JPH022834U - - Google Patents
Info
- Publication number
- JPH022834U JPH022834U JP8080588U JP8080588U JPH022834U JP H022834 U JPH022834 U JP H022834U JP 8080588 U JP8080588 U JP 8080588U JP 8080588 U JP8080588 U JP 8080588U JP H022834 U JPH022834 U JP H022834U
- Authority
- JP
- Japan
- Prior art keywords
- center block
- block
- surface plate
- positioning device
- attached
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000465 moulding Methods 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 claims description 2
- 238000002347 injection Methods 0.000 claims 1
- 239000007924 injection Substances 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 238000007789 sealing Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Description
第１図および第２図はこの考案の一実施例を示
す図で、第１図は要部平面図、第２図は要部平面
図イと側断面図ロ、第３図はこの考案の他の実施
例を示す要部平面図イと側断面図ロ、第４図は従
来のこの種樹脂封止形半導体装置成形用モールド
金型を示す要部平面図である。
図中、１は定盤、２はチエイスブロツク、３は
センタブロツク、４はノツクピン、５は六角穴付
ボルト、６は二面カツトノツクピンである。なお
、図中同一符号は同一又は相当部分を示す。
Figures 1 and 2 are views showing one embodiment of this invention. Figure 1 is a plan view of the main part, Figure 2 is a plan view of the main part A and side sectional view B, and Figure 3 is a diagram of the main part. FIG. 4 is a plan view of a main part showing another embodiment, a side sectional view B, and a plan view of a main part showing a conventional mold for molding a resin-sealed semiconductor device of this type. In the figure, 1 is a surface plate, 2 is a chase block, 3 is a center block, 4 is a knock pin, 5 is a hexagon socket head bolt, and 6 is a two-sided cut-off pin. Note that the same reference numerals in the figures indicate the same or equivalent parts.
Claims (1)
ンタブロツク、このセンタブロツクに隣接して上
記定盤に取付けられ樹脂封止用凹部を有するチエ
イスブロツク、このチエイスブロツクを上記定盤
に対して位置決めするために上記センタブロツク
に近接して配置された第１の位置決め装置と、上
記センタブロツクから離れた位置に配置されセン
タブロツクの熱歪みを吸収するよう構成された第
２の位置決め装置を備えた樹脂封止形半導体装置
成形用モールド金型。 A center block that is attached to the surface plate and constitutes the injection cylinder section, a chase block that is attached to the surface plate adjacent to the center block and has a resin sealing recess, and a chase block that is positioned with respect to the surface plate. a first positioning device disposed close to the center block, and a second positioning device disposed away from the center block and configured to absorb thermal distortion of the center block. Mold for molding resin-sealed semiconductor devices.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8080588U JPH022834U (en) | 1988-06-17 | 1988-06-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8080588U JPH022834U (en) | 1988-06-17 | 1988-06-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH022834U true JPH022834U (en) | 1990-01-10 |
Family
ID=31305623
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8080588U Pending JPH022834U (en) | 1988-06-17 | 1988-06-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH022834U (en) |
-
1988
- 1988-06-17 JP JP8080588U patent/JPH022834U/ja active Pending
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