JPH02292165A - Cutting method for brittle material - Google Patents

Abstract

PURPOSE:To cut a large sized brittle material by a wire saw by executing cutting while feeding a work liquid containing abrasive grains to a cutting face wire row and an auxiliary wire row. CONSTITUTION:A member 1 to be cut is pushed up by a lift device, pressed to a wire 4 row which travels at high speed in one direction and is hung on four grooved rollers 3, simultaneous and numerous cutting is performed and the auxiliary wire 7 hung on four separately provided grooved rollers 6 travels inside a cutting groove by forming a pair with the cutting wire 4. While under this cutting, due to a work liquid being fed from the respective work liquid feeding nozzles 5, 8 to the cutting wire 4 row and auxiliary wire 7 row, a mixture liquid 11 having fluidity mixed with abrasive grains, cutting chips and oil is filled up between the cutting wire 4 and auxiliary wire and at the upper part of the auxiliary wire 7 the sediment 12 of the abrasive grain and chip is filled up. The deterioration of the cutting efficiency and cutting accuracy can thus be evaded.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application This invention relates to a technique for cutting so-called large brittle materials such as marble, ceramics, and magnetic materials with a wire. The present invention relates to a cutting method using a wire-type cutting device, in which a machining fluid containing abrasive grains is supplied to the part while pressing the part to cut the part.

Conventional technology Wire cutting devices (generally called wire saws) basically cut the workpiece by pressing it against a moving wire, and the wire is passed between multiple guide rollers. The wires are stretched parallel to each other at arbitrarily set intervals, and the workpiece to be cut is pressed against the row of wires while a machining liquid containing abrasive grains is supplied to the wire row, thereby causing a so-called lapping action and cutting.

A wire saw of this type includes a method in which the wire is fed out and wound in one direction while the wire runs back and forth (Japanese Patent Publication No. 52-12954, Japanese Unexamined Patent Publication No. 52-982).
91, etc.) and a method in which the wire is run at high speed in one direction (Japanese Patent Application Laid-open No. 117060/1983), which mainly cuts so-called small brittle materials such as semiconductor materials and magnetic materials into wafer shapes. It has been adopted.

On the other hand, the above-mentioned wire saw is not applicable to large brittle materials such as marble and ceramics (cutting width exceeding 250 m or 300 m, for example), and free abrasive grains or fixed abrasive grains are used to cut these large materials. The mainstream is a pando saw, a so-called endless annular band saw in which fixed abrasive grains are fixed to a band saw, an edged straight reciprocating band saw, and a so-called OD saw in which saw teeth are provided on the outer periphery of a metal disc.

Here, the reason why wire saws are not used for cutting large brittle materials is that wires with diamond abrasive particles fixed to the surface of the wire or coated with high hardness materials such as diamond are generally very expensive. Wire saws that cut the wire by running it at high speed in one direction are superior to reciprocating wire saws in terms of cutting efficiency and cutting accuracy. However, conventional wire saws, both reciprocating type and unidirectional high speed type, have difficulties in supplying and discharging abrasive grains and ejecting cutting chips, and the longer the cutting section, the greater the wear of the abrasive grains. This method is not applicable to cutting large brittle materials mainly because the cutting ability decreases and saw marks are likely to occur.

Incidentally, in recent years, natural ultra-thin stones such as marble are used as interior products such as wall materials and floor materials of buildings, hotel front desks, etc., and ceramics as high-strength heat-resistant materials and electronic materials have become large-area thin sheets. It has been desired to develop cutting methods and equipment that are efficient, have high yields, and have high precision.

On the other hand, the method of cutting by running a wire at high speed in one direction has excellent effects such as high efficiency, high yield, high precision, and low processing cost.
In the case of marble, etc., which exceeds m, the cutting groove is narrow and long, so as mentioned above, it is difficult to supply and discharge abrasive grains and discharge chips, and abrasive grains and chips accumulate in the groove, causing the abrasive grains to There is a problem that the cutting accuracy is reduced due to insufficient supply.

Therefore, if this problem were solved, it would be possible to cut large brittle materials with a unidirectional high-speed traveling wire saw, but the reality is that a solution to this problem has not yet been found.

Problems to be Solved by the Invention In view of the above-mentioned circumstances, this invention has been developed to improve cutting efficiency and cutting accuracy by taking advantage of the wire saw's advantages of high efficiency and small cutting allowance and high yield due to multiple simultaneous cuts. The purpose of this paper is to propose a cutting method that allows easy cutting of large brittle materials using a wire saw that travels in one direction at high speed.

Means for Solving the Problems The present invention provides an auxiliary wire in addition to the cutting wire as a means to solve the above-mentioned problems in the unidirectional high-speed wire cutting device, that is, the difficulty in supplying and discharging abrasive grains and discharging chips. The auxiliary wire is arranged in pairs with the cutting wire and the cutting is performed while running.The auxiliary wire row is arranged at intervals in pairs with the cutting wire row inside the cutting wire row, The gist of this method is to perform cutting while supplying a machining liquid containing abrasive grains to a cutting wire array and an auxiliary wire array.

Operation Cutting using a unidirectional high-speed wire-type cutting device is a unidirectional high-speed cutting process in which groove rollers with a large number of guide grooves are arranged parallel to each vertex of a triangle or quadrilateral, and the groove rollers are stretched between the groove rollers. In this method, cutting is performed by supplying a machining fluid containing abrasive grains to the cutting section from a machining fluid supply nozzle while pressing the workpiece fixed on an elevating material fixing table against a group of traveling wires. By running the auxiliary wire row arranged in pair with the wire row inside the wire row directly above the cutting wire row in the cutting groove, abrasive grains are sufficiently supplied to the cutting part, and the abrasive grains in the cutting groove are Machining fluid containing abrasive grains is supplied to the cutting wire row and auxiliary wire row from separate machining fluid supply nozzles, which facilitates the discharge of abrasive grains and chips and prevents them from accumulating in the cutting groove. be done.

Embodiment Figure 1 is a schematic diagram showing an example of the configuration of an apparatus for carrying out the method of the present invention, Figure 2 is a schematic diagram showing an enlarged view of the machining fluid supply section of the same apparatus, and Figure 3 is a diagram illustrating cutting by the same apparatus. This is an enlarged vertical sectional side view showing an intermediate state. Here, a wire saw having four grooved rollers will be described as an example.

(1) is a member to be cut, (2) a device for lifting and lowering the member to be cut, and (3
) is a cutting wire groove roller with many grooves on the circumference, (4) is a cutting wire, (5) is a machining fluid supply nozzle to a row of cutting wires, and (6) is an auxiliary wire. Mizoguchi-
(7) is an auxiliary wire, and (8) is a nozzle for supplying machining liquid to the auxiliary wire row. The cutting wire Mizoguchi roller (3) is installed as if it were running.
and the groove roller (6) of the auxiliary wire are each driven by a motor (
M+) and a motor (M2).

In the unidirectional high-speed wire cutting device configured as described above, the member to be cut (1) is pushed up by the lifting device (2),
Multiple cuts are performed simultaneously by being pressed against a row of wires (4) running at high speed in one direction, which are cut by four groove rollers (3), and four groove groove rollers (6) installed separately. ) is hung on the cutting wire (4) and travels in the cutting groove in pair with the cutting wire (4).

During cutting, machining fluid is supplied to the cutting wire row and the auxiliary wire row from the respective machining fluid supply nozzles (5x8), so the cutting wire (4) and the auxiliary wire are A fluid mixture (11) of abrasive grains, chips, and oil is filled between the wire (7) and a deposit of abrasive grains and chips (11) above the auxiliary wire (force).
2) is full.

That is, if there is no auxiliary wire (7), the deposit (12
), the abrasive grains are not sufficiently brought into the cutting section, but in this invention, the machining liquid is also supplied from the auxiliary wire (7), so the abrasive grains are brought in well, and the cutting wire (4
) and the auxiliary wire (force) are filled with the mixed liquid (11).Therefore, cutting efficiency and cutting accuracy will not deteriorate.

In addition, although the case where the running direction of the auxiliary wire (7) is the same direction as the cutting wire (4) is shown here, it is also possible to run in the opposite direction. When running in the opposite direction, the machining fluid supply nozzle (8) to the auxiliary wire is arranged on the inlet, outlet side, or only on the outlet side of the cutting wire. Further, the cutting wire (4) and the auxiliary wire (7) are fed in one direction from the start to the end of cutting.

The running speeds of both wires do not need to be the same, and the auxiliary wire may have a lower speed. Furthermore, the wires used do not necessarily have to be of the same diameter; it is preferable that the auxiliary wire be slightly thinner than the cutting wire, and that the surface of the wire be textured, roughened, or spirally grooved. Improves the effect of bringing in machining fluid.

FIG. 4 is a diagram that does not show the operating method of the wire cutting device.
In a), when the running speed of the cutting wire (4) and the auxiliary wire (7) are kept constant during the cutting process, in (b), the length of the wire is shorter than in the case of (a), and the wire is cut during cutting. (C) is an example of the operation method when the auxiliary wire is short, and (d) is an example of the operation method when the cutting wire traveling speed and the auxiliary wire traveling speed are the same in (a). Regardless of which operating method is adopted, the effect of supplying machining fluid by the auxiliary wire remains the same.

Table 1 shows the application of this invention to an actual machine with 1000# square x 40
0. The result when a length of marble is cut into a thickness of 6 m is shown below.
This is a comparison with cutting with a conventional large-diameter blade.

As is clear from Table 1, the conventional blade method
．． In contrast to the cutting rate of 2 pieces/hour, the cutting efficiency of the present invention is as high as 10 to 11 pieces/hour, and the yield is 31.5% of the conventional rate.
to 90%, and a product with a smooth surface and good flatness was obtained.

Effects of the Margin Invention As explained above, according to the method of this invention, the machining fluid can be replenished by the auxiliary wire, so it is possible to cut large brittle materials with a wire saw, such as marble with a side of more than 1 m. However, a unidirectional high-speed running wire saw can simultaneously cut a large number of sheets with high efficiency and precision, which can greatly contribute to the production of thin plates and large-area brittle materials.

[Brief explanation of drawings]

FIG. 1 is a schematic diagram showing an example of the configuration of a unidirectional traveling type device for carrying out the present invention, FIG. 2 is a schematic diagram showing an enlarged view of the machining fluid supply section of the same wire-type cutting device, and FIG. A longitudinal side view showing an enlarged view of the state in the middle of cutting by the same wire type cutting device as above, and illustrating the operating method of the fourth same as above wire type cutting device, (a) shows the cutting wire and the auxiliary wire during the cutting process. When the running speed is constant, (b) the wire length is shorter than (a), and when the wire travel is reversed in the middle of cutting, (C) when the auxiliary wire is short, (d ) shows the case where the cutting wire running speed and the auxiliary wire running speed are the same in (a). 1... Member to be cut 3, 6... Groove roller 4.
... Cutting wires 5, 8 ... Processing liquid supply nozzle 7 ... Auxiliary wire Applicant: Nippon Spindle Mfg. Co., Ltd. Sumitomo Metal Industries, Ltd. 1 Gloss Figure 2 Figure 3 Low wire running speed Wire running speed Wire running Speed wire running speed procedure amendment (method) September 20, 1999

Claims (1)

[Claims] In a method of cutting a wire row stretched at predetermined intervals in one direction at high speed and pressing a member to be cut against the wire row, a machining fluid containing abrasive grains is supplied to the part concerned, wherein the cutting A brittle method characterized in that an auxiliary wire row is arranged at intervals inside the wire row so as to form a pair with a cutting wire row, and cutting is performed while supplying a machining liquid containing abrasive grains to the cutting wire row and the auxiliary wire row. Material cutting method.