JPH0229565U - - Google Patents
Info
- Publication number
- JPH0229565U JPH0229565U JP10777588U JP10777588U JPH0229565U JP H0229565 U JPH0229565 U JP H0229565U JP 10777588 U JP10777588 U JP 10777588U JP 10777588 U JP10777588 U JP 10777588U JP H0229565 U JPH0229565 U JP H0229565U
- Authority
- JP
- Japan
- Prior art keywords
- type
- board
- fixed
- pins
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims description 2
- 238000007796 conventional method Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図はこの考案の一実施例による実装された
ＤＩＰ型ＩＣの正面図と側面図、第２図は使用状
態における基板上面より見た図と側面図、第３図
は従来方法によるスルーホール挿入型と面実装ラ
ンド型の断面図である。
１はＤＩＰ型ＩＣ、２は基板、５ａ，５ｂは接
着剤。なお、図中、同一符号は同一、又は相当部
分を示す。
Fig. 1 is a front view and a side view of a DIP type IC mounted according to an embodiment of this invention, Fig. 2 is a view from the top of the board and a side view in a state of use, and Fig. 3 is a through hole formed by a conventional method. FIG. 3 is a cross-sectional view of an insertion type and a surface mount land type. 1 is a DIP type IC, 2 is a substrate, and 5a and 5b are adhesives. In addition, in the figures, the same reference numerals indicate the same or equivalent parts.
Claims (1)
Ｐ型ＩＣをそのピンを基板に対して上向きにした
状態で接着剤にて基板に固定すると共に、上記ピ
ンに所要の配線を固定したことを特徴とするＤＩ
Ｐ型ＩＣ実装構造。 In a substrate for configuring an electronic circuit, DI
A DI characterized in that a P-type IC is fixed to a board with an adhesive with its pins facing upward with respect to the board, and required wiring is fixed to the pins.
P-type IC mounting structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10777588U JPH0229565U (en) | 1988-08-16 | 1988-08-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10777588U JPH0229565U (en) | 1988-08-16 | 1988-08-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0229565U true JPH0229565U (en) | 1990-02-26 |
Family
ID=31342494
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10777588U Pending JPH0229565U (en) | 1988-08-16 | 1988-08-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0229565U (en) |
-
1988
- 1988-08-16 JP JP10777588U patent/JPH0229565U/ja active Pending
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