JPH02271969A - Aln-based sintered body - Google Patents
Aln-based sintered bodyInfo
- Publication number
- JPH02271969A JPH02271969A JP1092317A JP9231789A JPH02271969A JP H02271969 A JPH02271969 A JP H02271969A JP 1092317 A JP1092317 A JP 1092317A JP 9231789 A JP9231789 A JP 9231789A JP H02271969 A JPH02271969 A JP H02271969A
- Authority
- JP
- Japan
- Prior art keywords
- aln
- sintered body
- boride
- carbide
- fluoride
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 claims abstract description 10
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 claims abstract description 10
- 150000004767 nitrides Chemical class 0.000 claims description 8
- 239000000203 mixture Substances 0.000 abstract description 4
- 238000005245 sintering Methods 0.000 abstract description 3
- 238000002834 transmittance Methods 0.000 abstract description 2
- 239000000758 substrate Substances 0.000 description 8
- 230000000694 effects Effects 0.000 description 6
- 230000017525 heat dissipation Effects 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 238000004040 coloring Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 238000001465 metallisation Methods 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Landscapes
- Ceramic Products (AREA)
Abstract
Description
【発明の詳細な説明】
[産業上の利用分野]
本発明は、半導体素子の実装基板等として用いられるA
fLN質焼結体に関する。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to A
Regarding fLN sintered body.
[従来の技術]
半導体素子の実装基板には、アルミナ基板が多用されて
いるが、最近、実装基板の放熱特性を改善するため、熱
伝導率がアルミナの5〜10倍と高く、かつ高絶縁性で
低誘電率のAuN基板が開発されている。[Prior Art] Alumina substrates are often used for mounting substrates for semiconductor devices, but recently, in order to improve the heat dissipation characteristics of mounting substrates, alumina substrates that have thermal conductivity 5 to 10 times higher than alumina and high insulation AuN substrates with low dielectric constant and high dielectric constant have been developed.
[発明が解決しようとする課題]
しかし、上記従来のAuN基板は、熱伝導率を高くする
ため、不純物を少なくし、密度を大きくしており、その
結果、白色で透光性を有している。従って、これを実装
基板として使用するには、次のような問題がある。[Problems to be Solved by the Invention] However, in order to increase thermal conductivity, the conventional AuN substrate described above contains fewer impurities and has increased density, and as a result, it is white and has translucency. There is. Therefore, there are the following problems when using this as a mounting board.
(1)色むら、不均一な透光性等の外観不良が多発し、
製造上歩留まりが低下する。(1) Appearance defects such as uneven color and uneven translucency occur frequently.
Manufacturing yield will decrease.
(2) メタライズの際のスクリーン印刷等を行う場合
、その透光性が障害となり、赤外線センサ等による正確
な位置決めが困難となる。(2) When performing screen printing or the like during metallization, its translucency becomes an obstacle, making accurate positioning using an infrared sensor or the like difficult.
これに対し、赤外線センサ等による位置検出が容易な灰
色ないし黒灰色を呈するAJZN基板も知られているが
、このようなAuN基板は、熱伝導率がそれほど高くな
く、放熱特性が悪い問題がある。On the other hand, AJZN substrates that exhibit a gray or black-gray color that can be easily detected by infrared sensors, etc. are also known, but such AuN substrates do not have very high thermal conductivity and have poor heat dissipation characteristics. .
そこで、本発明は、外観に係る歩留まり、位置決め精度
及び放熱特性の向上をなし得るAβN質焼結体の提供を
目的とする。Therefore, an object of the present invention is to provide an AβN sintered body that can improve yield, positioning accuracy, and heat dissipation characteristics in terms of appearance.
[課題を解決するための手段]
前記課題を解決するため、本発明は、Y2O31〜lO
重量%、Zrの窒化物、炭化物、ホウ化物、塩化物又は
フッ化物のうちの少なくとも1種0.1〜5重量%、残
部Al1Nからなる混合物を焼成してなるものである。[Means for Solving the Problems] In order to solve the above problems, the present invention provides Y2O31 to lO
It is made by firing a mixture consisting of 0.1 to 5% by weight of at least one of Zr nitride, carbide, boride, chloride, or fluoride, and the balance Al1N.
[作 用]
上記手段において、Y203は、AJ2Nの焼結助剤と
して機能すると共に、熱伝導率の向上に寄与する。Y2
O3が1重量%未満では緻密な焼結体を得ることができ
ず、10重量%を超えると熱伝導率が低下すると共に、
色むらが発生し、かつコスト高となる。Y、03の添加
量は、好ましくは3〜5重量%である。これは、3重量
%未満では熱伝導率の向上の程度が小さく、5重量%を
超えるとコストの上昇にみあうだけの効果が得られない
ことによる。[Function] In the above means, Y203 functions as a sintering aid for AJ2N and contributes to improving thermal conductivity. Y2
If O3 is less than 1% by weight, a dense sintered body cannot be obtained, and if it exceeds 10% by weight, the thermal conductivity decreases,
Color unevenness occurs and costs are high. The amount of Y and 03 added is preferably 3 to 5% by weight. This is because if it is less than 3% by weight, the degree of improvement in thermal conductivity is small, and if it exceeds 5% by weight, the effect that is sufficient to compensate for the increase in cost cannot be obtained.
Zrの窒化物、炭化物、ホウ化物、塩化物又はフッ化物
は、Al1N質焼結体を均一な濃い茶黒色に着色し、透
光性を低下させ、更には熱伝導率を向上させ、01重量
%未満では、焼結体が着色せず、5重量%を超えると熱
伝導率が低下する。Nitride, carbide, boride, chloride, or fluoride of Zr colors the Al1N sintered body uniformly deep brown-black, reduces translucency, and furthermore improves thermal conductivity. If it is less than 5% by weight, the sintered body will not be colored, and if it exceeds 5% by weight, the thermal conductivity will decrease.
Zrの窒化物、炭化物、ホウ化物、塩化物又はフッ化物
の添加量は、好ましくは0.1〜2重量%である。The amount of Zr nitride, carbide, boride, chloride or fluoride added is preferably 0.1 to 2% by weight.
又、上記焼結体の焼成は、N2ガス又は他の不活性ガス
雰囲気中において1600〜1900℃で行う。The sintered body is fired at 1600 to 1900°C in an atmosphere of N2 gas or other inert gas.
[実施例] 以下、本発明の詳細な説明する。[Example] The present invention will be explained in detail below.
AJ2Nの原料粉末にY2O3とZrの窒化物、炭化物
、ホウ化物、塩化物又はフッ化物を第1表〜第3表に示
す割合でそれぞれ添加し、粉砕混合した。これらを直径
16mm、厚さ8mmの円板状に形成し、N2ガス;囲
気中において1750℃で1時間焼成して八11く質焼
結体を得た。Y2O3 and Zr nitride, carbide, boride, chloride, or fluoride were added to the raw material powder of AJ2N in the proportions shown in Tables 1 to 3, and the mixture was ground and mixed. These were formed into a disk shape with a diameter of 16 mm and a thickness of 8 mm, and fired at 1750° C. for 1 hour in an atmosphere of N2 gas to obtain a hard sintered body.
得られた各焼結体は、Zrの窒化物、炭化物、ホウ化物
、塩化物又はフッ化物無添加の試料(白色)を除き、均
一な濃い茶黒色をしており、十分に透光性の低下が詔め
られた。又、これらを厚さ0.5mo+にスライスした
が、これも十分不透明であり、可視光の透過は認められ
なかった。Each of the obtained sintered bodies had a uniform dark brown-black color, with the exception of the sample (white) containing no Zr nitride, carbide, boride, chloride, or fluoride, and had a sufficiently low light transmittance. was enshrined. Furthermore, although these were sliced to a thickness of 0.5 mo+, they were also sufficiently opaque and no transmission of visible light was observed.
又、熱伝導率は、Zrの窒化物、炭化物、ホウ化物、塩
化物又はフッ化物無添、加で、Y2O。Moreover, the thermal conductivity is Y2O with or without addition of Zr nitride, carbide, boride, chloride or fluoride.
5重量%添加したものの熱伝導率を100%とした場合
、第1表〜第3表に示すようになった。When the thermal conductivity of the added 5% by weight is taken as 100%, the results are as shown in Tables 1 to 3.
各表中、×、△、O1◎は着色効果を表わし、Xは効果
なし、Δは着色はするが効果は乏しい、Oは効果有り、
◎は効果大を示す。In each table, ×, △, O1◎ represent the coloring effect, X is no effect, Δ is coloring but the effect is poor, O is effective,
◎ indicates a large effect.
従ッテ、A 42 N ニY 2031〜10重量%と
Zrの窒化物、炭化物、ホウ化物、塩化物又はフッ化物
のうちの少なくともIF!0.1〜5重量%を添加する
ことにより、色むら、不均一な透光性等による外観不良
が低減して歩留まりが向上すると共に、メタライズの際
における赤外線センサによる位置決め精度が向上し、か
つ熱伝導率が向上することがわかる。At least IF of nitride, carbide, boride, chloride or fluoride of A 42 N 2031 to 10% by weight and Zr! By adding 0.1 to 5% by weight, appearance defects due to color unevenness, non-uniform translucency, etc. are reduced, yield is improved, and positioning accuracy by an infrared sensor during metallization is improved. It can be seen that the thermal conductivity is improved.
[発明の効果]
以上のように本発明によれば、焼結体が均一な濃い茶黒
色に着色され、かつ透光性が十分に低下するので、外観
上の歩留まりを向上できると共に、赤外線センサ等によ
る位置決めを容易かつ高精度に行うことができる。[Effects of the Invention] As described above, according to the present invention, the sintered body is colored uniformly dark brown and black, and the translucency is sufficiently reduced, so that it is possible to improve the yield in terms of appearance, and also to improve the appearance of infrared sensors, etc. positioning can be performed easily and with high precision.
又、熱伝導率が、従来に比して向上するので、放熱特性
を一層向上することができる。Furthermore, since the thermal conductivity is improved compared to the conventional one, the heat dissipation characteristics can be further improved.
出願人 東芝セラミックス株式会社Applicant: Toshiba Ceramics Corporation
Claims (1)
化物、ホウ化物、塩化物又はフッ化物のうちの少なくと
も1種0.1〜5重量%、残部AlNからなる混合物を
焼成してなることを特徴とするAlN質焼結体。(1) Y_2O_31 to 10% by weight, 0.1 to 5% by weight of at least one of Zr nitride, carbide, boride, chloride, or fluoride, and the balance AlN. Characteristic AlN sintered body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1092317A JPH02271969A (en) | 1989-04-12 | 1989-04-12 | Aln-based sintered body |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1092317A JPH02271969A (en) | 1989-04-12 | 1989-04-12 | Aln-based sintered body |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02271969A true JPH02271969A (en) | 1990-11-06 |
Family
ID=14051020
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1092317A Pending JPH02271969A (en) | 1989-04-12 | 1989-04-12 | Aln-based sintered body |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02271969A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPWO2021261441A1 (en) * | 2020-06-22 | 2021-12-30 |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61270262A (en) * | 1985-05-22 | 1986-11-29 | 日本特殊陶業株式会社 | High heat conductive aluminum nitride sintered body |
| JPS61281074A (en) * | 1985-06-05 | 1986-12-11 | 日本特殊陶業株式会社 | High heat conductivity aluminum nitride sintered body |
| JPS62128971A (en) * | 1985-11-28 | 1987-06-11 | 京セラ株式会社 | Aluminum nitride base sintered body and manufacture |
| JPS62153173A (en) * | 1985-06-28 | 1987-07-08 | 株式会社東芝 | Aluminum nitride sintered body and manufacture |
| JPS63288966A (en) * | 1987-05-21 | 1988-11-25 | Denki Kagaku Kogyo Kk | Member having resistance to erosion by molten copper |
| JPH0283266A (en) * | 1988-09-20 | 1990-03-23 | Murata Mfg Co Ltd | Production of aln sintered compact |
| JPH02124772A (en) * | 1988-05-16 | 1990-05-14 | Sumitomo Electric Ind Ltd | Aluminum nitride sintered body and manufacturing method |
| JPH02172868A (en) * | 1988-12-26 | 1990-07-04 | Hitachi Metals Ltd | Aluminum nitride sintered body and electronic parts with this utilized therefor |
-
1989
- 1989-04-12 JP JP1092317A patent/JPH02271969A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61270262A (en) * | 1985-05-22 | 1986-11-29 | 日本特殊陶業株式会社 | High heat conductive aluminum nitride sintered body |
| JPS61281074A (en) * | 1985-06-05 | 1986-12-11 | 日本特殊陶業株式会社 | High heat conductivity aluminum nitride sintered body |
| JPS62153173A (en) * | 1985-06-28 | 1987-07-08 | 株式会社東芝 | Aluminum nitride sintered body and manufacture |
| JPS62128971A (en) * | 1985-11-28 | 1987-06-11 | 京セラ株式会社 | Aluminum nitride base sintered body and manufacture |
| JPS63288966A (en) * | 1987-05-21 | 1988-11-25 | Denki Kagaku Kogyo Kk | Member having resistance to erosion by molten copper |
| JPH02124772A (en) * | 1988-05-16 | 1990-05-14 | Sumitomo Electric Ind Ltd | Aluminum nitride sintered body and manufacturing method |
| JPH0283266A (en) * | 1988-09-20 | 1990-03-23 | Murata Mfg Co Ltd | Production of aln sintered compact |
| JPH02172868A (en) * | 1988-12-26 | 1990-07-04 | Hitachi Metals Ltd | Aluminum nitride sintered body and electronic parts with this utilized therefor |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPWO2021261441A1 (en) * | 2020-06-22 | 2021-12-30 | ||
| WO2021261441A1 (en) * | 2020-06-22 | 2021-12-30 | デンカ株式会社 | Aluminum nitride sintered body, circuit substrate and junction substrate |
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