JPH02277773A - Support structure for film thickness monitoring sensor in vapor deposition equipment - Google Patents

Abstract

PURPOSE:To monitor film thickness with high precision by providing a supporting member piercing the hole of a rotating shaft, fixing a sensor to the member and monitoring the vapor-deposited film forming conditions on a substrate. CONSTITUTION:A cooling water pipe 27 is allowed to pierce the hole 19a of the rotating shaft 19 of a vapor deposition device 1, and the sensor 26 is fixed to the pipe. When the rotating shaft 19 is rotated by a driving means 6, a planetary jig 14 is rotated through a rotating arm 25 and a rod 18, and each substrate holder 5 is revolved. A roller 17 is rolled on an annular rail 3, and the substrate holder 5 is rotated. The sensor 26 is not interfered with the rotating arm 25, etc., or shielded from a vaporizing source 2, hence a difference in the film forming conditions is not caused between the substrates on the substrate holder 5, and the film thickness is monitored with high precision. The sensor 26 can easily be taken into and out from the vapor deposition vessel 1.

Description

DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a support structure for a film thickness monitoring sensor in a vapor deposition apparatus.

(Prior art) When performing vacuum evaporation on a substrate such as glass, each substrate is rotated around the central axis passing through the evaporation source (around this evaporation source in front of the evaporation source). There is a technique that uses a planetary jig that rotates on its axis to equalize the thickness of the deposited film.

In other words, this planetary jig is rotatably supported by a plurality of rollers on an annular rail provided approximately horizontally around the central axis passing through the evaporation source in the evaporation tank, and the substrate is supported on the spindle of each roller. The substrate holder that holds it is fixed.

In this case, the planetary jig is rotated by a rotating arm fixed to a rotating shaft provided on the central axis passing through the evaporation source, and this causes the substrate holder to revolve, and at the same time, the rollers are transferred on the annular rail. This causes the substrate holder to rotate itself, that is, to move on its own.

In a vapor deposition apparatus equipped with such a planetary jig, a monitoring sensor (crystal oscillator) is installed near the rotation axis to monitor the state of formation of the vapor deposited film on the substrate.
is installed. In other words, this monitor utilizes the fact that the resonant frequency of the sensor changes as the film-forming material is deposited on its surface, and the state of the deposition on the substrate is monitored from the change in this resonant frequency. It is something.

In this case, the sensor is held by a copper cooling water vibrator fixed to the ceiling wall of the deposition tank, and by bending this cooling water vibrator, the sensor is placed at a desired position near the rotation axis. It is like that.

(Problems to be Solved by the Invention) Incidentally, it is desirable that the sensor is provided at a position where the film forming conditions are the same as that of the substrate of the substrate holder. However, as described above, in the case of a system in which the substrate holder is rotated by a rotary arm, the sensor cannot be provided below the rotation locus of the rotary arm (closer to the evaporation source). In other words, this is because the sensor or its cooling water vibrator interferes with the rotating arm.

Therefore, the sensor must be provided above the rotary arm at a position eccentric from the rotation axis of the rotary arm, that is, the central axis passing through the evaporation source. Moreover, in that case, every time the rotary arm rotates once, the deposition on the sensor is blocked by the rotary arm, increasing the difference in film formation conditions between the substrate and the sensor. Therefore, in order to monitor the formation state of the deposited film on the substrate using the above sensor,
It is necessary to take into account the effects of the eccentricity and the obstruction of the rotating arm, which makes it difficult to monitor with high accuracy the state of formation of the deposited film on the substrate.

That is, an object of the present invention is to prevent, in a method in which a substrate holder is rotated by a rotating arm, a difference between the film forming conditions between a monitoring sensor and a substrate due to the rotation of the rotating arm. There is a particular thing.

(Means for Solving the Problems) In order to solve these problems, the present invention makes the rotary shaft of the rotary arm hollow, and supports a monitor sensor with a support member passing through the inside of the rotary arm. This allows the inside of the vapor deposition tank to be viewed without interfering with the interior of the vapor deposition tank.

That is, the specific means is to arrange a substrate holder that holds the substrate around the central axis passing through the evaporation source in the evaporation tank, while penetrating the wall of the evaporation tank on the central axis and driving means outside the evaporation tank. In a vapor deposition apparatus, the substrate holder is rotated around the central axis by a rotating arm connected to the rotating shaft in a vapor deposition tank, and the rotating shaft has openings at both ends thereof. A supporting member is provided which faces into the vapor deposition tank from outside the vapor deposition tank through the shaft hole, and a support member is provided that faces into the vapor deposition tank from the outside of the vapor deposition tank through the shaft hole. This is a support structure for a sensor for monitoring film thickness in a vapor deposition apparatus, characterized in that a sensor for monitoring the state is mounted.

(Function) In the support structure for the film thickness monitoring sensor described above, the rotating shaft is made hollow and the support member for the sensor is passed through it.
The sensor can be exposed to the inside of the deposition tank through the shaft hole of the rotating shaft without interfering with the rotating arm.

(Effects of the Invention) Therefore, according to the present invention, a shaft hole that is open at both ends is formed in the rotation shaft of the rotary arm, and a monitoring sensor is supported by a support member passed through the shaft hole, and the monitoring sensor is supported inside the vapor deposition tank. This allows the sensor to be placed on the central axis that passes through the evaporation source, and the sensor is not obstructed from the evaporation source by the rotating arm. It is possible to prevent differences in film formation conditions between the sensor and the substrate, and to monitor the formation state of the vapor deposited film on the substrate with high accuracy.

(Example) Embodiments of the present invention will be described below based on the drawings.

In the vacuum evaporation apparatus shown in FIG. 1, 1 is a evaporation tank kept in a high vacuum state, 2 is an evaporation source where the film-forming material is evaporated by an electron gun, etc., and 3 is installed approximately horizontally above the evaporation source 2. A plurality of substrate holders 5 are supported by the provided annular rail 3 and hold substrates on which a deposited film is to be formed.
A planetary jig 6 is a driving means (motor) for rotating the planetary jig 4 on the annular rail 3.

In order to support the annular rail 3 on the inner wall surface of the vapor deposition tank 1, a plurality of vertical screw members 8 fixed to the inner wall surface via brackets 7 are provided. The annular rail 3 is fixed to a support bracket 9 which is vertically adjustable by applying a nut to the screw member 8.

As shown in FIG. 2, the planetary jig 4 is a center member that is disposed at the center of the annular rail 3 and rotates around the center of the annular rail 3 (around the central axis passing through the evaporation source 2). 11, and six arms 12 projecting downward from the center member 11 at angular intervals of 60 degrees in the radial direction.

At the tip of each arm 12, a rotating shaft 15 whose axis is orthogonal to this arm and whose both ends protrude upward and downward is attached to a bearing 1.
It is rotatably supported at 6.

A roller 17 is fixed to the upper end of the rotating shaft 15 that protrudes above the arm 12, and is brought into contact with the annular rail 3 and rotates thereon, and the lower end of the rotating shaft 15 that protrudes below the arm 12 A substrate holder 5 is fixed to the part. The center member 11 also has the drive means 6.
A rod 18 is provided to protrude upward, and the planetary jig 4 receives the rotational driving force from the rod 18 .

Then, in order to rotate the planetary jig 4 by the driving means 6, it penetrates the ceiling wall of the vapor deposition tank 1 on the central axis (vertical line) passing through the evaporation source 2, and connects the upper and lower parts thereof. One hollow rotary shaft is provided that protrudes from the outside and inside of the vapor deposition tank 1.

That is, the rotating shaft 19 is provided with a shaft hole 19a that is open at both ends and passes through the shaft, and is fixed to the ceiling wall of the vapor deposition tank 1 by passing through a through hole 20 formed in the ceiling wall of the vapor deposition tank 1. The bearing member 21 is supported by an upper bearing 21a and a lower bearing 21b.

A gear 22 is fitted onto the rotary shaft 19 between the upper and lower bearing parts, and an idle gear 24 is interposed between the gear 22 and a drive gear 23 coupled to the output shaft of the drive means 6. ing. In addition, inside the vapor deposition tank 1, a rod 18 of the planetary jig 4 is attached to the lower end of the rotating shaft 19.
A rotating arm 25 that can be rotatably engaged with is horizontally protruded.

In order to monitor the state of formation of the vapor deposited film on the substrate in the vapor deposition tank 1, a sensor 26 is inserted into the vapor deposition tank 1 through the shaft hole 19a of the rotating shaft 19 toward the evaporation source 2. It's urgent.

That is, the sensor 26 is equipped with a crystal oscillator on its lower surface, and the rotation shaft 19 is connected from the outside of the vapor deposition tank 1.
The end of the cooling water vibrator (supporting member) 27 facing the inside of the vapor deposition tank 1 through the shaft hole 19a, that is, the vapor deposition tank 1
It is attached to the end facing inward. The cooling water vibe 27 is
It cools the sensor 26 and is made of stainless steel, and its upper end is fixed through a cap 28 that is placed over the upper end of the bearing member 21. It extends in a straight line so as not to touch each other. Therefore, the sensor 26 faces the inside of the vapor deposition tank 1 on the central axis passing through the evaporation source 2, and is supported by the cooling water vibrator 27 on the ceiling wall of the vapor deposition tank 1 via the cap 28 and the bearing member 21. It turns out.

Further, in this example, only the sensor 26 faces the inside of the vapor deposition tank 1, and the cooling water vibrator 27 is disposed in the shaft hole 19a of the rotating shaft 19.

In addition, in FIG. 1, 29 is a coaxial cable connected to the sensor 26 in order to detect the resonance frequency of the sensor 26.

Therefore, in the vacuum evaporation apparatus described above, the rotating shaft 19 rotates under the driving force of the driving means 6, and as a result, the rotating arm 25 coupled to the rotating shaft 19 rotates to rotate the rod of the planetary jig 4. 18 to rotate the planetary jig 4.

That is, the planetary jig 4 rotates as each roller 17 moves on the annular rail 3, causing each substrate holder 5 to revolve around a vertical line passing through the evaporation source 2. Further, the roller 17 moves on the annular rail 3 and rotates the rotation axis 15, thereby causing the substrate holder 5 fixed to the rotation axis 15 to rotate.

Therefore, all the substrate holders 5 rotate while rotating, and as a result, the thickness of the deposited film of the substrates held by these substrate holders 5 becomes approximately constant.

Thus, the sensor 26 for monitoring the formation state of the vapor deposited film on the substrate faces the inside of the vapor deposition tank 1 on the central axis that passes through the evaporation source 2 from the lower end of the shaft hole 19a of the rotating shaft 19. Therefore, this sensor 26 will not interfere with the rotating arm 25 coupled to the outer circumferential surface of the rotating shaft 19, nor will it be blocked from the evaporation source 2 by the rotation of this rotating arm 25. It is not affected by rotation.

That is, the crystal oscillator of the sensor 26 and the substrate holder 5
A rotary shaft 19 or a rotary arm 25 is connected between the base plate and the base plate.
There is no difference in the film forming conditions due to the rotation of the . Therefore, when monitoring the formation state of the evaporated film on the substrate using this sensor 26, there is no need to take into account eccentricity from the central axis passing through the evaporation source 2 or the influence of obstruction of the rotary arm 25, as in the conventional case. This means that the formation state of the vapor deposited film can be monitored with high precision.

Further, in the above embodiment, the cooling water pipe 27 of the sensor 26
The supporting rigidity of the sensor 26 is increased by making the sensor 26 made of stainless steel. Since the cooling water vibrator 27 extends linearly inside the shaft hole 19a of the rotating shaft 19, the vapor deposition tank 1
The sensor 26 can be easily inserted into and taken out of the vapor deposition tank through the shaft hole 19a of the rotating shaft 19. Moreover, in the case of the above embodiment, although only the sensor 26 is exposed inside the vapor deposition tank 1, the sensor 26
Other than that, i.e. cooling water vibrator 27 and coaxial cable 2
There is almost no accumulation of evaporated particles on the parts 9, and the effort of cleaning them can be saved.

[Brief explanation of drawings]

The drawings show an embodiment of the present invention, and FIG. 1 is a longitudinal sectional view showing the overall configuration of a vacuum evaporation apparatus, and FIG. 2 is a plan view showing the relationship between a planetary jig and an annular rail. 1... Vapor deposition tank 2... Evaporation source 3... Annular rail 4... Planetary jig 5... Substrate holder 6... ... Drive means 19 ... Rotating shaft 19a ... Shaft hole 25 ... Rotating arm 26 ... Sensor 27 ... Cooling water pipe (Supporting member) Fig. 2

Claims (1)

[Claims] (1) A substrate holder that holds the substrate is arranged around a central axis that passes through the evaporation source in the deposition tank, and a rotating shaft that penetrates the wall of the deposition tank on the central axis and is rotationally driven by a driving means outside the deposition tank. In the vapor deposition apparatus, the substrate holder is rotated around the central axis by a rotating arm connected to the rotating shaft in the vapor deposition tank, and the rotating shaft has a shaft hole that opens at both ends and passes through the rotating shaft. A support member is provided which faces into the vapor deposition tank from outside the vapor deposition tank through this shaft hole, and a support member is provided at the end of the support member facing into the vapor deposition tank for monitoring the state of formation of the vapor deposited film on the substrate. A support structure for a sensor for monitoring film thickness in a vapor deposition apparatus, characterized in that the sensor is attached.