JPH0227774U - - Google Patents
Info
- Publication number
- JPH0227774U JPH0227774U JP10640588U JP10640588U JPH0227774U JP H0227774 U JPH0227774 U JP H0227774U JP 10640588 U JP10640588 U JP 10640588U JP 10640588 U JP10640588 U JP 10640588U JP H0227774 U JPH0227774 U JP H0227774U
- Authority
- JP
- Japan
- Prior art keywords
- solder
- case
- slit
- soldering device
- attracting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 5
- 238000005476 soldering Methods 0.000 claims 2
Landscapes
- Casings For Electric Apparatus (AREA)
Description
第１図乃至第３図は本考案の一実施例であり、
第１図はその平面図、第２図ａ，ｂ，ｃ，ｄは要
部を示す一部切欠平面図、第３図ａは第２図ａの
Ａ―Ａ線断面図、第３図ｂは第２図ｂのＢ―Ｂ線
断面図、第３図ｃは第２図Ｃ―Ｃ線断面図、第３
図ｄは第２図ｄのＤ―Ｄ線断面図である。又、第
４図は従来型の平面図、第５図は第４図Ｅ―Ｅ線
断面図である。
２……下ケース、３……上ケース、４……スリ
ツト、５……ハンダ、６……凹凸部。
Figures 1 to 3 show an embodiment of the present invention,
Figure 1 is a plan view, Figure 2 a, b, c, and d are partially cutaway plan views showing the main parts, Figure 3 a is a sectional view taken along line A--A of Figure 2 a, Figure 3 b is a cross-sectional view taken along the line B-B in Figure 2b, Figure 3c is a cross-sectional view taken along the line C-C in Figure 2, and
FIG. d is a sectional view taken along the line DD in FIG. 2d. 4 is a plan view of the conventional type, and FIG. 5 is a sectional view taken along the line E--E in FIG. 2... lower case, 3... upper case, 4... slit, 5... solder, 6... uneven portion.
Claims (1)
リツトにハンダを流し込んで結合するように構成
したケースに於て、前記スリツトにハンダ呼び込
み用の連続した凹凸部を構成したことを特徴とす
る上下ケースのハンダ付装置。 (2) 前記ハンダ呼び込み用の連続した凹凸部の
下部を外側に湾曲してハンダ受を構成したことを
特徴とする請求項第(1)項記載の上下ケースのハ
ンダ付装置。[Claims for Utility Model Registration] (1) In a case constructed such that an upper case is fitted to a lower case and solder is poured into a slit between them to join the case, the slit has a continuous unevenness for attracting solder. A soldering device for upper and lower cases, characterized in that it consists of two parts. (2) The soldering device for upper and lower cases according to claim 1, characterized in that a lower portion of the continuous uneven portion for attracting solder is curved outward to form a solder receptacle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10640588U JPH0227774U (en) | 1988-08-11 | 1988-08-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10640588U JPH0227774U (en) | 1988-08-11 | 1988-08-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0227774U true JPH0227774U (en) | 1990-02-22 |
Family
ID=31339887
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10640588U Pending JPH0227774U (en) | 1988-08-11 | 1988-08-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0227774U (en) |
-
1988
- 1988-08-11 JP JP10640588U patent/JPH0227774U/ja active Pending