JPH0227634U - - Google Patents

Info

Publication number
JPH0227634U
JPH0227634U JP10562988U JP10562988U JPH0227634U JP H0227634 U JPH0227634 U JP H0227634U JP 10562988 U JP10562988 U JP 10562988U JP 10562988 U JP10562988 U JP 10562988U JP H0227634 U JPH0227634 U JP H0227634U
Authority
JP
Japan
Prior art keywords
switch
reed switch
reed
lead frame
temperature
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10562988U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP10562988U priority Critical patent/JPH0227634U/ja
Publication of JPH0227634U publication Critical patent/JPH0227634U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Thermally Actuated Switches (AREA)
  • Switches That Are Operated By Magnetic Or Electric Fields (AREA)
  • Manufacture Of Switches (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は、プリント基板実装タイプの封止成形
型温度スイツチの外観斜視図。第2図は、本考案
による封止成形温度スイツチの内部斜視図。第3
図は、従来の封止成形型温度スイツチの内部斜視
図。 1……環状感温磁性体、2……環状永久磁石、
3……リードスイツチ、4……リードスイツチの
リード、5……本考案のリードフレーム、55…
…従来のリードフレーム、6……リードフレーム
のリード、7……フレームガイド、8……モール
ド樹脂部、9……本考案のリードフレーム5のV
字形凹部、10……リード端子。
FIG. 1 is an external perspective view of a sealed molded temperature switch of the printed circuit board mounting type. FIG. 2 is an internal perspective view of the sealing molding temperature switch according to the present invention. Third
The figure is an internal perspective view of a conventional sealing mold temperature switch. 1... Annular temperature-sensitive magnetic body, 2... Annular permanent magnet,
3...Reed switch, 4...Reed switch lead, 5...Lead frame of the present invention, 55...
...Conventional lead frame, 6...Lead of lead frame, 7...Frame guide, 8...Mold resin part, 9...V of lead frame 5 of the present invention
Letter-shaped recess, 10...Lead terminal.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] リードスイツチと感温磁性体、永久磁石、及び
リードフレームとから構成され、樹脂にて一体に
封止成形される温度スイツチに於て、リードスイ
ツチを接続するリードフレームの中央部にV字形
凹部を形成し、該凹部にリードスイツチのリード
を接続することを特徴とする封止成形型温度スイ
ツチ。
In a temperature switch that is composed of a reed switch, a temperature-sensitive magnetic material, a permanent magnet, and a lead frame, and is integrally sealed and molded with resin, a V-shaped recess is formed in the center of the lead frame that connects the reed switch. What is claimed is: 1. A sealing mold temperature switch, characterized in that a reed switch is formed in the reed, and a lead of the reed switch is connected to the recess.
JP10562988U 1988-08-09 1988-08-09 Pending JPH0227634U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10562988U JPH0227634U (en) 1988-08-09 1988-08-09

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10562988U JPH0227634U (en) 1988-08-09 1988-08-09

Publications (1)

Publication Number Publication Date
JPH0227634U true JPH0227634U (en) 1990-02-22

Family

ID=31338415

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10562988U Pending JPH0227634U (en) 1988-08-09 1988-08-09

Country Status (1)

Country Link
JP (1) JPH0227634U (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5937952U (en) * 1982-08-31 1984-03-10 株式会社トヨトミ Ceramic burner flame detection device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5937952U (en) * 1982-08-31 1984-03-10 株式会社トヨトミ Ceramic burner flame detection device

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