JPH0229685A - Terminal electrode - Google Patents
Terminal electrodeInfo
- Publication number
- JPH0229685A JPH0229685A JP63179558A JP17955888A JPH0229685A JP H0229685 A JPH0229685 A JP H0229685A JP 63179558 A JP63179558 A JP 63179558A JP 17955888 A JP17955888 A JP 17955888A JP H0229685 A JPH0229685 A JP H0229685A
- Authority
- JP
- Japan
- Prior art keywords
- terminal electrode
- liquid crystal
- terminal electrodes
- terminal
- crystal panel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
Landscapes
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Liquid Crystal (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Multi-Conductor Connections (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
産業上の利用分野
本発明は液晶パネル等における端子電極、とりわけ高密
度な多数本の端子電極に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to terminal electrodes in liquid crystal panels and the like, particularly to a large number of high-density terminal electrodes.
従来の技術
微細加工技術、液晶材料および実装技術等の進歩によシ
、2〜6インチ穆度の小さな画面サイズであるが液晶パ
ネルで実用上支障ないテレビジョン画面が商業ペースで
得られるようになってきた。Conventional technology Advances in microfabrication technology, liquid crystal materials, packaging technology, etc. have made it possible to obtain television screens with a small screen size of 2 to 6 inches, but with no practical problems with liquid crystal panels, at a commercial pace. It has become.
液晶パネルを構成する2枚のガラス板の一方にRGHの
着色層を形成しておくことによりカラー表示も容易に実
現され、また画素毎にスイッチング素子を内蔵させた言
わゆるアクティブ型の液晶パネルではクロストークもな
くかつ高いコントラスト比を有する画像が確保されてい
る。By forming an RGH colored layer on one of the two glass plates that make up the liquid crystal panel, color display can be easily realized, and in so-called active type liquid crystal panels that have a built-in switching element in each pixel, An image without crosstalk and with a high contrast ratio is ensured.
このような液晶パネルは走査線としては120〜240
本、信号線としては240〜720本程度のマトリクス
編成が標準的であり、数百本の電極線が必要とされる。Such a liquid crystal panel has 120 to 240 scanning lines.
A matrix arrangement of approximately 240 to 720 signal lines is standard, and several hundred electrode lines are required.
画像表示機能を有する液晶パネルの端子電極に数百本の
配線を接続する手段が実装であって、例えば第3図に示
すように液晶パネル1を構成する一方のガラス板2上に
形成された走査線と信号線の端子電極3,4群に、ポリ
イミド系樹脂薄膜をベースとし金メッキされた銅箔の接
続部5を有する接続フィルム6を圧接しながら接着剤で
硬化することが実施されている。更に進んだ形としては
第4図に示すように端子電極3′、4′群に駆動信号を
供給する半導体集積回路チップ7を直接圧接しながら接
着剤で固定するC0G(チップ・オン・ガラス)方式が
あり、接続フィルム6(第3図参照)を使わないで実装
工程のコストを下げる。あるいは実装の高密度化を推進
させる目的で導入が計られている。なお第3図および第
4図において、8は液晶パネル1を構成するもう1枚の
ガラス板であり1着色層を有するものはカラーフィルタ
と呼ばれる。9,1oは液晶パネル1の中心部に位置す
る画像表示部と、走査線と信号線の端子電極3,4また
は3′、4′との間を接続する配線路で、必らずしも端
子電極3.4または3’、4’と同じ導電材で構成され
る必要はないが、−船釣な単純マトリクス型の液晶パネ
ルでは透明導電性の例えばITOで端子電極3,4また
は3′、4′と配線路9.10で同時に形成されている
。Mounting is a means for connecting several hundred wires to terminal electrodes of a liquid crystal panel having an image display function, and is formed on one glass plate 2 constituting a liquid crystal panel 1, for example, as shown in FIG. A connection film 6 based on a polyimide resin thin film and having a connection portion 5 of gold-plated copper foil is pressed onto the terminal electrodes 3 and 4 of the scanning line and signal line, and is cured with an adhesive. . A more advanced form is C0G (chip on glass), in which a semiconductor integrated circuit chip 7 that supplies drive signals to terminal electrodes 3' and 4' is directly pressed and fixed with adhesive, as shown in Figure 4. There is a method to reduce the cost of the mounting process without using the connection film 6 (see Fig. 3). Alternatively, it is planned to be introduced for the purpose of promoting higher density implementation. In FIGS. 3 and 4, reference numeral 8 denotes another glass plate constituting the liquid crystal panel 1, which has one colored layer and is called a color filter. Reference numerals 9 and 1o denote wiring paths that connect the image display section located at the center of the liquid crystal panel 1 and the terminal electrodes 3 and 4 or 3' and 4' of the scanning lines and signal lines, and are not necessarily connected. Although it is not necessary that the terminal electrodes 3.4 or 3', 4' be made of the same conductive material, in a simple matrix type liquid crystal panel used on a boat, the terminal electrodes 3, 4 or 3' are made of a transparent conductive material such as ITO. , 4' and wiring paths 9 and 10 are formed simultaneously.
発明が解決しようとする課題
実装技術で重要な役割を担う接着刷には周知のととく熱
硬化型のものと紫外線硬化型のものの2種類がある。熱
硬化型の接着剤の場合には端子電極の導電材に関して特
別な制約はなく、むしろ液晶パネルの耐熱性が問題とな
る。染料または顔料のいずれか一方もしくは両者を含む
有機薄膜よりなる着色層は液晶とともに160℃を越え
る加熱に対しては耐えられず、液晶パネルの光学特性が
損なわれてしまう。したがって100℃以下の加熱処理
か高温の場合ては処理時間を短かくするなどの対策が必
要であるが、接着剤の硬化度が上らず、耐湿性の確保に
難点を残さざるを得ない。Problems to be Solved by the Invention There are two well-known types of adhesive printing presses that play an important role in mounting technology: a thermosetting type and an ultraviolet curing type. In the case of thermosetting adhesives, there are no special restrictions regarding the conductive material of the terminal electrodes, but rather the heat resistance of the liquid crystal panel becomes a problem. A colored layer made of an organic thin film containing either a dye or a pigment, or both, together with liquid crystal, cannot withstand heating exceeding 160° C., and the optical properties of the liquid crystal panel are impaired. Therefore, it is necessary to take measures such as heat treatment below 100℃ or shortening the treatment time if the temperature is high, but the degree of curing of the adhesive will not increase and there will be difficulties in ensuring moisture resistance. .
これに対して紫外線硬化型の接着剤の場合にはカラーフ
ィルタの耐光性が劣悪で紫外線の選択的照射を必要とし
ない限シむしろ使い易く、生産性の点から考えても秀れ
た性質を持っている。しかしながら紫外線硬化型では第
6図に示すようにガラス基板2の裏面からの紫外線11
の紫外線硬化樹脂12への照射が必須の要件であって、
端子電極3等もITOなどの透明導電性薄膜でなければ
ならない。先述したように単純マトリクス型の液晶パネ
ルでは問題とはならないが、アクティブ型の場合には走
査線の端子電極と信号線の端子電極をITOで同一に構
成することは必らずしも得策ニスアイ示°、−
ではなく1文献(H,Tanaka at al、 S
I Dl 987 Digest pp、 14o
〜120 )にも示されているように工程合理化のため
に走査線側をクロム等の金属とし、信号線側をITOと
する端子電極群編成が採用されると第6図に示すように
紫外線硬化樹脂12は金属製の端子電極13の周辺で硬
化が進行できなくなる。紫外線11の照射方向をガラス
基板2に対して垂直方向のみならずランダムな方向の成
分も加えるとか、紫外線照射時間を長くする、あるいは
照射パワーを上げるとかの工夫によ・り紫外線11の端
子電極13の周辺部での回り込みを増やすことは可能で
あるが、端子電極3(第5図参照)がITOなどの透明
導電性薄膜の場合と同じ硬化度および生産性を得ること
は本質的に不可能であり、またカラーフィルタの劣化を
防ぐだめの対策も不可欠となるといった問題点を有して
いた。なお第5図および第6図において、14は接続フ
ィルム6や半導体チップをガラス基板2に押しつけるだ
めの部材であって、加圧機構については省略する。15
は5i02やSi3N4などの絶縁層で必らずしも端子
電極3,13の直下に位置するとは限らず、開口部によ
って端子電極3,13が露出するデバイスもある。On the other hand, in the case of UV-curable adhesives, the light resistance of the color filter is poor and unless selective irradiation with UV rays is required, they are easier to use and have excellent properties from the viewpoint of productivity. have. However, in the case of the ultraviolet curing type, as shown in FIG.
It is an essential requirement that the ultraviolet curing resin 12 be irradiated with
The terminal electrode 3 and the like must also be made of a transparent conductive thin film such as ITO. As mentioned earlier, this is not a problem with simple matrix type liquid crystal panels, but in the case of active type, it is not necessarily a good idea to configure the terminal electrodes of the scanning line and the terminal electrode of the signal line with the same ITO. 1 reference (H, Tanaka at al, S
I Dl 987 Digest pp, 14o
~120), in order to streamline the process, if a terminal electrode group arrangement in which the scanning line side is made of metal such as chromium and the signal line side is made of ITO is adopted, ultraviolet rays will be removed as shown in Figure 6. The cured resin 12 cannot be cured around the metal terminal electrodes 13. By making the irradiation direction of the ultraviolet rays 11 not only perpendicular to the glass substrate 2 but also adding a component in a random direction, lengthening the ultraviolet irradiation time, or increasing the irradiation power, the terminal electrode of the ultraviolet rays 11 can be Although it is possible to increase the wrapping around the periphery of the terminal electrode 3 (see Figure 5), it is essentially impossible to obtain the same degree of curing and productivity as when the terminal electrode 3 (see Fig. 5) is made of a transparent conductive thin film such as ITO. However, there is a problem in that it is necessary to take measures to prevent deterioration of the color filter. In FIGS. 5 and 6, reference numeral 14 denotes a member for pressing the connection film 6 and the semiconductor chip against the glass substrate 2, and the pressing mechanism will be omitted. 15
is an insulating layer such as 5i02 or Si3N4, and is not necessarily located directly under the terminal electrodes 3, 13, and there are devices in which the terminal electrodes 3, 13 are exposed through openings.
課題を解決するための手段
本発明は端子電極が紫外線に対して不透明な場合でも紫
外線硬化樹脂に十分な光量を与える手段を提供するもの
であり、その具体的手段は金属薄膜よりなる端子電極の
形成時に端子電極をベタとするのではなく、多数の開口
部を有するパターン形状とすることによって達成される
。Means for Solving the Problems The present invention provides a means for providing a sufficient amount of light to an ultraviolet curing resin even when the terminal electrode is opaque to ultraviolet light. This is achieved by forming the terminal electrode into a pattern having a large number of openings instead of forming it solidly.
作用
端子電極に形成された開口部の周辺部には紫外線が回り
込んで近傍の紫外線硬化樹脂が硬化するので、開口部の
数を多くすることと、最適の大きさを与えることによっ
て紫外線硬化樹脂をほぼ全体にわたって硬化させること
ができる。Ultraviolet rays penetrate around the opening formed in the working terminal electrode and harden the UV curable resin in the vicinity, so by increasing the number of openings and giving them an optimal size, the UV curable resin can be cured almost entirely.
実施例
本発明の実施例を、第1図および第2図を参照しながら
説明する。第1図は本実施例における端子電極16のパ
ターン形状を示し、第2図は同パターン形状に対する紫
外線照射時の製造工程断面図を示す。Embodiment An embodiment of the present invention will be described with reference to FIGS. 1 and 2. FIG. 1 shows the pattern shape of the terminal electrode 16 in this embodiment, and FIG. 2 shows a cross-sectional view of the manufacturing process when the same pattern shape is irradiated with ultraviolet rays.
本実施例によれば、端子電極16に形成された開口部1
7の周辺における紫外線の回折光が垂直入射光に対して
影となる領域の紫外線硬化樹脂18を照射するのである
。したがって影となる領域を狭くするためには開口部1
7の面積を広くすればよいが、そうすると端子電極16
の金属部分が減少し、接続フィルム6の接続部5や図示
しない半導体チップのパンデ電極との接触面積が減少し
接触抵抗が高くなるので、接触抵抗のデータに基づいて
開口部17の面積を決定するとよい。影となる領域への
回り込み量を大きくするためには開口部17のピッチを
上げること、すなわち開口部17の形成のためのリング
ラフィの解像度を上げることと先述したように紫外線1
1の入射成分に斜め成分11′を加えることが重要であ
る。According to this embodiment, the opening 1 formed in the terminal electrode 16
The diffracted light of the ultraviolet rays around the rays 7 irradiates the ultraviolet curing resin 18 in the area that is in the shadow with respect to the vertically incident light. Therefore, in order to narrow the shadow area, opening 1
The area of the terminal electrode 16 may be increased.
The area of the opening 17 is determined based on the contact resistance data because the contact area with the connecting portion 5 of the connecting film 6 and the pande electrode of the semiconductor chip (not shown) decreases, and the contact resistance increases. It's good to do that. In order to increase the amount of light that wraps around the shadow area, it is necessary to increase the pitch of the apertures 17, that is, to increase the resolution of the phosphorography for forming the apertures 17, and as mentioned earlier, the ultraviolet 1
It is important to add the oblique component 11' to the incident component 1.
また端子電極に金属薄膜を用いると接触抵抗を透明導電
性のITOと比べると殉以下に低減することは極めて容
易で、アクティブ型液晶パネルの駆動消費電力の低減や
高速信号を扱う半導体チップのCOGが可能となるなど
の優れた効果が得られる。あるいは半導体チップをガラ
スや石英などの透明絶縁性基板上に多数実装して高密度
チップボードをパッケージを使わずに実現するなどの新
たな技術展開が可能となったことも特筆される効果と言
える。In addition, when a metal thin film is used for the terminal electrode, it is extremely easy to reduce the contact resistance to less than 100% compared to transparent conductive ITO. Excellent effects such as being made possible can be obtained. Another notable effect is that it has become possible to develop new technologies such as mounting multiple semiconductor chips on transparent insulating substrates such as glass or quartz to create high-density chip boards without using packages. .
なお端子電極に用いる金属薄膜はムβやOrなどのよう
に表面に不働態を作シ易いものは実装の信頼性に欠ける
ことが多いので超LSIの人!−ムβの2層配線のよう
に不働態対策を行うか、白金や金などの材料を直接使う
か、あるいは適当な金属材と白金や金などの貴金属もし
くはモリブデンやタングステン等を含むシリサイドとの
積層形成を必要とする場合もあシうることを補足してお
く。Note that metal thin films used for terminal electrodes, such as Muβ and Or, which tend to form a passivity state on the surface, often lack reliability in mounting, so please be careful with ultra-LSI people! - Take measures for passivation like the two-layer interconnection of the metal β, directly use materials such as platinum or gold, or use suitable metals and noble metals such as platinum or gold, or silicides containing molybdenum, tungsten, etc. It should be noted that there may be cases where lamination formation is required.
発明の効果
以上述べたごとく、ガラスなどの透光性絶縁基板上に形
成された金属薄膜よりなる端子電極にも開口部を内在さ
せることKよって紫外線硬化型の接着剤を用いて実装を
実現できることが証明された。この結果、例えばアクテ
ィブ型の液晶パネルにおいて走査線側と信号線側の端子
群を透明導電材とする制約が解かれ、プロセスの合理化
と自由度が保証される。Effects of the Invention As stated above, since the terminal electrode made of a thin metal film formed on a transparent insulating substrate such as glass has an opening, mounting can be realized using an ultraviolet curing adhesive. has been proven. As a result, for example, in an active liquid crystal panel, the restriction that the terminal groups on the scanning line side and the signal line side are made of transparent conductive material is removed, and process rationalization and flexibility are guaranteed.
第1図は本発明の実施例における開口部を有する端子電
極パターン詔、第2図は同パターンを用いた紫外線照射
時の実装工程の要部断面図、第3図は従来例における液
晶パネルへのフィルム実装を行なう斜視図、第4図は他
の従来例における液晶第1図
16−jln’J@重
/7−−間口部
の従来例における不透明端子電極に対する実装工程の要
部断面図である。
2・・・・・・透明性絶縁基板、6・・・・・・接続部
、6・・・・・・接続フィルム、11.11・・・・・
・紫外線、12・・・・・・紫外線硬化樹脂、16・・
・・・・端子電極、17・・・・・・開口部。
代理人の氏名 弁理士 粟 野 重 孝 ほか1名第
図
第
図
第
図
第
図Figure 1 shows a terminal electrode pattern having an opening in an embodiment of the present invention, Figure 2 is a sectional view of the main part of the mounting process during ultraviolet irradiation using the same pattern, and Figure 3 shows a liquid crystal panel in a conventional example. FIG. 4 is a perspective view showing the mounting process for the opaque terminal electrodes in the conventional example of liquid crystal display in another conventional example. be. 2...Transparent insulating substrate, 6...Connection part, 6...Connection film, 11.11...
・Ultraviolet light, 12...Ultraviolet curing resin, 16...
...Terminal electrode, 17...Opening. Name of agent: Patent attorney Shigetaka Awano and one other person
Claims (1)
された接続部または半導体チップのパンデ電極に紫外線
硬化樹脂を介して圧接固定される端子電極において、開
口部を有する金属よりなることを特徴とする端子電極。A terminal electrode formed on a transparent insulating substrate and fixed to a gold-plated connection part of a connection film or a pande electrode of a semiconductor chip by pressure contact via an ultraviolet curing resin, characterized by being made of metal having an opening. terminal electrode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63179558A JPH0642124B2 (en) | 1988-07-19 | 1988-07-19 | Terminal electrode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63179558A JPH0642124B2 (en) | 1988-07-19 | 1988-07-19 | Terminal electrode |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0229685A true JPH0229685A (en) | 1990-01-31 |
| JPH0642124B2 JPH0642124B2 (en) | 1994-06-01 |
Family
ID=16067836
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63179558A Expired - Fee Related JPH0642124B2 (en) | 1988-07-19 | 1988-07-19 | Terminal electrode |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0642124B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2023110524A (en) * | 2022-01-28 | 2023-08-09 | キヤノン株式会社 | Electronic components, manufacturing methods thereof, and electronic equipment |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6456170B2 (en) * | 2015-02-02 | 2019-01-23 | デクセリアルズ株式会社 | Connection method and joined body |
-
1988
- 1988-07-19 JP JP63179558A patent/JPH0642124B2/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2023110524A (en) * | 2022-01-28 | 2023-08-09 | キヤノン株式会社 | Electronic components, manufacturing methods thereof, and electronic equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0642124B2 (en) | 1994-06-01 |
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