JPH022837U - - Google Patents

Info

Publication number
JPH022837U
JPH022837U JP7970888U JP7970888U JPH022837U JP H022837 U JPH022837 U JP H022837U JP 7970888 U JP7970888 U JP 7970888U JP 7970888 U JP7970888 U JP 7970888U JP H022837 U JPH022837 U JP H022837U
Authority
JP
Japan
Prior art keywords
heater chip
mounting surface
head
surface parallel
chip mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7970888U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP7970888U priority Critical patent/JPH022837U/ja
Publication of JPH022837U publication Critical patent/JPH022837U/ja
Pending legal-status Critical Current

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Landscapes

  • Wire Bonding (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は、本考案の第1の実施例を示す斜視図
、第2図は、本考案の第2の実施例2を示す正面
図、第3図は従来を示す斜視図である。 1……スライド板、2,2a,2b,2c,2
d……ヒーターチツプホルダー、3,3a……ヒ
ーターチツプ、4,4a……ヒーターチツプ加工
面、5……基準テブール、6a,6b……ケーブ
ル、7a,7b……ビス、8a,8b……ビス、
9a,9b……ヒーターチツプホルダーマウント
面、10a,10b……ヒーターチツプマウント
面。
FIG. 1 is a perspective view of a first embodiment of the present invention, FIG. 2 is a front view of a second embodiment of the present invention, and FIG. 3 is a perspective view of a conventional device. 1...Slide plate, 2, 2a, 2b, 2c, 2
d... Heater chip holder, 3, 3a... Heater chip, 4, 4a... Heater chip processed surface, 5... Reference table, 6a, 6b... Cable, 7a, 7b... Screw, 8a, 8b... Screw,
9a, 9b... Heater chip holder mount surface, 10a, 10b... Heater chip mount surface.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 金属の熱圧着加工装置のヘツドにおいて、被加
工物を置く基準テーブルと平行なヒーターチツプ
マウント面を一面のみに有し、該ヒーターチツプ
マウント面と平行なヘツド本体へのマウント面を
1面のみもつヒーターチツプホルダーを有するこ
とを特徴とする熱圧着加工ヘツド。
The head of a metal thermocompression bonding machine has only one heater chip mounting surface parallel to the reference table on which the workpiece is placed, and has only one mounting surface parallel to the heater chip mounting surface on the head body. A thermocompression processing head characterized by having a heater chip holder.
JP7970888U 1988-06-15 1988-06-15 Pending JPH022837U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7970888U JPH022837U (en) 1988-06-15 1988-06-15

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7970888U JPH022837U (en) 1988-06-15 1988-06-15

Publications (1)

Publication Number Publication Date
JPH022837U true JPH022837U (en) 1990-01-10

Family

ID=31304566

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7970888U Pending JPH022837U (en) 1988-06-15 1988-06-15

Country Status (1)

Country Link
JP (1) JPH022837U (en)

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