JPH0228395Y2 - - Google Patents
Info
- Publication number
- JPH0228395Y2 JPH0228395Y2 JP1981087598U JP8759881U JPH0228395Y2 JP H0228395 Y2 JPH0228395 Y2 JP H0228395Y2 JP 1981087598 U JP1981087598 U JP 1981087598U JP 8759881 U JP8759881 U JP 8759881U JP H0228395 Y2 JPH0228395 Y2 JP H0228395Y2
- Authority
- JP
- Japan
- Prior art keywords
- container
- firing
- silicon carbide
- graphite
- lid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Furnace Charging Or Discharging (AREA)
Description
【考案の詳細な説明】
本考案は基板上に塗布された化合物半導体薄膜
を焼結させる際に用いて最適な焼成用容器に関す
るものであり、特に比較的大面積の基板を熱処理
する場合にその効果を発揮するものである。[Detailed description of the invention] The present invention relates to a sintering container that is optimal for use in sintering a compound semiconductor thin film coated on a substrate, and is particularly useful when heat-treating a relatively large-area substrate. It is effective.
化合物半導体、たとえばCdSやCdTeなどの焼
結膜は単独で、或は複合層として光導電素子、光
増幅器、光起電力素子などに用いられる。このよ
うな焼結膜は通常CdSなどの高純度微粉末を融剤
としてのCdCl2やその他の微量添加物とともにガ
ラスや磁器基板上に塗布、乾燥したのち、N2な
どの不活性ガスを主体とした雰囲気中で焼成して
作られる。この場合、融剤としてのCdCl2は高温
では揮発性があり、雰囲気中のCdCl2濃度が得ら
れた焼結膜の性質を左右するので、焼成は通常容
器中で行なわれる。 Sintered films of compound semiconductors, such as CdS and CdTe, are used alone or as composite layers in photoconductive devices, optical amplifiers, photovoltaic devices, and the like. Such sintered films are usually made by applying high-purity fine powder such as CdS together with CdCl 2 as a fluxing agent and other trace additives onto a glass or porcelain substrate, drying it, and then applying an inert gas such as N 2 as the main agent. It is made by firing in a warm atmosphere. In this case, the calcination is usually carried out in a container, since CdCl 2 as a flux is volatile at high temperatures and the CdCl 2 concentration in the atmosphere influences the properties of the resulting sintered film.
このような焼成容器としては、従来緻密なアル
ミナ磁器で作られた容器が一般に用いられてい
た。それはアルミナ磁器は焼結膜を特性を損う不
純物が少いこと、腐食性の強いCdCl2蒸気に耐え
ること、空孔率が小さく汚染されにくいことなど
の理由による。 Conventionally, containers made of dense alumina porcelain have generally been used as such firing containers. This is because alumina porcelain has fewer impurities that impair the properties of the sintered film, can withstand highly corrosive CdCl 2 vapor, and has a small porosity and is less susceptible to contamination.
しかし、基板の寸法が300〜500mm以上の大型基
板を焼成したい場合にはアルミナ磁器製容器には
次のような大きな問題が発生する。まず、そのよ
うな焼成容器を作ること自体、極めて難しく、非
常に高価なものとなる。しかし更に根本的な問題
はアルミナ磁器が耐熱衝撃性が小さいため、加熱
による破損を避けるためには昇温速度を極端に遅
くせざるを得ず、トンネル炉による焼成の場合、
焼結膜の特性と生産性の両面において相当の制約
を受けるということである。 However, when it is desired to fire a large substrate with a size of 300 to 500 mm or more, the following major problem occurs with the alumina porcelain container. First, making such a firing container itself is extremely difficult and extremely expensive. However, a more fundamental problem is that alumina porcelain has low thermal shock resistance, so in order to avoid damage due to heating, the heating rate must be extremely slow, and when firing in a tunnel furnace,
This means that there are considerable limitations in terms of both the properties and productivity of the sintered film.
またアルミナ磁器は熱伝導性が小さいため、容
器が大型になると内部の昇温の遅れが甚しく、焼
成すべき基板に精度の良い熱処理を加えることが
難しいばかりでなく、基板の中央部と周辺部とで
甚だしい焼成むらが起り、特性の不均一となつて
あらわれることも大きな問題である。そのほか容
器の寸法精度をあげにくいとか、重量が大となり
取扱いにくいというような問題も発生する。 In addition, alumina porcelain has low thermal conductivity, so when the container becomes large, there is a significant delay in temperature rise inside the container, which not only makes it difficult to apply accurate heat treatment to the substrate to be fired, but also makes it difficult to heat the substrate in the center and surrounding areas. Another major problem is that severe unevenness in firing occurs between parts, resulting in non-uniform properties. Other problems also arise, such as difficulty in improving the dimensional accuracy of the container and the large weight of the container, making it difficult to handle.
本考案はこのような点に鑑みて成されたもので
あり、上記した問題点を除去した焼成用容器を提
供するものである。本考案の焼成用容器は、高密
度黒鉛よりなる浅い箱形の容器と、この箱形容器
とゆるく嵌合する同材質の蓋とからなり、少なく
とも箱形容器の内壁面および内部底面と蓋の内側
とが炭化ケイ素薄膜で被覆されているものであ
る。この薄膜が目的とするところは、黒鉛微粉の
脱落による半導体焼結膜の汚染の防止と焼成用容
器の耐久性の向上にある。本考案の焼成用容器の
形状は、図面にその断面を示すように浅い箱形の
容器1と、それにゆるく嵌合する蓋2より成る。
蓋2には必要により1個またはそれ以上の細孔3
を設ける。また4は炭化ケイ素の薄膜であつて、
容器の全表面を被覆した例を示す。5は焼成すべ
き基板である。黒鉛は熱伝導性、耐熱衝撃性とも
アルミナ磁器にくらべ桁ちがいに大きく、また硬
度が高くないため機械加工は容易で寸法精度も出
しやすく、更にCdCl2などに対する耐蝕性も大き
いというすぐれた特長をもつている。また耐酸化
性についてもCdSの焼成が行なわれる600℃程度
までは十分あり、また通常CdSの焼成はN2を主
体とするガス中で行なわれるためあまり問題は起
らない。しかし、黒鉛の容器は取扱いの際に微粉
が付着したり加熱・冷却の過程で微粉が脱落した
りする危険を伴うので、本考案の炭化ケイ素薄膜
で少なくとも容器1の内壁面および内部底面と蓋
2の内側との内側とを被覆した黒鉛容器を用いれ
ばこのような問題の発生防止に極めて有効であ
る。 The present invention has been made in view of these points, and is intended to provide a baking container that eliminates the above-mentioned problems. The baking container of the present invention consists of a shallow box-shaped container made of high-density graphite and a lid made of the same material that loosely fits into the box-shaped container, and the lid is connected to at least the inner wall surface and inner bottom surface of the box-shaped container. The inside is coated with a silicon carbide thin film. The purpose of this thin film is to prevent contamination of the semiconductor sintered film due to shedding of fine graphite powder and to improve the durability of the firing container. The shape of the baking container of the present invention consists of a shallow box-shaped container 1 and a lid 2 that loosely fits into the container, as shown in the cross section in the drawing.
The lid 2 has one or more pores 3 as required.
will be established. Further, 4 is a thin film of silicon carbide,
An example is shown in which the entire surface of the container is coated. 5 is a substrate to be fired. Graphite's thermal conductivity and thermal shock resistance are orders of magnitude higher than that of alumina porcelain, and since it is not hard, it is easy to machine and achieve dimensional accuracy, and it also has excellent corrosion resistance against CdCl 2 etc. I have it too. In addition, the oxidation resistance is sufficient up to about 600°C, which is the temperature at which CdS is fired, and since CdS is usually fired in a gas mainly composed of N 2 , there are no problems. However, since there is a risk of fine powder adhering to graphite containers during handling or falling off during heating and cooling processes, the silicon carbide thin film of the present invention is applied to at least the inner wall surface and inner bottom surface of the container 1 and the lid. It is extremely effective to prevent such problems from occurring if a graphite container is coated on both the inside and the inside.
本考案の焼成用容器は黒鉛ブロツクからの機械
的加工によるほか、コークス微粒子とピツチとの
〓合物を加圧成型したのち、焼成、ピツチ含浸、
焼成、黒鉛化し表面被覆する方法によつても製造
することが出来る。 The firing container of the present invention is not only manufactured by mechanical processing from a graphite block, but also by pressure-molding a mixture of fine coke particles and pitch, followed by firing, pitch impregnation, etc.
It can also be produced by firing, graphitizing, and surface coating.
炭化ケイ素により被覆する方法としては、黒鉛
製焼成用容器を1200℃以上の高温に加熱してお
き、四塩化ケイ素、メチルトリクロルケイ素、ジ
メチルジクロルケイ素などケイ素を含有する気体
を、必要により、メタン、プロパン、アセチレン
などの気体状炭化水素と混合した状態で水素ガス
をキヤリヤーガスとして通ずることにより、黒鉛
表面において熱分解により炭化ケイ素を生成し、
被膜を形成せしめる方法が推奨される。このよう
な処理により、黒鉛表面に炭化ケイ素の被膜が形
成されると、焼成用容器に接触した時黒鉛微粉末
が付着したり、また加熱冷却過程で黒鉛微粉末が
脱落して内容物を汚染するのを防止することが出
来る。 The method for coating with silicon carbide is to heat a graphite firing container to a high temperature of 1200°C or higher, and then add silicon-containing gas such as silicon tetrachloride, methyltrichlorosilicon, dimethyldichlorosilicon, etc. to methane if necessary. By passing hydrogen gas as a carrier gas in a state mixed with gaseous hydrocarbons such as propane and acetylene, silicon carbide is generated by thermal decomposition on the graphite surface,
A method of forming a film is recommended. When a silicon carbide film is formed on the surface of graphite through such treatment, fine graphite powder may adhere to the firing container when it comes into contact with it, or fall off during the heating and cooling process, contaminating the contents. It is possible to prevent this from happening.
またこのような処理により黒鉛の表面層の気孔
が炭化ケイ素で充填されるため、半導体焼結膜焼
成中に発生するCdCl2蒸気が黒鉛空孔中に拡散
し、蓄積するのを軽減することが出来る。 In addition, as this treatment fills the pores in the surface layer of graphite with silicon carbide, it is possible to reduce the diffusion and accumulation of CdCl 2 vapor generated during the firing of the semiconductor sintered film into the graphite pores. .
次に、本考案の一実施例について述べる。 Next, an embodiment of the present invention will be described.
空孔率15%灰分含有率900ppmの高密度黒鉛ブロ
ツクを研削加工して外形寸法が360×360×45mmで
図面に示す構造の焼成用容器(但し、炭化ケイ素
被覆形成前の状態)を作製した。次にジメチルジ
クロルケイ素を2vol%添加した水素気流中におい
て、黒鉛焼成容器を1450℃に加熱し、表面に炭化
ケイ素を沈着せしめ、炭化ケイ素被覆した焼成容
器を作製した。A high-density graphite block with a porosity of 15% and an ash content of 900 ppm was ground to produce a firing container with external dimensions of 360 x 360 x 45 mm and the structure shown in the drawing (however, before silicon carbide coating was formed). . Next, the graphite firing container was heated to 1450°C in a hydrogen stream containing 2 vol% of dimethyldichlorosilicon to deposit silicon carbide on the surface, producing a silicon carbide-coated firing container.
次に、純度99.99%のCdS微粉末100gCdCl210
g、プロピレングリコール30gよりなるペースト
をスクリーン印刷法により300×300×3mmのホウ
ケイ酸ガラス基板上に塗布し、120℃で3時間乾
燥した。この基板を上記の焼成用容器に入れ全長
4mのトンネル炉を通過させた。最高温度は650
℃、雰囲気はN299%、O21%であつた。この焼成
条件により得られたCdS焼結膜は黄色半透明で欠
陥のないものであり、導電性が大きく、CdS−
Cu2S系およびCdS−CdTe系太陽電池用として適
することがわかつた。 Next, 100g of CdS fine powder with a purity of 99.99%CdCl 2 10
A paste consisting of 1 g and 30 g of propylene glycol was applied onto a 300 x 300 x 3 mm borosilicate glass substrate by screen printing and dried at 120°C for 3 hours. This substrate was placed in the above-mentioned firing container and passed through a tunnel furnace having a total length of 4 m. Maximum temperature is 650
℃, and the atmosphere was 99% N 2 and 1% O 2 . The CdS sintered film obtained under these firing conditions is yellow and translucent, free from defects, highly conductive, and CdS−
It was found that it is suitable for Cu 2 S-based and CdS-CdTe-based solar cells.
比較のため、上記実施例において、炭化ケイ素
による被覆を行なわず、他は実施例と同一条件と
した場合には、容器の取扱いの際に手が黒く汚
れ、また得られたCdS焼結膜の面にはところどこ
ろに褐色や黒色の斑点があらわれ、その部分は光
透過率や導電性が不十分で上記の太陽電池用とし
て適当でないことがわかつた。 For comparison, in the above example, when the coating with silicon carbide was not performed and the other conditions were the same as in the example, hands were stained black when handling the container, and the surface of the obtained CdS sintered film was Brown or black spots appeared here and there, and it was found that these areas had insufficient light transmittance and conductivity, making them unsuitable for use in the solar cell described above.
以上の説明から明らかなように本考案にる焼成
用容器を用いることにより大面積ですぐれた特性
を化合物半導体薄膜が得られる。なお、上記実施
例においてはCdS膜の焼成について記したが、本
考案の焼成用容器はCdSe、CdTe、ZnS、ZnSe
あるいはそれらの固溶体についても同様に適用す
ることが出来る。 As is clear from the above description, by using the firing container according to the present invention, a compound semiconductor thin film having a large area and excellent properties can be obtained. Although the above embodiment describes the firing of a CdS film, the firing container of the present invention can be used for CdSe, CdTe, ZnS, and ZnSe.
Alternatively, the same can be applied to solid solutions thereof.
図面は本考案の焼成用容器の一実施例を示す断
面図である。
1……容器本体、2……蓋、3……小孔、4…
…炭化ケイ素薄膜、5……焼成すべき基板。
The drawing is a sectional view showing an embodiment of the baking container of the present invention. 1... Container body, 2... Lid, 3... Small hole, 4...
...Silicon carbide thin film, 5...Substrate to be fired.
Claims (1)
器とゆるく嵌合する同材質の蓋からなり、前記容
器と前記蓋の内側および外側の全表面が炭化ケイ
素薄膜で被覆されてなることを特徴とする焼成用
容器。 It consists of a shallow box-shaped container made of high-density graphite and a lid made of the same material that fits loosely with the container, and the entire inner and outer surfaces of the container and the lid are coated with a silicon carbide thin film. Container for firing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1981087598U JPH0228395Y2 (en) | 1981-06-15 | 1981-06-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1981087598U JPH0228395Y2 (en) | 1981-06-15 | 1981-06-15 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57200027U JPS57200027U (en) | 1982-12-20 |
| JPH0228395Y2 true JPH0228395Y2 (en) | 1990-07-30 |
Family
ID=29882799
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1981087598U Expired JPH0228395Y2 (en) | 1981-06-15 | 1981-06-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0228395Y2 (en) |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57188822A (en) * | 1981-05-15 | 1982-11-19 | Matsushita Electric Ind Co Ltd | Vessel for baking |
-
1981
- 1981-06-15 JP JP1981087598U patent/JPH0228395Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS57200027U (en) | 1982-12-20 |
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