JPH02299253A - Hybrid integrated circuit device - Google Patents

Abstract

PURPOSE:To contrive a reduction in the size of a hybrid integrated circuit device as well as to make it possible to perform freely the insertion and taking- out of an EPROM in and from the device by a method wherein the device is constituted into such a structure that a microcomputer and circuit elements on the periphery of the microcomputer are hermetically sealed in a sealing space formed by a case material and a board and the EPROM only is exposed through a recess provided in the side of the peripheral end of the case material. CONSTITUTION:A recess 7 is provided in the side of the peripheral end of a case material 8 and a single line type nonvolatile memory, that is, an EPROM (an ultraviolet erase type programmable read-only memory) 4 is mounted on a conductive path 3 on a laminated circuit board 2 exposed through the recess 7. Moreover, data are supplied from the EPROM 4 and a microcomputer connected with the path 3 on the board 2 and circuit elements on the periphery of the microcomputer are housed in a sealing space 14 formed by the material 8 and the board 2. Thereby, a reduction in size is possible and a hybrid integrated circuit device 1, in which the EPROM 4 is contained in a freely detachable manner, can be obtained.

Description

DETAILED DESCRIPTION OF THE INVENTION (a) Industrial application field The present invention provides a resin-sealed nonvolatile memory on an integrated circuit board.
For example, the present invention relates to a hybrid integrated circuit device with a built-in EFROM (ultraviolet erasable programmable read only memory).

(b) Conventional technology EF with an ultraviolet irradiation window that can erase and rewrite previously written memory information by irradiating it with ultraviolet rays
ROM3i is preferably used in various electronic devices. Currently, most of these EPROM elements are mounted on printed wiring boards together with control or driving integrated circuits, and in order to rewrite the information once written, they are usually mounted on easily removable printed wiring boards. has been done. For various electronic devices that require smaller size and lighter weight, a semiconductor integrated circuit (IC) chip is directly mounted on a printed wiring board using a technique called chip-on-board, and after the required wiring is done, this The IC chip including the wiring part is synthesized by S
It has been covered with t-mari, making it extremely compact and lightweight.

On the other hand, EPROM chips that require an ultraviolet irradiation window cannot be made smaller and lighter because the irradiation window is a bottleneck and they are still manufactured in a cerdip package and mounted on a printed wiring board.

The mounting structure of such a conventional EPROM element will be explained with reference to FIG. 12. FIG. 12 is a perspective view with a partial cross section of a conventional EPROM element, in which a conductive wiring pattern (41) is formed on the main surface. Through holes (
43) is incorporated into a cerdip type package and the EPRO
An M element (44) is mounted. This EPROM element (44) has a header (45) and a cap (46), said header (45) having a ceramic substrate (47).
An external lead (48) or a low melting point glass material is bonded to the external lead (48). In addition, this header (45) is an element mounting part (45) made by sintering so-called gold paste, which is glass mixed with a large amount of gold powder.
50) on the low melting point glass material or the ceramic substrate (4
7) is glued on the top, and the E
A PROM depth (51) is mounted with the ultraviolet irradiation surface facing upward, and the electrodes of this chip (51) and the external leads (48) are connected by thin metal wires (52). The cap (46) is a storage member, and the EPR
The cap (46) includes a ceramic base material (54) having a window (53) in a portion facing the ultraviolet irradiation surface of the OM chip (51), and the cap (46) is connected to the header (4) by a low melting point glass.
5) is sealed. The EPROM chip (51) is sealed in this way.
The PROM element (44) is fixed by soldering by inserting external leads (48) into the through holes (43) of the insulating substrate (42). This through hole (43)
A conductive wiring pattern (41) is used to perform necessary wiring, and a male connector terminal portion (55) provided at the end of the insulating substrate is connected to a female connector (not shown).

Now, the mounting structure of such a conventional EPROM element is
Compared to the ROM chip (51), the package external size is extremely large, and not only the surface area but also the height is several times the height of the chip, which is extremely disadvantageous for thinning. Furthermore, after the external lead is inserted into the through hole (43), it is necessary to fix it with solder or the like. Another major drawback that should be noted is that EP
This involves assembling some ROM elements into a package. E
Since the PROM element has a window for irradiating ultraviolet rays, its package is assembled into a ceramic-based cerdip-type package, but since this package is sealed with low-melting glass, it cannot be heated to high temperatures (400 to 500°C). )
If the thin metal wires that serve as a seal and connect the electrodes (aluminum) of the EPROM chip and the external leads are not made of the same material, alloying will occur, resulting in an increase in wiring resistance or disconnection. To avoid such a situation, thin aluminum wire is usually used, but this EPROM
Since the chip needs to have the substrate at ground potential, EP
The ground electrode of the ROM chip is connected by wire to the chip mounting portion formed of gold paste. Here, too, a secondary or multi-component alloy reaction progresses between the gold or metals such as foil in the gold paste and the aluminum, so a small piece of silicon whose head is coated with aluminum, called a ground die, is used. Separately from the EPROM chip, it is fixed to the chip mounting part made of the gold paste, and this ground die head and the EPR
Conventional mounting structures are unsatisfactory in terms of small size, light weight, and low cost, as they involve extremely complicated work of connecting the OM chip to the ground electrode.

In order to solve this problem, the EPROM shown in FIG.
There is an implementation structure.

The EPROM mounting structure shown in FIG. 13 will be explained below.

An insulating substrate (60
0) has a chip mounting area (60c) on which an EPROM chip (61) is placed, and the wiring pattern (60b)
) is routed from near this area on the main surface (60a) and connected to a male connector terminal portion (not shown).

The area (60c) contains an EPROM chip (61).
is mounted, and the surface electrode of this chip (61) and the wiring pattern (60b) are connected by a thin metal wire (62). Of course, one of the thin metal wires (62) is connected to the chip (
In order to connect to the substrate of 61), this chip (
61) is wired with the wiring pattern (60b) mounted thereon. On the ultraviolet irradiation surface (61a) of the EPROM chip (61) is an ultraviolet transparent tree Jl (63).
(For example, manufactured by Toshisha Co., Ltd., model number TX-978), the ultraviolet-transparent window material (64) is completely fixed. This window material (6
4) is a known ultraviolet transparent material such as quartz or transparent alumina. Then, the top surface (64a) of the window material (64)
) is the surface that introduces light to the ultraviolet irradiation surface of the EPROM chip (61), so the remaining window material (4) portion excluding this top surface (64a), the thin metal wire (62), and this metal The connecting portion between the thin wire (62) and the wiring pattern (60b) is covered with a synthetic resin (65) (for example, manufactured by Nitto Denko Corporation, model name MP-10). If the insulating substrate (6
0), the EPROM chip (61), and the window material (64), if it is necessary to further reduce the total thickness dimension, the chip mounting area (60c) of the board (60) can be counterbored and this board can be used. (60) You only need to grip it about half the thickness.
Also, if you make a counterbored hole like this, you can make a synthetic tree JI! (65
) is formed and acts effectively against the infiltration of moisture.

The EPROM mounting structure shown in FIGS. 12 and 13 is described in Japanese Unexamined Patent Publication No. 1983-83393 (HO5, 1/18).

(c) Problems to be Solved by the Invention In the EPROM mounting structure shown in FIG. 13, the EFROM chip is die-bonded onto the printed circuit board, so it goes without saying that the size is reduced. The miniaturization referred to here is simply the miniaturization of the EPROM itself. That is, although it is not clear from FIG. 13, there is a microcomputer fixed around the EFROM.

Since the peripheral circuit elements are composed of discrete and other electronic components, when looking at the entire system as an integrated circuit for a printed circuit board equipped with EFROM, there is no miniaturization at all, and the printed circuit board is enlarged as before. In other words, there is a problem that the entire system becomes larger. Furthermore, in the EFROM structure shown in FIG. 13, when erasing program data in the EFROM, after erasing it by irradiating the printed circuit board with ultraviolet rays, a writing probe or the like is placed on the conductive pattern of the routing line extending from the EFROM. It is necessary to rewrite the EFROM by touching the terminals of the EFROM, and a conventional general ROM writer cannot be used, which makes rewriting the EFROM complicated.

In addition, in the EFROM mounting structure shown in Figure 12, in terms of rewriting after erasing, it is possible to attach and detach the EPROM from the printed circuit board, so it is possible to write using a general ROM writer. It's easy to do. However, in the mounting structure shown in FIG. 12 as well as in FIG. 13, the peripheral circuits of the EPROM, that is, the circuit elements such as the microcomputer and its peripheral LSIs and ICs, are composed of discrete electronic components. , Printed circuit boards have become larger, that is, the entire system has become larger, and users are demanding lighter, thinner, shorter, and smaller EPROMffr@
There is a major problem in not being able to provide integrated circuits.

Furthermore, in the EFROM mounting structure shown in FIGS. 12 and 13, the entire system becomes larger as described above, and the conductive patterns that connect the EFROM and its surrounding circuit elements are exposed, which reduces reliability. There is a problem of deterioration.

Furthermore, in the EFROM mounting structure shown in FIGS. 12 and 13, the EFROM and the surrounding microcomputer, IC, LSI, and other circuit elements are exposed, which creates unevenness on the top surface of the board, making it difficult to handle and work. There is a problem of deterioration.

(d) Means for Solving the Problems The present invention has been made in view of the above-mentioned problems, and includes a single in-line tree-sealed EPROM mounted on a substrate and a microprocessor connected to the EFROM. Equipped with a computer and its peripheral circuit elements, and
The microcomputer and all its peripheral circuit elements are hermetically sealed in the sealed space formed by the case material and the board.
It is characterized in that only the FROM has a structure exposed by a recess provided at a desired position on the peripheral edge of the case material.

Therefore, it is possible to provide a hybrid integrated circuit device with a built-in EFROM that can be miniaturized and in which the EPROM can be freely inserted and removed.

(Book) Function According to this type of book and the present invention, a recess is provided on the peripheral edge of the case material, and a single in-line type EFROM is connected to the conductive path on the substrate exposed by the recess. Therefore, since the mounting position of the EPROM can be set arbitrarily, the EPROM and the microcomputer can be efficiently connected by considering the electrical connection with the built-in microcomputer. can be made unnecessary.

Furthermore, the most closely related microcomputer can be placed adjacent to the EFROM, and the data line for exchanging data between the EFROM and the microcomputer can be realized with the shortest or minimum distance, reducing loss in packaging density due to data line routing. This allows for high-density packaging.

Further, in the present invention, all the elements other than the EFROM are in the form of chips and are housed in the sealed space formed by the case material and the substrate, so it is possible to provide a hybrid integrated circuit device that is compact and easy to handle. can.

(F) Embodiments Below, the hybrid integrated circuit device of the present invention will be explained in detail based on the embodiments shown in FIGS. 1 to 11.

1 and 2 show a hybrid integrated circuit device (1) according to an embodiment of the present invention. This hybrid integrated circuit device (1) is used as an independent electronic component and is used as an integrated circuit having independent functions in a wide range of fields such as computers.

As shown in FIGS. 1 and 2, this hybrid integrated circuit device (1) includes an integrated circuit board (2), a conductive path (3) of a desired shape formed on the integrated circuit board (2), Conductive path (3)
a single in-line resin-molded nonvolatile memory (4) connected to a microcomputer (5) supplied with data from the memory (4) and connected to a conductive path (3) on the substrate (2); It consists of a peripheral circuit element (6) and a case material (8) which is integrated with the substrate (2) and has a recess (A) on the peripheral edge thereof.

The integrated circuit board (2) is a hard substrate made of ceramics, glass epoxy, metal, or the like, and in this embodiment, a metal substrate with excellent heat dissipation and mechanical strength is used.

As the metal substrate, for example, an aluminum substrate with a thickness of 0.5 to 1.0 m is used. As shown in Figure 3, the surface of the substrate (2) is coated with an aluminum oxide film (
9) (alumite layer) is formed, and 10
An insulating resin layer (10) of epoxy or polyimide or the like with a thickness of ~70μ is pasted. Further, on the insulating resin layer (10), a copper foil (11) with a thickness of 10 to 70 μ is placed on the insulating resin layer (10).
At the same time, it is attached using a roller or hot press.

On the surface of the copper foil (11) provided on the main surface of the substrate (2), a conductive path of a desired shape is exposed by screen printing, masked with a resist, and plated with gold, silver, and platinum. A layer is plated onto the copper foil (11) surface. After that, the resist was removed and copper foil (1
Etching step 1) is performed to form a desired conductive path (3). Here, the thinness of the conductive path (3) by screen printing is limited to 0.51Ta, so when an ultra-fine wiring pattern is required, the ultra-fine conductive path (3) up to about 2 μm can be formed using well-known photo-etching technology. Formation becomes possible.

At a predetermined position on the conductive path (3), there is a single in-line resin-molded nonvolatile memory (4) and a microcomputer (4) supplied with data from the memory (4).
5) and its surrounding circuit elements (6) are mounted, and a conductive path (3) is mounted.
) is connected. The conductive path (3) is formed to extend over substantially the entire surface of the substrate (2), and a lead fixing pad is formed at the tip of the conductive path (3) extending around the peripheral edge of the substrate (2). An external lead terminal (12) is fixed to the. The external lead (12) is bent at a substantially right angle for attachment to the board.

E F ROM (Er
as-able Programmable Read
(hereinafter, non-volatile memory (4) is referred to as EFROM), this EFRO
As is well known, M(4) excites the electrons (program data) stored in the floating gate formed in the pellet of EFROM(4) by irradiating it with light and returns it to the pellet in an unmemorized state. This is an element that can be written into and used.

The structure of a typical EPROM (4) is of the 5IP (single-in-line) type, as shown in FIGS. 4 and 5, and can be broadly classified into resin mold package type and ceramic package type. In either the resin mold type or the ceramic type, it is necessary to irradiate the pellet (12) with light to erase its memory, so the upper surface of the pellet (12) is exposed to high-energy light (ultraviolet light). A transparent member (13) is arranged. In this example, the SIP type E
For PROM (4), either a resin mold type or a ceramic type package can be used.Such EFROM devices are disclosed in Japanese Patent Laid-Open No. 53-74358 and Japanese Patent Laid-Open No. 62-290160. has been done.

The IC1 transistor, chip resistor, chip capacitor, etc. of the microcomputer (5) and its peripheral circuit elements (6), which are supplied by selecting the program data of the EPROM (4), are connected to the desired conductive path (3) in a chip state.
The microcomputer (5) and circuit elements (6) are attached to the top by soldering or a brazing material such as Ag paste, and are bonded to the nearby conductive path (3). Furthermore, a carbon resistor by screen printing and a nickel-plated resistor by nickel plating are formed as resistance elements between the conductive paths (3), respectively.

On the other hand, the case material (8) is made of thermoplastic resin as an essential member, and is formed into a box shape so that a space is formed when it is fixed to the substrate (2). The box-shaped case material (
The peripheral end portion of 8) is disposed substantially at the peripheral end portion of the substrate (2) and is firmly fixed and integrated with the substrate (2) using an adhesive sealant (J sheet: trade name). As a result, the substrate (2
) and the case material (8), a predetermined sealed space (14) is formed between the case material (8). Further, the case material (8) of this embodiment is provided with a recess (7). The recess (7) has substantially the same shape as the EFROM (4), and
EFROM (4) is installed to facilitate insertion and removal of ROM (4).
) is formed slightly larger than the This hollow (7)
is formed so as to be located at the peripheral edge of the case material <8), and is composed of at least three sides.

On the substrate (2) exposed in the recess (7) of the case material (8), one end of a plurality of conductive paths (3) that can be firmly connected to the electrodes of the socket (15) is formed. Socket (15) to insert E F ROM (4) into the tip
is fixed. A conductive path (
3) The other end is efficiently routed near the microcomputer (5) and is a chip-shaped microcomputer (5).
and electrically connected with bonding wires.

Here, EFROM (4> and microcomputer (5)
I will explain the positional relationship with. Figure 6 shows EPROM (4
) and a microcomputer (5) are arranged on the board (2), and the EPROM (4) and chip-shaped microcomputer (5) are arranged in large numbers as shown in Fig. 6. Because it is connected via the conductive path (3),
In order to shorten the wiring of the conductive path (3),
(4) and the microcomputer (5) are arranged adjacent to each other or as close as possible. Therefore, EFROM (4) and microcomputer (
The conductive path (3) can be formed in the shortest distance between the conductive path (3) and the conductive path (3), and the mounting area on the board can be used effectively. EFR
As shown in FIG. 6, the OM (4) and a chip-shaped microcomputer (5) placed near or adjacent to it are connected to the tip of a conductive path (3) extending near the microcomputer (5). It is bonded and electrically connected to the EFROM (4) by a wire line.

By the way, the EPROM (4) will be inserted into the socket (15) and mounted on the board (2), and the EPRO
Only the top surface of M(4) will be exposed to the outside. At this time, it is preferable that the top surface of the EFROM (4) and the top surface of the case material (8) are in a substantially coincident state.As a result,
Only the EPROM (4) is exposed, and the other microcomputer (5) and its peripheral circuit elements (6) are placed in the sealed space (14). Also, EFROM (
Since the transparent member (13) provided on the side surface of the recess (7) almost contacts the side surface of the recess (7), the EPROM (
4) You can block light just by inserting it.

As described above, the microcomputer (5) connected to the EFROM (4) and its peripheral circuit elements (6) are placed in the sealed space (14) formed by the substrate (2) and the case material (8).
). That is, all elements, including chip-shaped electronic components and resistance elements such as printed resistors and plated resistors, are provided within the sealed space (14).

In this embodiment, when erasing data in the EFROM (4), there is a case where the EFROM (4) is removed from the socket (15) and irradiated with ultraviolet rays. Also, in case of rewriting, E
Remove the PROM (4) from the socket and use it as a general ROM.
Write electrically using a writer, and after writing,
Just insert it into the socket (15).

A specific example of a hybrid integrated circuit device for a modem using the present invention will be shown below.

What is a modem? A modem exists for data users who use telephone lines to send and receive digitized data handled by data terminals such as personal computers at a distance from each other. The function of a modem is to modulate digitized data using the frequency that can be used on the telephone line, convert it into an analog signal, and send it on the telephone line, and to send an analog signal that is modulated with the data sent from the other party. It has the ability to demodulate and return to digitized data.

The modem will be briefly explained based on the block diagram shown in FIG.

FIG. 7 is a block diagram when the modem is mounted on the integrated circuit board (2).

The modem has a DTE interface (21) that stores data sent from the computer in its built-in memory and outputs the data, and a DTE interface (21).
A microcomputer (5) that outputs a predetermined output signal based on data output from the microcomputer (5), and an EFR that contains data addressed by the microcomputer (5).
The output signals from the OM (4) and the microcomputer (5) are modulated and demodulated to the NCU (NETWORK C0NTR).
0L UNIT) and a microcomputer (5).
A DTMF generator (24) generates a desired DTMF signal (tone signal) according to an output signal from the DTMF generator (24).

The DTE interface consists of an IC such as 5TC9610 (Seiko Epson), and as shown in Figure 8, it has a transmitting memory that supplies output signals from the personal computer, stores the output signals in built-in memory, and outputs them to the microcomputer (5). Part (25) and microcomputer (5)
a receiving memory part (26) that accumulates the signal supplied with the output signal from the built-in memory and outputs it to the personal computer;
Part of transmitting memory (25) and part of receiving memory (26)
A control unit (2) that switches each signal input and output via
7), and has a predetermined function for connecting the personal computer (28) and the microcomputer (5).

The microcomputer (5) is, for example, 5TC9620 (
It consists of ICs such as Seiko Epson), as shown in Figure 9.
A command recognition section that recognizes the output signal output from the DTE interface (21), a command decoding section that decodes the output signal recognized by the command recognition section, and a part of memory that decodes the signal decoded by the command decoding section. The DTE interface (21 ) and a response code generation unit that outputs an output signal to the output signal.

The modulation/demodulation circuit (28) converts the digital signal sent from the microcomputer (5) into an analog signal and sends it to the NC
Send to U department. On the other hand, it converts the analog signal sent from the NCU section into a digital signal and sends it to the microcomputer (5), and includes low-speed and medium-speed circuits. First modulation/demodulation circuit (22
) is a 300 bps low speed modulation/demodulation circuit, and the second modulation/demodulation circuit (23) is a 1200 bps medium speed modulation/demodulation circuit. Respective first and second modulation/demodulation circuits (22) (2
3), one of the modulation and demodulation circuits is selected by the microcomputer (5).

DTMF generator (24) is a microcomputer (5)
The data output from the command execution part of COL, RO
A predetermined DTMF signal is generated by inputting it to each input terminal of W, and is output to the transmitting A M P (29a) to supply the signal to the telephone line.

Program data for setting various modes of the modem is stored in the E P ROM (4).
The data is supplied to the microcomputer (5) based on the address of the microcomputer (5).

Next, the operation of the modem will be briefly explained.

First, in order to start the bass communication, the control switch (29d) operates based on the read signal from the microcomputer (5), and the predetermined address data is read from the EFRO.
EFRO supplied to M(4) and based on its address
The program data of M (4) is supplied to the microcomputer (5), and the communication standard (BELL/CCITT standard) and communication speed (300/1
200bpS), data format matching, and various modes such as depth switch mode switching are checked.

Assuming the various modes match, enter the answering modem's phone number into your computer.

The phone number is the DT for interfacing with the computer.
E-interface (21) and forwarded to the microcomputer (5) for decoding the telephone number.

Send the decoded result to the DTMF generator (24),
A DTMF signal is transmitted from the DTMF generator (24), and the signal is transferred to the general telephone line via the transmission A M P (29a) and the line transformer (29c).

The transferred DTMF signal sends a paging signal to the modem on the responding side, and the modem on the responding side receives the paging signal and automatically receives the call. Then, the modem on the responding side sends an answer tone for the connection procedure to the modem on the calling side.

In the modem on the calling side, the answer tone passes through a line transformer (29c) and a receiving amplifier (29b), and is sent to the low-speed modulation/demodulation circuit (22) as a predetermined answer to the modem on the calling side.
Detect whether it is a tone or not. If it is a predetermined answer tone, the communication state is entered.

When the communication state is established, parallel data from the PC is input to the DTE interface (21) based on predetermined key manual signals from the keyboard of the calling party's PC,
The data is transferred to the microcomputer (5).

Here, parallel data is converted to serial data. The digital signal converted into serial data is sent to the low-speed modulation/demodulation circuit (22). Here, the digital signal is converted to an analog signal, subjected to frequency modulation FSX based on the corresponding communication standard, and transmitted to the responding modem via the transmission AMP (29) and line transformer (32).

On the other hand, the frequency-modulated analog signal sent by the key input signal of the personal computer on the responding side is sent to the modem on the calling side, and is sent to the line transformer (29c) and the receiving A M P (2
9b) to the low-speed modulation/demodulation circuit (22).

Here, the analog signal is converted to a digital signal and input to the DTE interface (21), and the serial digital signal is converted to a parallel digital signal and input to the calling side personal computer. As a result, full duplex communication between the calling side personal computer and the responding side personal computer becomes possible, and personal computer communication is realized.

FIG. 10 is a plan view of the modem circuit shown in FIG. 7 mounted on the substrate (2) used in this embodiment, and the mounted circuit elements are given the same reference numerals. EFROM (
The connection between 4) and the microcomputer (5) is shown by a pass line. Note that the conductive paths connecting the plurality of circuit elements are omitted because they are complicated.

As shown in FIG. 10, a plurality of fixing pads (3a) to which external lead terminals (12) are fixed are provided at opposing peripheral ends of the substrate (2). A socket (15) in which a plurality of circuit elements and an EFROM (4) are mounted is fixed at a predetermined position on the conductive path (3) extending from the fixing pad (3a). A plurality of circuit elements including a microcomputer (5) other than the EPROM (4) are fixed on the substrate (2), (21) is a DTE interface, and (22)<23) are the first and second 2 modem circuit, (
24) is a DTMF generation circuit, (29g> is an EPROM (
4) is a control switch that controls , (5) is a microcomputer, and (6) is a chip component such as a capacitor.

As shown in FIG. 10, a socket (15) in which an EFROM (4) is mounted is fixed near or adjacent to the microcomputer (5). A socket (15) is installed near or adjacent to the microcomputer (5).
) by fixing the microcomputer tough 5) and E
The distance between the signal line from the FROM (4), that is, the wiring line for the conductive path (3), can be routed at the shortest possible distance, and other mounting patterns can be used effectively, and high-density mounting can be achieved. . At this time, the socket material (15) is
) is provided at the peripheral edge of the substrate (2) to correspond to the recess (7).

In addition, the area surrounded by the dashed line is covered with an adhesive sheet for the case material (
8) indicates the area to be fixed.

Figure 11 shows the case material (
8) is a plan view of the completed product of the hybrid integrated circuit device for a modem when the EFROM (4) is fixed, and only the top surface of the EFROM (4>) can be seen from the recess (7) provided on the peripheral edge of the case material (8). In other words, all other elements other than the EFROM (4) are sealed within the sealed space (14) formed by the case material (8) and the substrate (2), and the EFROM (4) is exposed.
) is exposed, so the E F ROM (4) can be inserted and removed as desired.

EFRO, the hybrid integrated circuit device for modems detailed above.
M(4) includes the destination and OEM in preparation for diversification of product specifications.
It is possible to easily respond to specification changes requested by set manufacturers (users) such as in-house sales. That is, EPR
Circuit configurations other than OM(4) were designed in advance to accommodate various specification changes, but if a hybrid integrated circuit is designed based on a specific user's specifications, it may not match the specifications of other users. In this case, conventionally it was necessary to reconsider the design of the hybrid integrated circuit itself.

However, in the hybrid integrated circuit device of the present invention, the EFROM (4)
is mounted on the board (2) via the socket (15), and its surface is exposed through the recess (7) of the case material (8), so the EFROM (4) can be removed, making it easy for the user to remove the EFROM (4). Just select the EFROM and install it.
Multiple types of hybrid integrated circuit devices can be realized with one hybrid integrated circuit device.

According to the present invention, a recess (7) is provided at a desired position of the case material (8), and the exposed substrate (2) is formed in the recess (7).
) A single in-line resin-molded EFROM (4) is connected to the conductive path (3) on the conductive path (3) via a socket 15), and a sealed space (14) formed by the substrate (2) and the case material (8) is connected. ) by fixing a microcomputer (5) and other circuit elements (6) to a device that integrates a hybrid integrated circuit and an EFROM. have

(G) Effects of the Invention As detailed above, according to the present invention, firstly, a recess (7) is provided on the peripheral edge of the case material (8), and the recess (7)
) is connected to the conductive path (3) on the substrate (2) exposed at It has the advantage of being able to be selected arbitrarily in the vicinity. Therefore, in consideration of the electrical connection with the built-in microcomputer, the EFROM (4) and the microcomputer (5) can be connected efficiently, making it unnecessary to route signal lines. More specifically, the most closely related microcomputer (5) can be placed adjacent to the EFROM (4), and as a result, the data line for exchanging data between the EFROM (4) and the microcomputer (5) can be realized with the shortest distance or the easiest layout, and the loss in packaging density due to data line routing can be minimized.

Second, EPR is applied to the recess (7) at the peripheral edge of the case material 8).
Since the OM(4) is arranged, it has the advantage that it can be handled as an integrated 41-inch hybrid integrated circuit device. Furthermore, by improving the mounting density of the microcomputer and its peripheral circuit elements on the integrated circuit board (2),
It is possible to eliminate the conventionally required printed circuit board, and to realize a hybrid integrated circuit device that includes one miniaturized EFROM (4) that can be detachably attached.

Thirdly, by using a metal substrate as the integrated circuit board (2), its heat dissipation effect can be greatly improved compared to a printed circuit board, which can further contribute to an improvement in packaging density. Furthermore, by using copper foil (11) as the conductive path (3), the resistance value of the conductive path (3) can be significantly reduced compared to conductive paste, and the circuit to be mounted can be expanded to the same level or more than that of a printed circuit board.

Fourth, since a single in-line type can be used as the EFROM (4), the EFROM (4) can be used in a hybrid integrated circuit device.
It is extremely easy to implement ROM (4) and EP
It has the advantage that light can be blocked simply by inserting the transparent member (13) of the ROM (4). Furthermore, there is a recess (7) and an EPROM (
By making the outer shape of 4) the same, it can be buried exactly in the case material (8), and since the recess (7) is provided on the peripheral edge of the case material (8), it is easy to insert and remove, and it is extremely neat. A hybrid integrated circuit device with a built-in EFROM can be realized.

Fifth, the microcomputer (5) and its peripheral circuit elements (6) connected to the EPROM (4) are made of case material (
8) and the integrated circuit board (2).
4) Since it is incorporated in a gooey shape or a chip shape, it occupies an extremely small area compared to a conventional printed circuit board molded with 46tJfl, and has the advantage of greatly improving the packaging density.

Sixth, by substantially matching the peripheral edges of the case material (8) and the integrated circuit board (2), almost the entire surface of the integrated circuit board (2) can be used as a sealed space (14), which reduces the packaging density. Combined with this improvement, an extremely compact hybrid integrated circuit device can be realized.

Seventh, by providing a socket (15) on the integrated circuit board (2) corresponding to the recess (7), the EFROM (4
) can be freely attached and detached, and has the advantage that the EFROM (4) can be replaced and erased, and (31) written can be freely performed.

Eighth, by making the upper surfaces of the case material (8) and the EFROM (4) coincide with each other, there is an advantage that a hybrid integrated circuit device having a flat upper surface can be realized.

Ninth, the external lead (12) can be led out from the negative side or the opposing side of the integrated circuit board (2), which has the advantage of realizing a hybrid integrated circuit device with an extremely large number of bins.

[Brief explanation of drawings]

Fig. 1 is a perspective view showing this embodiment, and Fig. 2 is an I-
3 is a sectional view of the substrate used in this embodiment, FIG. 4 is a perspective view of the EFROM used in this embodiment, FIG. 5 is a sectional view of FIG. 4, and FIG. 6 is a sectional view of the substrate used in this embodiment. FIG. 7 is a block diagram showing the modem used in this example. FIG. 8 is a DT of the modem shown in FIG. 7.
FIG. 9 is a block diagram showing the microcomputer of the modem shown in FIG. 7. FIG. 10 is a plan view of the block diagram shown in FIG. 7 mounted on a board. FIG. 11 is a plan view of the case material fixed onto the substrate shown in FIG. 10, and FIGS. 12 and 13 are cross-sectional views showing a conventional EPROM mounting structure. (1)...Hybrid integrated circuit device, (2)...Integrated circuit board, (3)...Conducting path, (4)...EFR
OM, (5)...Microcomputer, (6)
・・・Circuit element, (7)...Indentation, (8)...
Case material, (15)... socket.

Claims (11)

[Claims] (1) an integrated circuit board; a conductive path having a desired pattern formed on the board; a single in-line resin-molded nonvolatile memory connected to the conductive path; and a nonvolatile memory that is supplied with data from the memory. and a microcomputer and its peripheral circuit elements connected to the conductive path on the substrate, and a case material integrated with the substrate, and a recess is provided at a desired position on a peripheral edge of the case material, The non-volatile memory is connected to the conductive path on the substrate exposed in the depression, the erasing window of the non-volatile memory is brought into contact with the case material in the depression to block light, and the substrate and the case material are connected to each other. A hybrid integrated circuit device, characterized in that the microcomputer and its peripheral circuit elements are arranged in a sealed space formed by. (2) The hybrid integrated circuit device according to claim 1, wherein a metal substrate whose surface is insulated is used as the integrated circuit board. (3) The hybrid integrated circuit device according to claim 1, wherein copper foil is used as the conductive path. (4) The hybrid integrated circuit device according to claim 1, wherein the outer shape of the recess and the nonvolatile memory are substantially the same. (5) The hybrid integrated circuit device according to claim 1, wherein the microcomputer is incorporated in the form of a die on the conductive surface. (6) The hybrid integrated circuit device according to claim 1, wherein a chip resistor or a chip capacitor is used as the peripheral circuit element. (7) The hybrid integrated circuit device according to claim 1, wherein the peripheral edge of the case material substantially coincides with the peripheral edge of the substrate except for the recess. (8) A socket connected to the conductive path is provided on the substrate exposed in the recess, and the single in-line resin-molded nonvolatile memory is inserted into the socket. Hybrid integrated circuit device. (9) The hybrid integrated circuit device according to claim 8, wherein the upper surface of the nonvolatile memory and the upper surface of the case material are substantially aligned. (10) The hybrid integrated circuit device according to claim 1, wherein an external lead is led out from one side of the substrate. (11) The hybrid integrated circuit device according to claim 1, wherein external leads are led out from two opposing sides of the substrate.