JPH02290027A - Semiconductor device - Google Patents

Abstract

PURPOSE:To obtain semiconductor devices having identical characteristics by arranging a dummy wiring in the vicinity of a specified signal wiring and in parallel therewith. CONSTITUTION:In the vicinity of a signal wiring 2 of an Al film having designed specification minimum width, a dummy wiring 3 (which is not connected with a decoding circuit 5 and an I/O pad 4) of an Al film of the same width is arranged. The interval between them is set nearly equal to the minimum width capable of etching. By this constitution, in the adjacency of an arbitrary signal wiring, any one of the other signal wiring 2, a power supply wiring 1, and the dummy wiring 3 always exists, so that the width of the signal wiring is uniformized, and semiconductor devices having identical characteristics can be obtained.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a semiconductor device, and more particularly to a semiconductor device in which wiring having a design standard minimum width over a long distance is arranged.

[Conventional technology]

FIG. 2 shows a schematic plan view of the semiconductor device.

Conventionally, when laying out a semiconductor device, each functional block was connected with metal wiring such as an aluminum film. At that time, the signal wiring 2 having the minimum width of the design standard was sometimes arranged over a long distance over a wide field area. Reference numeral 1 denotes a power supply wiring connected to the decoding circuit section 5, which is made of a metal film having a wider width than the signal wiring 2.

[Problem to be solved by the invention]

In the conventional semiconductor device described above, signal wiring with the minimum width of the design standard is arranged over a long distance in a wide field area, so it is extremely difficult for the width of the signal wiring to become narrow during etching in the manufacturing process for pattern formation. In some cases, it may dissolve and disappear. Alternatively, depending on the type and conditions of etching, it may become thicker. In any case, if there is no other wiring nearby, there is a drawback that the reproducibility of the process will be poor.

[Means to solve the problem]

In the semiconductor device of the present invention, dummy wires made of the same material are arranged in parallel to and near predetermined signal wires.

〔Example〕

Next, the configuration of the present invention will be explained with reference to the drawings.

FIGS. 1A and 1B are a schematic plan view and a partially enlarged plan view showing an embodiment of the present invention, respectively.

Signal wiring 2 made of aluminum film with the minimum width of the design standard
A tummy wiring 3 (not connected to either the code circuit 5 or the input/output pad 4) made of an aluminum film and having the same width in design is arranged in parallel near the . The distance between the two is set to the minimum width that can be etched. Compared to the conventional example in which there is no tummy wiring near one side of the signal wiring 2, there is less risk of the finished width being thin (or thick) during etching. The signal wiring for which it is necessary to arrange such a dummy wiring in the vicinity is limited to one in which there is no other signal wiring or power supply wiring in the vicinity.

Note that the tummy wiring may be in a floating state in terms of potential, but it may also be connected to a power supply wiring or the like and fixed at a certain potential.

〔Effect of the invention〕

As explained above, the present invention is capable of arranging dummy wiring in parallel near a predetermined signal wiring, thereby making it possible to connect other signal wiring, power supply wiring, or tummy wiring adjacent to any signal wiring. Since some of the wirings are present, the width of the signal wirings becomes uniform, which has the effect of providing a semiconductor device with uniform characteristics.

[Brief explanation of drawings]

1A and 1B are a schematic plan view and a partially enlarged plan view showing an embodiment of the present invention, respectively, and FIG. 2 is a schematic plan view showing a conventional example. 1... Power wiring, 2... Signal wiring, 3... Dummy wiring, 4... Input/output pad, 5... Decode circuit section.

Claims (1)

[Claims] A semiconductor device characterized in that a dummy wiring made of the same material is arranged in parallel near a predetermined signal wiring.