、焼き付や表面性状不良あるいはろう材の圧接位
置決めが悪くなる問題があった。In addition, excessive pressing force is generated locally in the roll groove on the Ag solder side, resulting in problems such as seizure, poor surface quality, and poor positioning of the solder material.
そこで、母材金属の全面に平ロールで被覆材を圧接した
後、被覆材に選択的にマスキングを施し、非マスク部の
被覆材を除去して、所要部に被覆材を設けたトップレイ
クラッド材の製造方法が提案（特開昭６１−７３８８９
号公報）されている。Therefore, after applying the coating material to the entire surface of the base metal using a flat roll, we selectively mask the coating material, remove the coating material from the non-masked areas, and apply the coating material to the required areas. A method for manufacturing the material was proposed (Japanese Unexamined Patent Publication No. 61-73889
(No. Publication).
上記技術をリードフレームの製造に適用することは、マ
スキング、エツチング処理が煩雑で作業性が悪く、かつ
Ａｇろうをエツチングすることになり、歩留が悪く、工
業的に不経済である。Applying the above technology to the production of lead frames is industrially uneconomical because the masking and etching processes are complicated and workability is poor, and Ag solder is etched, resulting in poor yields.
また、リードフレーム基板の所要面上にめっき処理する
ことも考えられるが、十分なろう°付は強度を確保する
にはＡｇろうは２０〜１１００ｐ厚みに被着する必要が
あるため、かかる厚みに積層することは工業的に不経済
である。It is also possible to perform plating on the required surfaces of the lead frame substrate, but in order to ensure sufficient brazing strength, Ag solder must be deposited to a thickness of 20 to 1100p, so Lamination is industrially uneconomical.
この発明は、かかる現状に鑑み、特に薄肉化したリード
フレーム材に最適のトップレイクラッド材をはじめ、基
板材の所定位置に少なくとも１条の被着材が突条に圧接
されたトップレイクラッド材を、工業的に簡単な工程で
かつ安定して供給できる製造方法の提供を目的としてい
る。In view of the current situation, the present invention provides a top lay clad material which is particularly suitable for thinned lead frame materials, and a top lay clad material in which at least one strip of adherend material is pressure-welded to a protrusion at a predetermined position of a substrate material. The objective is to provide a manufacturing method that can stably supply the following in an industrially simple process.
発明の概要
この発明は、従来容易に製造できるインレイクラツド材
を素材として、凹部溝付ダミー材を介して一対の平ロー
ルで圧延するが、凹部溝付ロールを用いて圧延すること
により、簡単に精度よく、薄肉化したリードフレーム材
に最適のトップレイクランド材を製造するものである。SUMMARY OF THE INVENTION This invention uses an inlay clad material, which can be easily manufactured, as a raw material and rolls it with a pair of flat rolls through a dummy material with grooves. The company manufactures Top Lakeland material, which is ideal for thinned lead frame materials, with high accuracy.
すなわち、この発明は、
金属または合金基板材上の所定位置に少なくとも１条の
所要幅の被着材を一対のロールで圧接するに際し、
基板材の上面に被着材を埋火圧接したインレイクラツド
材と、被着材が埋火可能な凹部溝を有し両面が平坦面で
ある帯状のダミー材を用いて、一対の平ロールで該凹部
溝に被着材を埋火させてダミー材と基板材を圧延し、基
板材に被着材を圧接した後、基板材に被着したダミー材
を剥がし、基板材の所定位置に圧接した被着材突条を得
ることを特徴とするトップレイクランド材の製造方法で
ある。That is, the present invention provides an inlay crack in which the adherend material is embedded and pressure welded to the upper surface of the substrate material when at least one strip of the adherend material of a required width is pressure-welded to a predetermined position on a metal or alloy substrate material using a pair of rolls. Using Tsudo material and a belt-shaped dummy material with a concave groove in which the adherend material can be buried and flat surfaces on both sides, the adherend material is buried in the concave groove with a pair of flat rolls to make the dummy material. The top is characterized in that the substrate material is rolled, the adherend material is pressed against the substrate material, and then the dummy material adhered to the substrate material is peeled off to obtain adherend material protrusions that are pressed into predetermined positions on the substrate material. This is a method of manufacturing Lakeland lumber.
また、さらに、
基板材の上面に被着材を埋入圧接したインレイクラツド
材を素材とし、インレイクラツド材の被着材の圧接側に
凹部溝を有するロールを当接させ、前記被着材の圧接面
とは反対側に平ロールを当接させ、凹部溝を有するロー
ルの溝位置を被着材位置に合せて該素材を圧延し、基板
材の所定位置に圧接した被着材突条を得ることを特徴と
するトップレイクラッド材の製造方法である。Furthermore, an inlay clad material is used as a material in which an adherend is embedded and pressure bonded to the upper surface of the substrate material, and a roll having a concave groove is brought into contact with the pressure welding side of the adherend of the inlay clad material. A flat roll is brought into contact with the side opposite to the pressure contact surface of the material, and the groove position of the roll having the recessed groove is aligned with the position of the adherend, and the material is rolled. This is a method for producing top layer cladding material, which is characterized by obtaining strips.
この発明を、特にリードフレーム基板にＡｇろうを圧接
したトップレイクラッド材の場合について説明すると、
リードフレーム帯材の上面にＡｇろう帯材を埋入圧接し
たインレイクラツド材と、Ａｇろう帯材が埋火可能な凹
部溝を有し両面が平坦面である帯状のダミー利を用いて
、一対の平ロールで該凹部溝にＡｇろうを埋火させてダ
ミー材とリードフレーム帯材を圧延して、リードフレー
ム帯材にＡｇろうを圧接した後、リードフレーム材に被
着したダミー材を剥がし、リードフレーム基板面の所定
位置に圧接したＡｇろう突条を有するトップレイクラッ
ド材を得ることができ、
さらに、
リードフレーム帯材の上面にＡｇろう帯材を埋入圧接し
たインレイクランド材を素材とし、インレイクラツド材
のＡｇろうの圧接側に凹部溝を有するロールを当接させ
、前記Ａｇろうの圧接面とは反対側に平ロールを当接さ
せ、凹部溝を有するロールの溝位置をＡｇろう位置に合
せて該素材を圧延し、リードフレーム基板面の所定位置
に圧接したＡｇろう突条を有するトップレイクラッド材
を得ることができる。This invention will be explained in particular in the case of a top lay clad material in which Ag solder is pressure bonded to a lead frame substrate.Inlay clad material in which an Ag solder strip is embedded and pressure bonded to the top surface of a lead frame strip, and an Ag braze strip material. Using a strip-shaped dummy material having a recessed groove that can be filled with fire and having flat surfaces on both sides, a pair of flat rolls is used to fill the recessed groove with Ag solder and roll the dummy material and lead frame strip material. After pressing the Ag solder onto the lead frame strip material, the dummy material adhered to the lead frame material is peeled off to obtain the top lay clad material having the Ag solder protrusion pressed onto a predetermined position on the lead frame substrate surface. Furthermore, the material is made of inlay land material in which an Ag solder strip is embedded and press-bonded to the upper surface of the lead frame strip material, and a roll having a concave groove is brought into contact with the pressure welding side of the Ag solder of the inlay crad material, and the above-mentioned A flat roll is brought into contact with the side opposite to the pressing surface of the Ag solder, and the groove position of the roll having the concave groove is aligned with the Ag solder position, and the material is rolled, and the Ag solder is pressed at a predetermined position on the lead frame substrate surface. A top lay cladding material having ridges can be obtained.
この発明において、トップレイクラッド材は、従来の基
板材表面が平坦で被着材料が埋火したインレイタイプと
は異なり、母材に被着材料がストライプ状にクラッドさ
れ、被着材料の一部又は全部が母材面上に露出したもの
をいい、さらに、第１図ｅ図に示す如く、基板材に中央
突条部を有する溝部を設け、中央突条部の上面に被着材
の突条を圧接したものもトップレイクラッド材という。In this invention, the top lay clad material differs from the conventional inlay type in which the surface of the substrate material is flat and the adherend material is buried, but the base material is clad with the adherend material in stripes, and a part of the adherend material Furthermore, as shown in Figure 1e, a groove portion having a central protrusion is provided in the substrate material, and a protrusion of the adherend material is placed on the upper surface of the central protrusion. The material in which the strips are pressed together is also called top lay clad material.
この発明において、クラッド母材となる基板材には、リ
ードフレーム材として使用されている４２Ｎｉ−Ｆｅ系
など公知のいずれの材料も適用でき、突条に圧接する被
着材はＡｇ、 Ａｇ−Ｃｕ等のＡｇろうをはじめとする
公知のろう材、あるいはＡｕ、 Ａｇ−Ｃｄなどの公知
の接点材料等を利用できる。さらに、用途に応じては、
多条の突条を圧接した基板材が要求されるが、所要数の
凹部溝を有するダミー材、溝ロールを用いて、実施例の
突条が１条の場合と同様に製造できる。In this invention, any known material such as 42Ni-Fe system used as lead frame material can be applied to the substrate material serving as the cladding base material, and the adherend material to be pressed into contact with the protrusions can be Ag, Ag-Cu. Known brazing fillers such as Ag brazing materials, such as Ag brazing materials, and known contact materials such as Au and Ag-Cd can be used. Furthermore, depending on the application,
Although a substrate material having multiple protrusions pressed against each other is required, it can be manufactured in the same manner as in the case of one protrusion in the embodiment using a dummy material having a required number of concave grooves and a grooved roll.
発明の図面に基づく開示
第１図ａ、ｃ、ｄ図はこの発明によるトップレイクラッ
ドの製造工程を示すロールと素材の説明図であり、同す
、ｅは得られたトップレイクランド材の断面である。Disclosure of the invention based on drawings Figures 1a, c, and d are explanatory diagrams of rolls and materials showing the manufacturing process of the top lay clad according to the present invention, and figures 1 and 1 e are cross-sectional views of the top lay clad material obtained. It is.
第２図ａ図はこの発明におけるインレイクラツド材と溝
ロールとの関係を示す縦断説明図であり、ｂ−ｄ図はこ
の発明による製品のＡｇろう突条の形状を示ずトップレ
イクラッド材の縦断説明図である。Fig. 2a is a vertical cross-sectional view showing the relationship between the inlay clad material and the groove roll in this invention, and Figs. FIG.
ここでは、トップレイクランド材として、リードフレー
ム基板面の中央位置に１条のＡｇろうを凸状に圧接した
トップレイクラッド材及びその製造方法について説明す
る。Here, as a top layer clad material, a top layer clad material in which a single strip of Ag solder is pressed into a convex shape at the center of the lead frame substrate surface, and a method for manufacturing the same will be described.
この発明によるトップレイクラッド材の製造方法は、従
来の製造方法で得られた所要寸法がらなるインレイクラ
ツド材（１０）を素材として用ν）一対の平ロール（２
０Ｘ２１）にて圧延する工程からなる。The method for manufacturing a top lay clad material according to the present invention uses as a raw material an inlay clad material (10) having the required dimensions obtained by a conventional manufacturing method.v) A pair of flat rolls (2)
It consists of a step of rolling at 0x21).
インレイクラツド材（１０）は、リードフレーム帯材（
１１）上面中央にＡｇろう帯材（１２）を圧接して埋入
し、平坦面となっている。The inlay clad material (10) is a lead frame strip material (
11) An Ag solder strip (12) is pressed and embedded in the center of the top surface, making it a flat surface.
ダミー材（３０）は、リードフレーム帯材（１０）と同
様形状を有しかつ同等以上の大きさを有する同材質ある
いはより高硬度の材質からなる帯材であり、一方面、図
面で下面の中央部に凹部溝（３１）を設けである。The dummy material (30) is a strip material having the same shape as the lead frame strip material (10), and having the same or larger size and made of the same material or a material with higher hardness. A recessed groove (31) is provided in the center.
第１図ａ図に示す如く、一対の平ロール（２０）（２１
）間に、インレイクラツド材（１０）のＡｇろう帯材（
１２）とダミー材（３０）の凹部溝（３１）とを対向さ
せて、所要の速度、圧下率で圧延を施す。As shown in Figure 1a, a pair of flat rolls (20) (21
) between the inlay clad material (10) and the Ag solder strip (
12) and the concave groove (31) of the dummy material (30) are made to face each other, and rolling is performed at a required speed and reduction ratio.
なお、前記Ａｇろう帯材（１２）と凹部溝（３１）との
位置合せはサイドロールを用いるなどの手段で容易に実
施できる。Note that the alignment of the Ag solder strip (12) and the recessed groove (31) can be easily carried out by means such as using side rolls.
一対の平ロール（２０Ｘ２１）の圧下とともに、凹部溝
（３１）にＡｇろう帯材（１２）が嵌まり変形する。As the pair of flat rolls (20×21) are rolled down, the Ag solder strip (12) fits into the recessed groove (31) and is deformed.
例えば、一対の平ロール（２０Ｘ２１）を多段に設けて
、所要の圧延を行うことにより、ダミー材（３０）とリ
ードフレーム帯材（１０）が圧着して順次薄肉化してゆ
く。For example, by providing a pair of flat rolls (20×21) in multiple stages and performing the required rolling, the dummy material (30) and the lead frame strip material (10) are pressed together and gradually thinned.
リードフレーム帯材（１０）が所要厚みになったところ
で圧延を完了する。Rolling is completed when the lead frame strip (10) reaches the required thickness.
その後、ダミー材（３０）を剥がすことにより、ｂ図に
示す如く、リードフレーム帯材（１１）の所定位置にＡ
ｇろう突条（１３）を圧接したトップレイクラ・ノド材
（１４）を得る。Thereafter, by peeling off the dummy material (30), the A
g. Obtain the top leikura-nod material (14) to which the brazing ridges (13) are pressed.
前記圧延工程において、ロール段数、速度、圧下率など
の条件は、用いるインレイクランド材種類、寸法、厚み
により適宜選定され、ダミー材（３０）の凹部溝（３１
）寸法も同様に適宜選定できる。In the rolling process, conditions such as the number of rolls, speed, and rolling reduction are appropriately selected depending on the type, size, and thickness of the inlay land material used, and the conditions such as the number of roll stages, speed, and rolling reduction are appropriately selected depending on the type, size, and thickness of the inlay land material used.
) dimensions can be similarly selected as appropriate.
従って、インレイクラツド材の寸法及び圧接されたＡｇ
ろう材厚み、あるいはさらに圧延時の凹部溝の深さを上
記の所望の条件となるように適宜選定するとよい。Therefore, the dimensions of the inlay clad material and the pressed Ag
The thickness of the brazing material or the depth of the recessed grooves during rolling may be appropriately selected to meet the above-mentioned desired conditions.
Ｃ図に示すこの発明の製造方法は、リードフレーム帯材
（１１）の上面にＡｇろう帯材（１２）を埋入圧接した
インレイクラツド材（１０）を素材とし、Ａｇろうの圧
接側に、図で上ロールに所要寸法の凹部溝（２３）を有
する溝ロール（２２）を用い、前記Ａｇろうの圧接面と
は反対側、図で下ロールに平ロール（２１）を用い、該
溝位置を埋入したＡｇろう位置に合せて、インレイクラ
ンド材（１０）を所要速度、圧下率で圧延し、ｂ図に示
す如きリードフレーム帯材の所定位置にＡｇろう突条（
１３）を圧接したトップレイクラッド材（１４）を得る
。The manufacturing method of the present invention shown in Fig. C uses an inlay clad material (10) in which an Ag brazing strip (12) is embedded and press-bonded to the top surface of a lead frame strip (11), and a lead frame strip (11) is embedded and press-bonded with an inlay clad material (10). In the figure, a grooved roll (22) having a recessed groove (23) of the required size is used on the upper roll, and a flat roll (21) is used as the lower roll on the side opposite to the pressing surface of the Ag solder, and the groove is The inlaid land material (10) is rolled at the required speed and reduction ratio to match the position of the embedded Ag solder, and the Ag solder protrusion (
13) is pressed to obtain a top lay clad material (14).
前記圧延工程において、ロール段数、速度、圧下率など
の条件は、同様に用いるインレイクラツド材種類、寸法
、厚みにより適宜選定され、溝ロール（２２）の凹部溝
（２３）寸法も同様に適宜選定できる。In the rolling process, conditions such as the number of rolls, speed, and rolling reduction are appropriately selected depending on the type, size, and thickness of the inlay clad material used, and the dimensions of the recessed grooves (23) of the grooved roll (22) are similarly selected appropriately. You can choose.
ｄ図に示すこの発明の製造方法は、Ｃ図と同様であるが
、図で上ロールに所要寸法の凸部（２５Ｘ２５）間に凹
部溝（２６Ｘ２７）を有する溝ロール（２４）を用い、
また、下ロールに平ロール（２１）を用い、凹部溝（２
６）の中央に設けた凹部溝（２７）位置と埋入したＡｇ
ろう位置を合せて圧延する。The manufacturing method of the present invention shown in Fig. d is the same as Fig. C, but in the figure, a grooved roll (24) having a concave groove (26 x 27) between protrusions (25 x 25) of the required dimensions on the upper roll is used,
In addition, a flat roll (21) is used as the lower roll, and a concave groove (2
6) The recess groove (27) provided in the center and the embedded Ag
Align the solder position and roll.
これにより、ｅ図に示す如く、リードフレーム帯材（１
０）の中央に溝部（１６）を有し、該溝部（１６）に中
央突条部（１７）を有し、中央突条部（１７）の上面に
Ａｇろう突条（１８）を圧接したトップレイクラ・ノド
材（１５）を得ることができる。また、溝ロール（２４
）と同様の凹凸部を有するダミー材を用いても製造する
ことができる。As a result, as shown in figure e, the lead frame strip material (1
0) had a groove (16) in the center, the groove (16) had a central protrusion (17), and the Ag brazing protrusion (18) was pressed against the upper surface of the central protrusion (17). Top Lake Cranod wood (15) can be obtained. In addition, groove rolls (24
) can also be manufactured using a dummy material having uneven parts similar to those shown in FIG.
従って、Ａｇろう帯材（１２）厚み、各凹凸部の高さや
深さ、幅、さらに圧延条件を上記の所望のトップレイク
ラッド材の条件となるように適宜選定する必要がある。Therefore, it is necessary to appropriately select the thickness of the Ag solder strip (12), the height, depth, and width of each uneven portion, as well as the rolling conditions so as to meet the above-mentioned conditions for the desired top lay cladding material.
以上、第１図にはこの発明による製造方法の工程の概念
を示したが、圧接強度の向上、歪取りのために、さらに
製品のトップレイクラッド材（１４）（１５）に熱処理
を施すのもよい。As mentioned above, the concept of the process of the manufacturing method according to the present invention is shown in FIG. Good too.
熱処理としては、５００℃から用いたろう材の融点以下
の温度域、さらに６５０〜７００℃が好ましく、０．５
〜５分間、水素中雰囲気の拡散焼鈍が好ましい。The heat treatment is preferably carried out at a temperature ranging from 500°C to below the melting point of the brazing material used, preferably from 650 to 700°C, and at a temperature of 0.5°C.
Diffusion annealing in a hydrogen atmosphere for ~5 minutes is preferred.
発明の効果
上述したこの発明の製造方法によるトップレイクラッド
材（１４Ｘ１５）は、従来の如き潤滑油の悪影響が全く
なく、Ａｇろう突条（１３）の圧接強度、形状精度にす
ぐれ、また、圧接位置決めが容易で正確となる利点があ
り、簡単な工程でかつ安定して供給できる。Effects of the Invention The top lay clad material (14 x 15) manufactured by the manufacturing method of the present invention as described above has no adverse effects of lubricating oil as in the past, has excellent pressure welding strength and shape accuracy of the Ag brazing ridges (13), and has excellent pressure welding strength and shape accuracy. It has the advantage of easy and accurate positioning, and can be supplied stably through a simple process.
しかって、この発明の製造方法によるトップレイクラッ
ド材（１４）は、所要厚みのＡｇろう突条（１３）を所
要位置に圧接しであるため、第３図に示す如く、フラッ
トパッケージ（３）用のリードフレーム（４）をプレス
加工により製造するのに最適である。Therefore, since the top lay cladding material (14) produced by the manufacturing method of the present invention has the Ag brazing protrusions (13) of the required thickness pressed into the required positions, the flat package (3) is produced as shown in FIG. It is most suitable for manufacturing a lead frame (4) for use by press working.
発明の好ましい実施態様
第２図ａ図に示す如く、トップレイクラッド材を得るた
めのインレイクランド材（１０）の埋入したＡｇろう帯
材（１２）の埋入深さ（ｈ）とロールの凹部溝（２３）
深さ（Ｈ）との関係が、
ｈ＝Ｈの場合は、 同す図の如く、トップレイクラッ
ド材（１４）の表面上に着設面
を除く全面が露出しなＡｇろう
突条（１３）が得られ、
ｈ＞Ｈの場合は、 同Ｃ図の如く、トップレイクラッ
ド材（１４）の表面に一部が埋
入したＡｇろう突条（１３）が得ら
れ、
ｈ＜Ｈの場合は、 同ｄ図の如く、トップレイクラッド
材（１４）表面に突出する母
材突条の上にＡｇろう突条（１３）が
圧接されたものが得られる。Preferred Embodiment of the Invention As shown in FIG. 2a, the embedding depth (h) and roll of the Ag solder strip (12) embedded with the inlay cladding material (10) to obtain the toplay cladding material recessed groove (23)
When the relationship with the depth (H) is h=H, as shown in the same figure, the Ag solder protrusion (13 ) is obtained, and when h>H, as shown in Figure C, an Ag solder ridge (13) partially embedded in the surface of the top lay cladding material (14) is obtained, and when h<H As shown in Fig. d, the Ag solder protrusion (13) is pressed onto the base material protrusion protruding from the surface of the top lay clad material (14).
さらに、ダミー材、溝ロールの溝幅及び深さと、インレ
イクラツド材（１０）の埋入したＡｇろう帯材（１２）
の幅とを適宜選定することにより、Ａｇろう突条（１３
）の高さを所望の高さに制御できる。なお、多条の突条
を圧接した基板材を製造する場合も、同様にＡｇろう等
の被着材突条の高さを制御できる。Furthermore, the dummy material, the groove width and depth of the groove roll, and the Ag solder strip material (12) embedded with the inlay clad material (10).
By appropriately selecting the width of the Ag wax protrusion (13
) can be controlled to a desired height. Note that when manufacturing a substrate material having multiple protrusions pressed together, the height of the protrusions of the adherend material such as Ag solder can be controlled in the same way.
実施例
去１旦Ｉ
素材として、厚み０．２５ｍｍＸ幅２５鵬のコイル状の
４２Ｎｉ−Ｆｅ系合金リードフレーム材の中央部に、厚
み８０ｐｍＸ幅２．３ｍｍの８５Ａｇ−Ｃｕ材を埋入し
たインレイクラツド材を用い、ダミー材には、０．２５
ｍｍＸ幅２５ｍｍのコイル状の４２Ｎｉ−Ｆｅ系合金を
用いて圧接用の凹部溝寸法を、深さ０．１ｍｍＸ幅２．
３ｍｍとし、圧下荷重５ｔｏｎ、１０ｍ／ｍｉｎの条件
で圧延した。Example 1 I As a material, an inlay crab was used in which an 85Ag-Cu material with a thickness of 80 pm and a width of 2.3 mm was embedded in the center of a coiled 42Ni-Fe alloy lead frame material with a thickness of 0.25 mm and a width of 25 mm. Tsudo material is used, and the dummy material is 0.25
Using a coil-shaped 42Ni-Fe alloy with a width of 25 mm and a depth of 0.1 mm and a width of 2.
It was rolled to a thickness of 3 mm under the conditions of a rolling load of 5 tons and a rolling speed of 10 m/min.
圧延後、ダミー材を剥がし、さらに、水素雰囲気中で、
６５０℃×５分の拡散焼鈍を施した。After rolling, the dummy material is peeled off, and further, in a hydrogen atmosphere,
Diffusion annealing was performed at 650°C for 5 minutes.
その結果、厚み０．１５ｍｍＸ幅２３ｍｍのリードフレ
ーム材上面中央に、厚み５０ｐｍ、露出部厚み４０ｐｍ
Ｘ幅２．３ｍｍのＡｇろう突条を圧接したトノプレイク
ラツド材を得た。As a result, at the center of the upper surface of the lead frame material, which is 0.15 mm thick x 23 mm wide, a thickness of 50 pm and an exposed part thickness of 40 pm were formed.
A tono play clad material was obtained in which Ag solder protrusions having an X width of 2.3 mm were pressed together.
実施例２
素材として、厚み０．２５ｍｍＸ幅２５ｍｍのコイル状
の４２Ｎｉ−Ｆｅ系合金リードフレーム材の中央部に、
厚み８〇四■幅２．３鵬の８５Ａｇ−Ｃｕ材を埋入した
インレイクラツド材を用い圧延用溝ロールの凹部溝寸法
を、幅２．３ｍｍ、深さ６０ｐｍとし、圧゛下荷重４．
５ｔｏｎ、、２０ｍ／ｍｉｎの条件で、前記中間素材を
圧延した。Example 2 As a material, a coiled 42Ni-Fe alloy lead frame material with a thickness of 0.25 mm and a width of 25 mm was made of
The concave groove dimensions of the rolling groove roll were 2.3 mm in width and 60 pm in depth using an inlay clad material with a thickness of 80 mm and a width of 2.3 mm with 85Ag-Cu embedded, and the rolling load was 4. ．．
The intermediate material was rolled under conditions of 5 tons and 20 m/min.
その結果、厚み０．１５ｍｍＸ幅２３ｍｍのリードフレ
ーム旧上面中央に、厚み５０ｐｍ、露出部厚み４０ｐｍ
Ｘ幅２．３ｍｍのＡｇろう突条を圧接したトップレイク
ラッド材を得た。As a result, in the center of the old top surface of the lead frame, which was 0.15 mm thick x 23 mm wide, a thickness of 50 pm and an exposed part thickness of 40 pm were added.
A top lay clad material was obtained in which Ag solder protrusions with an X width of 2.3 mm were pressed together.
第１図ａ、ｃ、ｄ図はこの発明によるトップレイクラッ
ドの製造工程を示すロールと素材の説明図であり、同す
、ｅ図は得られたトップレイクラッド材の断面である。
第２図ａ図はこの発明におけるインレイクランド材と溝
ロールとの関係を示す縦断説明図であり、ｂ−ｄ図はこ
の発明による製品のＡｇろう突条の形状を示すトップレ
イクラッド材の縦断説明図である。
第３図ａ、ｂ図はリードフレームのフラットパッケージ
へのろう付は状態を示すリードフレームとパッケージの
斜視説明図である。
第４図ａ図はインレイクラツド材の断面説明図、ｂ図は
リードフレームの断面説明図、０図はそのろう付は状態
を示す縦断説明図である。
第５図ａ図はトップレイクランド材の断面説明図、ｂ図
はリードフレームの断面説明図、Ｃ図はそのろう付は状
態を示す縦断説明図である。
１・・・リードフレーム材、２・Ａｇろう、３・・・フ
ラットパッケージ、４・・・リードフレーム、１０・・
・インレイクラツド材、
１１・・・リードフレーム帯材、１２・・・Ａｇろう帯
材、ｉａ、ｉｓ・・・Ａｇろう突条、
１４．１５・・・トップレイクラッド材、１６・・・溝
部、エフ・・・中央突条部、２０．２１・・・平ロール
、２２．２４・・・溝ロール、２３，２６，２７・・・
凹部溝、２５・・・凸部、３０・・・ダミー材、３１・
・・凹部溝。Figures 1a, c, and d are explanatory diagrams of rolls and materials showing the manufacturing process of the top lay clad according to the present invention, and Figures 1 and 1 e are cross-sectional views of the obtained top lay clad material. Fig. 2a is a longitudinal cross-sectional view showing the relationship between the inlay clad material and the groove roll in this invention, and Figs. FIG. FIGS. 3A and 3B are perspective explanatory views of the lead frame and the package, showing how the lead frame is brazed to the flat package. FIG. 4A is an explanatory cross-sectional view of the inlay clad material, FIG. B is an explanatory cross-sectional view of the lead frame, and FIG. 4 is a longitudinal cross-sectional view showing the state of brazing. FIG. 5A is an explanatory cross-sectional view of the top lakeland material, FIG. B is an explanatory cross-sectional view of the lead frame, and FIG. C is a longitudinal cross-sectional view showing the state of brazing. 1... Lead frame material, 2... Ag solder, 3... Flat package, 4... Lead frame, 10...
- Inlay clad material, 11... Lead frame strip material, 12... Ag solder strip material, ia, is... Ag solder protrusion, 14.15... Top lay clad material, 16... Groove, F...Central protrusion, 20.21...Flat roll, 22.24...Groove roll, 23, 26, 27...
Concave groove, 25... Protrusion, 30... Dummy material, 31.
・Concave groove.
Claims (1)
所要幅の被着材を一対のロールで圧接するに際し、基板
材の上面に被着材を埋入圧接したインレイクラッド材と
、被着材が埋入可能な凹部溝を有し両面が平坦面である
帯状のダミー材を用いて、一対の平ロールで該凹部溝に
被着材を埋入させてダミー材と基板材を圧延し、基板材
に被着材を圧接した後、基板材に被着したダミー材を剥
がし、基板材の所定位置に圧接した被着材突条を得るこ
とを特徴とするトップレイクラッド材の製造方法。 ２ 金属または合金基板材上の所定位置に少なくとも１条の
所要幅の、被着材を一対のロールで圧接するに際し、基
板材の上面に被着材を埋入圧接したインレイクラッド材
を素材とし、インレイクラッド材の被着材の圧接側に凹
部溝を有するロールを当接させ、前記被着材の圧接面と
は反対側に平ロールを当接させ、凹部溝を有するロール
の溝位置を被着材位置に合せて該素材を圧延し、基板材
の所定位置に圧接した被着材突条を得ることを特徴とす
るトップレイクラッド材の製造方法。[Scope of Claims] 1. An inlay in which at least one strip of adherend material of a required width is pressed onto a predetermined position on a metal or alloy substrate material by embedding the adherend material into the upper surface of the substrate material using a pair of rolls. Using a cladding material and a belt-shaped dummy material that has a recessed groove into which the adherend can be inserted and has flat surfaces on both sides, a pair of flat rolls is used to embed the adherend into the recessed groove to make the dummy material. The top is characterized in that the substrate material is rolled, the adherend material is pressed against the substrate material, and then the dummy material adhered to the substrate material is peeled off to obtain adherend material protrusions that are pressed into predetermined positions on the substrate material. Method of manufacturing lake cladding. 2. When at least one strip of the required width of adherend material is pressure-bonded to a predetermined position on a metal or alloy substrate material using a pair of rolls, the material is an inlay clad material in which the adherend material is embedded and pressure-welded on the top surface of the substrate material. , a roll having concave grooves is brought into contact with the pressure contact side of the adherend of the inlay clad material, a flat roll is brought into contact with the opposite side of the adherend from the press contact surface, and the groove position of the roll having the concave grooves is adjusted. A method for manufacturing a top lay cladding material, which comprises rolling the material in accordance with the position of the adherend to obtain adherend protrusions pressed into predetermined positions of the substrate material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1087737A JPH0688147B2 (en) | 1989-04-06 | 1989-04-06 | Method for manufacturing top laid clad material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1087737A JPH0688147B2 (en) | 1989-04-06 | 1989-04-06 | Method for manufacturing top laid clad material |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02268986A true JPH02268986A (en) | 1990-11-02 |
| JPH0688147B2 JPH0688147B2 (en) | 1994-11-09 |
Family
ID=13923239
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1087737A Expired - Fee Related JPH0688147B2 (en) | 1989-04-06 | 1989-04-06 | Method for manufacturing top laid clad material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0688147B2 (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54126963A (en) * | 1978-03-24 | 1979-10-02 | Furukawa Electric Co Ltd | Method of producing top lay type compound filament |
-
1989
- 1989-04-06 JP JP1087737A patent/JPH0688147B2/en not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54126963A (en) * | 1978-03-24 | 1979-10-02 | Furukawa Electric Co Ltd | Method of producing top lay type compound filament |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0688147B2 (en) | 1994-11-09 |
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