JPH0228371U - - Google Patents
Info
- Publication number
- JPH0228371U JPH0228371U JP10612188U JP10612188U JPH0228371U JP H0228371 U JPH0228371 U JP H0228371U JP 10612188 U JP10612188 U JP 10612188U JP 10612188 U JP10612188 U JP 10612188U JP H0228371 U JPH0228371 U JP H0228371U
- Authority
- JP
- Japan
- Prior art keywords
- soldering iron
- vacuum suction
- suction device
- view
- electronic components
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図はこの考案の一実施例による真空吸着装
置付半田ごてを示す斜視図、第２図は第１図の要
部を示す拡大斜視図、第３図は従来の電気半田ご
てを示す斜視図、第４図は電子部品実装時正面断
面図、第５図は従来の電気半田ごてによる電子部
品取り外し状態を示す斜視図である。
図において、２はこて先、３は印刷配線板、４
は電子部品、５は導体部、６は半田、８は真空吸
吸装置付半田ごて、９は真空吸着ノズル、１０は
ノズル高さ調整つまみ、１１はエアーホース、１
２は電源コード、１３は真空ポンプ内臓半田こて
制御装置、１４は空気排出口を示す。なお、図中
、同一符号は同一、又は相当部分を示す。
Fig. 1 is a perspective view showing a soldering iron with a vacuum suction device according to an embodiment of this invention, Fig. 2 is an enlarged perspective view showing the main parts of Fig. 1, and Fig. 3 is a perspective view of a conventional electric soldering iron. FIG. 4 is a front sectional view when electronic components are mounted, and FIG. 5 is a perspective view showing a state in which electronic components are removed using a conventional electric soldering iron. In the figure, 2 is a soldering iron tip, 3 is a printed wiring board, and 4 is a soldering iron tip.
are electronic parts, 5 is a conductor part, 6 is solder, 8 is a soldering iron with a vacuum suction device, 9 is a vacuum suction nozzle, 10 is a nozzle height adjustment knob, 11 is an air hose, 1
2 is a power cord, 13 is a soldering iron control device with a built-in vacuum pump, and 14 is an air outlet. In addition, in the figures, the same reference numerals indicate the same or equivalent parts.
Claims (1)
真空吸着装置付半田ごてにおいて、半田ごて部と
真空吸着部とを備えたことを特徴とする真空吸着
装置付半田ごて。 A soldering iron with a vacuum suction device for removing electronic components soldered to a printed wiring board, characterized in that the soldering iron with a vacuum suction device is provided with a soldering iron part and a vacuum suction part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10612188U JPH0228371U (en) | 1988-08-10 | 1988-08-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10612188U JPH0228371U (en) | 1988-08-10 | 1988-08-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0228371U true JPH0228371U (en) | 1990-02-23 |
Family
ID=31339350
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10612188U Pending JPH0228371U (en) | 1988-08-10 | 1988-08-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0228371U (en) |
-
1988
- 1988-08-10 JP JP10612188U patent/JPH0228371U/ja active Pending