JPH02276105A - Conductive paste - Google Patents
Conductive pasteInfo
- Publication number
- JPH02276105A JPH02276105A JP9517389A JP9517389A JPH02276105A JP H02276105 A JPH02276105 A JP H02276105A JP 9517389 A JP9517389 A JP 9517389A JP 9517389 A JP9517389 A JP 9517389A JP H02276105 A JPH02276105 A JP H02276105A
- Authority
- JP
- Japan
- Prior art keywords
- conductor
- substrate
- glass
- conductive paste
- solder wettability
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004020 conductor Substances 0.000 claims abstract description 24
- 229910052709 silver Inorganic materials 0.000 claims abstract description 4
- 239000000758 substrate Substances 0.000 abstract description 14
- 229910000679 solder Inorganic materials 0.000 abstract description 11
- 239000011521 glass Substances 0.000 abstract description 9
- 239000000919 ceramic Substances 0.000 abstract description 7
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 abstract description 2
- 239000000463 material Substances 0.000 abstract description 2
- QDOXWKRWXJOMAK-UHFFFAOYSA-N dichromium trioxide Chemical compound O=[Cr]O[Cr]=O QDOXWKRWXJOMAK-UHFFFAOYSA-N 0.000 abstract 6
- 238000012360 testing method Methods 0.000 description 4
- 239000000203 mixture Substances 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000005388 borosilicate glass Substances 0.000 description 2
- 230000005496 eutectics Effects 0.000 description 2
- ZFZQOKHLXAVJIF-UHFFFAOYSA-N zinc;boric acid;dihydroxy(dioxido)silane Chemical compound [Zn+2].OB(O)O.O[Si](O)([O-])[O-] ZFZQOKHLXAVJIF-UHFFFAOYSA-N 0.000 description 2
- WUOACPNHFRMFPN-SECBINFHSA-N (S)-(-)-alpha-terpineol Chemical compound CC1=CC[C@@H](C(C)(C)O)CC1 WUOACPNHFRMFPN-SECBINFHSA-N 0.000 description 1
- 239000001856 Ethyl cellulose Substances 0.000 description 1
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 1
- OVKDFILSBMEKLT-UHFFFAOYSA-N alpha-Terpineol Natural products CC(=C)C1(O)CCC(C)=CC1 OVKDFILSBMEKLT-UHFFFAOYSA-N 0.000 description 1
- 229940088601 alpha-terpineol Drugs 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229920001249 ethyl cellulose Polymers 0.000 description 1
- 235000019325 ethyl cellulose Nutrition 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000011812 mixed powder Substances 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
Landscapes
- Paints Or Removers (AREA)
- Conductive Materials (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、電子回路のセラミック配線基板、特に低温焼
成多層配線基板に用いる導体用のペーストの組成に関す
る。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to the composition of a paste for conductors used in ceramic wiring boards for electronic circuits, particularly low-temperature fired multilayer wiring boards.
ハイブリッド回路を印刷したセラミック配線基板には、
従来からアルミナ基板が主として用いられてきた。最近
では、さらに高密度の配線を達成するために、低温焼成
多層配線基板が開発されている。この基板には、低温で
焼成ができるように、セラミックの他にガラスなどの低
融点化合物が含まれている。そのため、この基板に回路
用の導体ペーストを印刷し焼成すると、ガラス成分が導
体の表面に滲みだし、導体にはんだをつける場合、導体
のはんだ濡れ性が悪くなるという問題があった。The ceramic wiring board printed with the hybrid circuit has
Conventionally, alumina substrates have been mainly used. Recently, low-temperature firing multilayer wiring boards have been developed in order to achieve even higher density wiring. This substrate contains a low melting point compound such as glass in addition to ceramic so that it can be fired at low temperatures. Therefore, when a circuit conductor paste is printed on this board and fired, the glass component oozes out onto the surface of the conductor, resulting in poor solder wettability of the conductor when soldering is applied to the conductor.
本発明者らは、導体用ペーストについて鋭意研究した結
果、従来のＡｇ −ＰｄペーストにＣｒｚ（ｈを添加す
ればこの欠点を解消できるとの知見を得て、本発明を完
成した。As a result of extensive research into pastes for conductors, the present inventors obtained the knowledge that this drawback could be overcome by adding Crz(h) to the conventional Ag--Pd paste, and completed the present invention.
すなわち、本発明の要旨は、Ａ、とＰｄの合量に対し、
Ａｇが７０〜９５重量％、Ｐｄが５〜３０重量％、Ｃｒ
２Ｏ１が０．１〜５重量％および適量の有機ビヒクルか
らなる導体ペーストにある。That is, the gist of the present invention is that for the total amount of A and Pd,
Ag: 70-95% by weight, Pd: 5-30% by weight, Cr
The conductive paste consists of 0.1-5% by weight of 2O1 and a suitable amount of organic vehicle.
本発明において、ＡｇとＰｄＯ量が通常使用されている
Ａ、 −Ｐｄペーストの範囲、すなわちＡｇが７０〜９
５重量％、Ｐｄが５〜３０重量％であれば、使用できる
。In the present invention, the amount of Ag and PdO is in the range of commonly used A, -Pd paste, that is, Ag is 70 to 9.
If Pd is 5% by weight and Pd is 5 to 30% by weight, it can be used.
Ｃｒ２Ｏ．０量は０．１〜５重量％好ましくは０．３〜
３重量％である。０．１重量％より少ないと、導体のは
んだ濡れ性が悪い。５重量％よりも多いとシート抵抗値
が上がるので好ましくない。Cr2O. 0 amount is 0.1 to 5% by weight, preferably 0.3 to 5% by weight.
It is 3% by weight. If it is less than 0.1% by weight, the solder wettability of the conductor is poor. If it is more than 5% by weight, the sheet resistance value will increase, which is not preferable.
基板材料としては、アルーナなどのセラミックにガラス
を添加したものが特に効果があるが、セラミック単味ま
たはガラスの添加量の少ない場合には、導体ペーストに
ガラスフリフトをθ〜５重量重量％撚加すれば、基板と
導体との固着強度を増すことができるとともに、Ｃｒ２
Ｏ２により導体のはんだ濡れ性もよくなる。As a substrate material, ceramics such as Aruna with glass added are particularly effective, but in the case of a single ceramic or a small amount of glass added, twist θ ~ 5% by weight of glass lift into the conductor paste. By adding Cr2, it is possible to increase the adhesion strength between the substrate and the conductor, and
O2 also improves the solder wettability of the conductor.
基板の作製
Ａ ｆｆｉ ２Ｏ．粉末単味、Ａ ｉ’ ２Ｏ３粉末と
ホウケイ酸亜鉛ガラス粉末との等量混合粉末にそれぞれ
バインダーを混合し、シート状に成形し、それぞれを１
６００℃、８５０℃で焼成して、厚み０．６鶴の基板を
得た。Preparation of substrate Affi 2O. A binder was mixed with a single powder, a mixed powder of equal amounts of A i' 2O3 powder and zinc borosilicate glass powder, and the mixture was formed into a sheet.
It was fired at 600°C and 850°C to obtain a substrate with a thickness of 0.6 mm.
導体ペーストの作製
エチルセルローズをα−テルピネオールに溶解し、ビヒ
クルを作製した。これに＾ｇＳＰｄｓ Ｃｒ２Ｏ２、ガ
ラスフリット（ホウケイ酸亜鉛ガラス）を所定量加え、
三本ロールミルで混練し、ペースト状にした。Preparation of conductor paste Ethyl cellulose was dissolved in α-terpineol to prepare a vehicle. Add a predetermined amount of gSPds Cr2O2 and glass frit (zinc borosilicate glass) to this,
The mixture was kneaded in a three-roll mill to form a paste.
特性試験用の基板の作製
２５０メツシユのスクリーンを用いて、２インチ角の大
きさの基板に２ｍ角のもの２５個２Ｏ．５ＸＩ（Ｉｎの
もの２個になるように導体ペーストを印刷した。これを
大気中で８５０℃１０分間焼成し、特性試験用の基板を
得た。Preparation of substrate for characteristic test Using a 250-mesh screen, 25 pieces of 2m square were placed on a 2 inch square substrate. Two pieces of 5XI (In) conductive paste were printed. This was fired in the atmosphere at 850°C for 10 minutes to obtain a substrate for characteristic testing.
特性試験
得られた基板について、つぎの特性試験を行なった。そ
の結果は表１．２．３に示す。Characteristics Test The following characteristics tests were conducted on the obtained substrate. The results are shown in Table 1.2.3.
イ、はんだ濡れ性
２鶴角に導体を焼付けた基板を２２０℃のへ８２％人共
晶はんだ中に５秒間浸漬し、導体がはんだに濡れる面積
で評価した。B. Solder wettability A board on which a conductor was baked into a square shape was immersed in 82% eutectic solder at 220°C for 5 seconds, and the area of the conductor wetted by the solder was evaluated.
口、はんだ喰れ性
２鶴角に導体を焼付けた基板を２６０℃のＡｇ２％人共
晶はんだ中に３０秒間浸漬し、導体がはんだに溶出する
程度を観察した。A board on which a conductor was baked into a square shape was immersed for 30 seconds in 2% Ag eutectic solder at 260° C., and the extent to which the conductor was eluted into the solder was observed.
ハ、固着強度
基板に焼付けられた２鶴角の導体に２Ｏ．５ ｔｍ径の
スズめっき銅線をＬ字形にはんだ付けし、基板に対して
直角方向に銅線を引張り、基板から導体が剥れたときの
強度を測定した。C. Adhesion strength: 2O. A tin-plated copper wire with a diameter of 5 tm was soldered in an L shape, the copper wire was pulled in a direction perpendicular to the board, and the strength was measured when the conductor was peeled off from the board.
二、膜厚
表面粗さ計により、基板に印刷された導体の厚さを測定
した。2. Film thickness The thickness of the conductor printed on the substrate was measured using a surface roughness meter.
ホ、シート抵抗
基板に焼付けられた０、 ５ Ｘ １０鰭の導体を用い
て、四端子法で測定した。E. Measurement was performed using a four-probe method using a 0.5 x 10 fin conductor baked on a sheet resistance board.
表 〔発明の効果〕 本発明の導体ペーストを用いることにより、基 板に焼付けられた導体は、 はんだ濡れ性が良好で あった。table 〔Effect of the invention〕 By using the conductive paste of the present invention, the basic The conductor baked into the board is Good solder wettability there were.
出 願 人 日本セメント株式会社Out wish Man Nippon Cement Co., Ltd.
Claims (1)
、Ｐｄが５〜３０重量％、Ｃｒ＿２Ｏ＿３が０．１〜５
重量％および適量の有機ビヒクルからなる導体ペースト
。Ag is 70 to 95% by weight based on the total amount of Ag and Pd
, Pd is 5-30% by weight, Cr_2O_3 is 0.1-5
Conductor paste consisting of weight percent and appropriate amount of organic vehicle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1095173A JP2992958B2 (en) | 1989-04-17 | 1989-04-17 | Conductive paste for low-temperature fired multilayer wiring boards |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1095173A JP2992958B2 (en) | 1989-04-17 | 1989-04-17 | Conductive paste for low-temperature fired multilayer wiring boards |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02276105A true JPH02276105A (en) | 1990-11-13 |
| JP2992958B2 JP2992958B2 (en) | 1999-12-20 |
Family
ID=14130364
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1095173A Expired - Lifetime JP2992958B2 (en) | 1989-04-17 | 1989-04-17 | Conductive paste for low-temperature fired multilayer wiring boards |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2992958B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6596382B2 (en) * | 2000-07-21 | 2003-07-22 | Murata Manufacturing Co. Ltd. | Multilayered board and method for fabricating the same |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62186407A (en) * | 1986-02-10 | 1987-08-14 | 昭栄化学工業株式会社 | Conductive compound |
-
1989
- 1989-04-17 JP JP1095173A patent/JP2992958B2/en not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62186407A (en) * | 1986-02-10 | 1987-08-14 | 昭栄化学工業株式会社 | Conductive compound |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6596382B2 (en) * | 2000-07-21 | 2003-07-22 | Murata Manufacturing Co. Ltd. | Multilayered board and method for fabricating the same |
| EP1178713A3 (en) * | 2000-07-21 | 2005-01-26 | Murata Manufacturing Co., Ltd. | Multilayered board and method for fabricating the same |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2992958B2 (en) | 1999-12-20 |
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