JPH02308108A - Base plate for coupling laser diode and optical fiber - Google Patents

Base plate for coupling laser diode and optical fiber

Info

Publication number
JPH02308108A
JPH02308108A JP12792189A JP12792189A JPH02308108A JP H02308108 A JPH02308108 A JP H02308108A JP 12792189 A JP12792189 A JP 12792189A JP 12792189 A JP12792189 A JP 12792189A JP H02308108 A JPH02308108 A JP H02308108A
Authority
JP
Japan
Prior art keywords
optical fiber
laser diode
pipe
base
groove
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12792189A
Other languages
Japanese (ja)
Inventor
Akinobu Yamaoka
山岡　明暢
Toshiya Isobe
俊哉 磯部
Shigenori Ito
伊藤　茂憲
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Japan Aviation Electronics Industry Ltd
Original Assignee
Japan Aviation Electronics Industry Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Japan Aviation Electronics Industry Ltd filed Critical Japan Aviation Electronics Industry Ltd
Priority to JP12792189A priority Critical patent/JPH02308108A/en
Publication of JPH02308108A publication Critical patent/JPH02308108A/en
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4202—Packages, e.g. shape, construction, internal or external details for coupling an active element with fibres without intermediate optical elements, e.g. fibres with plane ends, fibres with shaped ends, bundles

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Optical Couplings Of Light Guides (AREA)

Abstract

PURPOSE:To allow the coupling of a laser diode and an optical fiber with high efficiency by absorbing the distortion by the shrinkage force of solder in a mounting part. CONSTITUTION:The base plate 10 is a block made of a metal, for example, ''Invar(R)'' consisting of a laser diode fixing part 14 which fixes the laser diode to a prescribed height from the flat surface of a package and the optical fiber mounting part 18 which fixes the projected optical fiber by having a spacing from this fixing part 14. The groove side wall 26 of this base plate 10 is formed much thinner than the conventional side wall W to substantially lower the rigidity than the rigidity of a pipe. The side walls 26, 27, therefore, deflect respectively to absorb the force to bend the pipe even if the shrinkage force of the solder varies on both sides of the pipe at the time of fixing the pipe to the U-shaped groove by using the solder. The axis misalignment of the pipe, i.e., the axis misalignment of the laser diode and the optical fiber is prevented in this way and the coupling efficiency is improved.

Description

【発明の詳細な説明】 ［産業上の利用分野］ この発明はレーザダイオードに光ファイバを接続する基
台、より詳細にはレーザダイオードの光軸に光ファイバ
の軸線を整列させて固定する調心結合基台に関する。[Detailed Description of the Invention] [Industrial Application Field] This invention relates to a base for connecting an optical fiber to a laser diode, and more specifically, an alignment system for aligning and fixing the axis of the optical fiber with the optical axis of the laser diode. Regarding the bonding base.

［発明の背景］ レーザダイオードモジュール化することは光伝送および
光計測などの技術分野において、重要な構成技術である
。[Background of the Invention] Making laser diodes into modules is an important configuration technology in technical fields such as optical transmission and optical measurement.

そのためには、レーザダイオードに光ファイバを結合す
る必要があり、高い結合効率を得ようとする場合には、
光ファイバの結合すべき先端を半球状に加工した、いわ
ゆる先球光ファイバを使用することが望ましい。For this purpose, it is necessary to couple an optical fiber to the laser diode, and if you want to obtain high coupling efficiency,
It is desirable to use a so-called spherical optical fiber whose tip end to be coupled is processed into a hemispherical shape.

ところが、レーザダイオードと先球光ファイバとを結合
するには、とくに光軸が的確に整列されなければならな
い。However, in order to couple the laser diode and the optical fiber, the optical axes must be precisely aligned.

従来技術としては、レーザダイオードと先球光ファイバ
とを調心固定するためには、単一モード光７フイバ（Ｓ
ｉｎｏｌｅ−ｍｏｄｅ　ｏｐｔｉｃａｌｆｉｂｅｒ　’
）の先端を半球状に加工し、これを金属製のパイプに装
入する１次に、レーザダイオードを固定する部分を有し
、さらにパイプを固定するための清を有する基台の溝内
に、先球ファイバを装入したパイプを装入して半田で固
着した後、パイプチャックなどの工具を用いて光ファイ
バの軸線をレーザダイオードの出力軸と一致するように
調心して、その半田の部分にＹＡＧレーザを照射して、
最終的にパイプをベースに固定している。As a conventional technique, a single mode optical 7 fiber (S
inole-mode optical fiber'
) is machined into a hemispherical shape, and this is inserted into a metal pipe.The first part has a part for fixing the laser diode, and it is further inserted into the groove of the base, which has a hole for fixing the pipe. After inserting the pipe containing the spherical fiber and fixing it with solder, use a tool such as a pipe chuck to align the axis of the optical fiber to the output axis of the laser diode, and then remove the solder part. Irradiate the YAG laser to
Finally, the pipe is fixed to the base.

ところで、従来の以上の技術においては、光ファイバを
装入したパイプを基台の清に半田で固定するときに、半
田の収縮力が均等に分布されず、パイプが湾曲して、折
角調心しても、軸ずれを招き、結合効率を低下させると
いう不都合が少くなかった。By the way, in the above-mentioned conventional technology, when the pipe containing the optical fiber is fixed to the base with solder, the shrinkage force of the solder is not evenly distributed, causing the pipe to curve and become misaligned. However, there were many disadvantages in that it caused axis misalignment and reduced coupling efficiency.

さらに、従来、このようにレーザダイオードに光ファイ
バを調心結合したとき、両者間に軸ずれを生じた場合に
、これを袖正することは頗る困難であった。Furthermore, conventionally, when an optical fiber is aligned and coupled to a laser diode in this manner, it has been extremely difficult to correct the misalignment of the axes between the two.

［発明の目的］　　　　′ 以上に述べた従来技術における解決を求められていた問
題点を考慮して、この発明の目的はレーザダイオードと
光ファイバとを高効率にて結合する基台を提供すること
にある。[Objective of the Invention] 'In consideration of the above-mentioned problems that have been required to be solved in the prior art, an object of the present invention is to provide a base for coupling a laser diode and an optical fiber with high efficiency. It is in.

この発明の目的はまた、レーザダイオードと光ファイバ
との軸ずれを最小限度に抑制することのできる基台を提
供することにある。Another object of the invention is to provide a base that can minimize axis misalignment between a laser diode and an optical fiber.

［発明の構成］ この発明の好ましい実施態様を添付図面について具体的
に説明する。[Structure of the Invention] Preferred embodiments of the present invention will be specifically described with reference to the accompanying drawings.

第１図はこの発明の第一の実施態様であるレーザダイオ
ードと光ファイバとの結合基台１０を示す、基台１０は
レーザダイオード１２をパッケージ（図面に示してない
）の平坦な面から所定の高さに固定するレーザダイオー
ド固定部１４と、この固定部１４から間隔をとって突出
する光ファイバ１６を固定する光フアイバ取付は部１８
とから成る金属製たとえばアンバー製のブロックである
。FIG. 1 shows a coupling base 10 for a laser diode and an optical fiber, which is a first embodiment of the present invention. The laser diode fixing part 14 is fixed at a height of
It is a block made of metal, for example, amber.

光ファイバ１６は、その結合側の端部を加工して、先球
状のものとし、ニッケルなどの金属製のパイプ２０に装
入して、光フアイバ取付は部１８に固着する。その固着
のために、取付は部１８の上面には、光ファイバ１６を
装入したパイプ２０の軸線に沿い、このパイプ２０を装
入するためのＵ字形の消２２が形成されている。渭２２
に装入されたパイ１２０は、レーザダイオード１２の出
力軸と一致するように、光ファイバ１６の軸線を調整、
すなわち調心して、消２２に半田２４で固定される。The end of the optical fiber 16 on the coupling side is processed to have a spherical tip, and the optical fiber 16 is inserted into a pipe 20 made of metal such as nickel, and the optical fiber attachment part 18 is fixed. In order to fix the optical fiber 16, a U-shaped groove 22 is formed on the upper surface of the mounting portion 18 along the axis of the pipe 20 into which the optical fiber 16 is inserted. Wei 22
The pi 120 inserted into the
That is, it is aligned and fixed to the eraser 22 with solder 24.

ところで、従来の基台は、第１図に一点鎖線で示すよう
に、取付は部１８の清２２の両側壁Ｗの部分を十分に厚
くして、パイプの剛性よりも、高剛性に構成しである。By the way, the conventional base is mounted by making the side walls W of the bottom 22 of the part 18 sufficiently thick so that the rigidity is higher than that of the pipe, as shown by the dashed line in FIG. It is.

この発明によれば、基台１０は消２２の側壁２６を、従
来の側壁Ｗよりも遥かに薄くし、パイプ２０の剛性に比
して、剛性を相当に低いものとしである。According to this invention, the side wall 26 of the base 10 is made much thinner than the conventional side wall W, and the rigidity is considerably lower than that of the pipe 20.

以上の構成における各部の寸法の一例を示すと、次の通
りである。An example of the dimensions of each part in the above configuration is as follows.

まず、光ファイバ１６の直径は約０．１２５＋ｉｎで、
ニッケル製としたパイプ２０の外径は約０．６８ａｍ、
内径は約０．１３間である。アンバー製とした基台１０
の溝２２の深さと幅とは約１閣で、溝２２の側壁２６の
高さは約０．３１１ＩＩ＋で、その幅は約１．５ｍａで
ある。First, the diameter of the optical fiber 16 is approximately 0.125+in.
The outer diameter of the pipe 20 made of nickel is approximately 0.68 am,
The inner diameter is approximately 0.13 mm. Base 10 made of amber
The depth and width of the groove 22 are about 1 mm, the height of the side wall 26 of the groove 22 is about 0.311II+, and the width is about 1.5 ma.

以上の寸法と材料との組合せで、曲げ剛性の目安となる
断面２次モーメントエとヤング率Ｅとの積はパイプ２０
が約２０００［Ｎ−ＩｕＩ２］で、基台１０の側壁２６
が約４９０［Ｎ−ＩＩＩＩ＋２１となり、パイプ２０の
曲げ剛性は側壁２６の剛性の４倍に相当する。With the combination of the above dimensions and materials, the product of the second moment of area E and Young's modulus E, which is a guideline for bending rigidity, is the pipe 20
is about 2000 [N-IuI2], and the side wall 26 of the base 10
is approximately 490 [N-III+21, and the bending rigidity of the pipe 20 is equivalent to four times the rigidity of the side wall 26.

さらに半田２４の収縮力の力点を消２２の中心と仮定す
ると、パイプ２０には消２２の側壁２６に比べて２倍の
トルクが加わることになる。しかし前述したようにパイ
プ２０の剛性は側！１２６の剛性の４倍に相当するから
、パイプ２０のたわみは側壁２６のそれとくらべて１／
２であることが計算される。Furthermore, assuming that the point of force of the contraction force of the solder 24 is at the center of the eraser 22, twice as much torque will be applied to the pipe 20 as compared to the side wall 26 of the eraser 22. However, as mentioned above, the rigidity of the pipe 20 is on the side! 126, the deflection of the pipe 20 is 1/ compared to that of the side wall 26.
It is calculated to be 2.

この第一の実施態様においては、第２図に示すように、
パイプ２０をＵ字状の消２２に半田２４を用いて固定す
るとき、パイプ２０の両側において半田２４の収縮力が
異っても、側壁２６．２７がそれぞれ撓わんで、パイプ
２０を曲げようとする力を吸収し、パイプ２０の軸ずれ
、つまりレーザダイオード１２と調心された光ファイバ
１６の軸ずれを未然に防止することができる。In this first embodiment, as shown in FIG.
When fixing the pipe 20 to the U-shaped eraser 22 using solder 24, even if the shrinkage force of the solder 24 is different on both sides of the pipe 20, the side walls 26 and 27 will bend, causing the pipe 20 to bend. By absorbing this force, it is possible to prevent the axis of the pipe 20 from shifting, that is, the axis of the optical fiber 16 aligned with the laser diode 12.

第３図はこの発明の第二の実施態様の基台１１０を示す
、この実施態様においては、パイプ２０を固定する基台
１１０の表面に設ける清１２２をＶ字状とし、その側壁
１２６　、１２７を第一の実施態様について述べたよう
に、十分に薄いものとするために、基台１１０の消１２
２の下部中央に空所１３０を設け、両側壁１２６　、１
２７のそれぞれの下端を相互に離隔した自由端１３２　
、１３３にしである。FIG. 3 shows a base 110 according to a second embodiment of the present invention. In this embodiment, a groove 122 provided on the surface of the base 110 for fixing the pipe 20 is V-shaped, and its side walls 126, 127 As described for the first embodiment, the eraser 12 of the base 110 is made sufficiently thin.
A void space 130 is provided in the center of the lower part of 2, and both side walls 126, 1
free ends 132 with the lower ends of each of 27 spaced apart from each other;
, 133.

このようにすることによって、パイプ２０を基台１１０
に固定する半田２４のパイプ２０の下方の部分の半田の
収縮力を両側壁１２６　、１２７によって吸収すること
ができる。By doing this, the pipe 20 can be attached to the base 110.
The shrinkage force of the solder 24 fixed to the lower portion of the pipe 20 can be absorbed by the side walls 126 and 127.

第４図はこの発明の第三の実施態様の基台２１０を示す
、この実施態様においては、基台２１０は光ファイバ１
６を装入したパイプ２０を半田２４で固定するＵ字形の
消２２を具備する第一の実施態様と同様のものであるが
、消２２の下方に消２２の長手軸線と平行する両側面か
ら、互に対向して平行する２列の横溝２１２　、２１４
が形成しである。FIG. 4 shows a base 210 of a third embodiment of the invention. In this embodiment, the base 210 includes an optical fiber 1
This embodiment is similar to the first embodiment in which a U-shaped eraser 22 is fixed to a pipe 20 charged with a pipe 20 with solder 24, but from both sides parallel to the longitudinal axis of the eraser 22 below the eraser 22. , two rows of horizontal grooves 212 and 214 that are parallel to each other and opposite to each other.
is formed.

この第三の実施Ｂ様によれば、第５図に示すように、パ
イプ２０をＵ字状の消２２に半田２４で固定後、横１２
１２　、２１４によって薄くなった基台２１０の側部Ａ
またはＢを軸心として、基台２１０を曲げると、これら
の軸心部に集中応力が発生して、塑性変形することがで
きる。また基台２１０に部分的に厚さの薄い部位を設け
ることによって、熱伝導を軽減し、レーザダイオード１
２の熱による支障を未然に阻止することができると共に
、パイプ２０を固定する半田２４の付着性を向上するこ
とができる。According to this third embodiment B, as shown in FIG. 5, after fixing the pipe 20 to the U-shaped eraser 22 with solder 24,
12, side part A of the base 210 thinned by 214
Alternatively, when the base 210 is bent with B as the axis, concentrated stress is generated at these axes, allowing plastic deformation. In addition, by providing partially thin parts on the base 210, heat conduction is reduced and the laser diode 1
2 can be prevented from occurring, and the adhesion of the solder 24 that fixes the pipe 20 can be improved.

第６図はこの発明の第四の実施態様の基台３１０を示す
、この基台３１０は前述の第三の実施Ｂ様の基台に設け
た横溝２１２　、２１４に加えて、第三の横溝３１６が
設けである。第三の横溝３１６は、第６図に明らかであ
るように、基台３１０の消２２の長手軸線に沿い、レー
ザダイオード１２に近接する側で終っている。FIG. 6 shows a base 310 according to a fourth embodiment of the present invention. In addition to the lateral grooves 212 and 214 provided in the base of the third embodiment B described above, this base 310 has a third lateral groove. 316 is provided. A third transverse groove 316 terminates on the side proximate to the laser diode 12 along the longitudinal axis of the eraser 22 of the base 310, as seen in FIG.

以上のように、基台３１０に３列の横溝２１２゜２１４
　、３１６を設けたことによって、二次元の調整だけで
なく、三次元の調整を可能にし、レーザダイオード１２
に対する光ファイバ１６を取付けたパイプ２０の軸ずれ
の調整を容易にし、その結合効率を安定できる。As described above, the base 310 has three rows of horizontal grooves 212°214.
, 316 enables not only two-dimensional adjustment but also three-dimensional adjustment, and the laser diode 12
It is possible to easily adjust the axis misalignment of the pipe 20 to which the optical fiber 16 is attached, and to stabilize the coupling efficiency.

なお、第７図に示すように、横溝２１２゜２１４などに
は、必要量の半田２４を充てんして、前記軸ずれの調整
を容易にさせることもできる。Incidentally, as shown in FIG. 7, the lateral grooves 212 and 214 may be filled with a necessary amount of solder 24 to facilitate adjustment of the axis misalignment.

第８図はこの発明の第五の実施態様の基台１１１０を示
す、この基台４１０はレーザダイオード固定部４１４か
ら光フアイバ取付は部４１８を片持ち支持するように梢
成して、光フアイバ取付は部４１８の底面とパッケージ
ＤＩＲの内底面との間に基台空所４１２が形成しである
。FIG. 8 shows a base 1110 according to a fifth embodiment of the present invention. This base 410 has a laser diode fixing part 414 and an optical fiber mounting part 418 supported in a cantilever manner. The mounting is performed by forming a base cavity 412 between the bottom surface of the portion 418 and the inner bottom surface of the package DIR.

この実施態様の基台４１０によれば、基台４１０の光フ
アイバ取付は部４１８がパッケージＤ■Ｐの内底から浮
いた状態にしであるため、パッケージＤＩＲに外力が加
わった場合、あるいは温度に変化が生じた場合において
、パッケージＤＩＲと基台４１０との間に歪みが発生し
ても、基台空所４１２がこれを吸収して、レーザダイオ
ード１２に対して調心して取付は部４１８に固着した光
ファイバ１６の軸ずれを最小限に抑制することができる
。According to the base 410 of this embodiment, since the optical fiber attachment part 418 of the base 410 is floating from the inner bottom of the package DP, when an external force is applied to the package DIR or due to temperature Even if a change occurs and distortion occurs between the package DIR and the base 410, the base cavity 412 absorbs this, aligns with the laser diode 12, and fixes the mounting to the part 418. The misalignment of the optical fiber 16 can be suppressed to a minimum.

［発明の作用と効果］ この発明のレーザダイオード１２と光ファイバ１６との
結合基台の幾つかの好ましい実施態様について、以上に
詳述し、またそれに付随して、その作用と効果とについ
ても言及した。[Operations and Effects of the Invention] Several preferred embodiments of the coupling base between the laser diode 12 and the optical fiber 16 of the present invention have been described in detail above, and the operations and effects thereof have also been described in conjunction therewith. Mentioned.

さらに、いま、これを要約して述べる。従来の構成は、
第９図に示すように、パッケージＤＩＰに封入するレー
ザダイオード１２に光ファイバ１６を結合するには、光
フアイバ取付は台８１０に光ファイバ１６を装入した金
属パイプ２０を、レーザダイオード１２の発光領域と軸
心が一致するように調心して、半田２４で固着している
。そして、この取り付は台６１０には、金属パイプ２０
を固着する半田２４の収縮力の不均等さによるパイプ２
０の湾曲などについて全く考慮されていなかった。した
がって、レーザダイオード１２と光ファイバ１６との軸
ずれを回避することができず、レーザダイオード１２と
光ファイバ１６との結合効率を低下させる結果を招いて
いた。Furthermore, I will now summarize this. The traditional configuration is
As shown in FIG. 9, in order to couple the optical fiber 16 to the laser diode 12 enclosed in the package DIP, the optical fiber mounting is performed by inserting a metal pipe 20 into which the optical fiber 16 is inserted into a base 810, and connecting the metal pipe 20 with the optical fiber 16 to the base 810. It is aligned so that the region and axis coincide, and is fixed with solder 24. For this installation, the metal pipe 20 is attached to the base 610.
Pipe 2 due to uneven shrinkage force of solder 24 that fixes
No consideration was given to the curvature of zero. Therefore, axis misalignment between the laser diode 12 and the optical fiber 16 cannot be avoided, resulting in a reduction in coupling efficiency between the laser diode 12 and the optical fiber 16.

これに反して、この発明は特に、以上の問題点を考慮し
てされたものであって、レーザダイオード１２と光ファ
イバ１６との結合効率が格別すぐれなレーザダイオード
モジュールを得ることができる。On the other hand, the present invention has been made especially in consideration of the above problems, and it is possible to obtain a laser diode module in which the coupling efficiency between the laser diode 12 and the optical fiber 16 is particularly excellent.

【図面の簡単な説明】[Brief explanation of the drawing]

第１図はこの発明のレーザダイオードと光ファイバとの
結合基台の第一の実施態様を説明する略斜視図、第２図
は第１図の基台の作用を説明する略図、第３図はこの発
明の基台の第二の実施態様を説明する略図、第４図はこ
の発明の基台の第三の実施態様を示す略斜視図、第５図
は第４図の基台の効果を説明する略図、第６図はこの発
明の基台の第四の実施態様の略斜視図、第７図は第四の
実施態様における基台の横溝に半田を充てんすることを
説明する略斜視図、第８図はこの発明の基台の第五の実
施態様を示す略側面図で、第９図は従来の基台を有する
レーザダイオードモジュールの一例を示す一部切欠き略
斜視図である。 図面における主な参照数字を列挙すると次の通りである
。 １０、１１０　、２１０　、３１０　、４１０・旧・・
基台１２・・・・・・レーザダイオード １４、４１４・・・・・・レーザダイオード固定部１６
・・・・・・光ファイバ １８、４１８・・・・・・光フアイバ取付は部２０・・
・・・・パイプ ２２・・・・・・Ｕ字状の溝 ２４・・・・・・半田 ２６、２７・・・・・・側壁 １２２・・・・・・Ｖ字状の湧 １２６　、１２７・・・・・・Ｖ字消の側壁１３Ｇ・・
・・・・中央空所 １３２　、１３３・・・・・・Ｖ字溝側壁の自由端２１
２　、２１４　、３１６・・・・・・横溝特許出願人代
理人　　　　　　　飯　１）幸　郷はか１名： 第１図 第２図 虐 第３図 第４図 第５図　　　　第。図 第７図FIG. 1 is a schematic perspective view illustrating a first embodiment of a coupling base for a laser diode and an optical fiber according to the present invention, FIG. 2 is a schematic diagram illustrating the operation of the base shown in FIG. 1, and FIG. is a schematic diagram illustrating a second embodiment of the base of this invention, FIG. 4 is a schematic perspective view showing a third embodiment of the base of this invention, and FIG. 5 shows the effect of the base of FIG. 4. 6 is a schematic perspective view of a fourth embodiment of the base of the present invention, and FIG. 7 is a schematic perspective view illustrating filling the horizontal grooves of the base with solder in the fourth embodiment. 8 is a schematic side view showing a fifth embodiment of the base of the present invention, and FIG. 9 is a partially cutaway schematic perspective view showing an example of a laser diode module having a conventional base. . The main reference numbers in the drawings are listed below. 10, 110, 210, 310, 410・Old...
Base 12... Laser diode 14, 414... Laser diode fixing part 16
...Optical fibers 18, 418... Optical fiber installation part 20...
...Pipe 22...U-shaped groove 24...Solder 26, 27...Side wall 122...V-shaped well 126, 127・・・・・・V-shaped blank side wall 13G...
...Central void 132, 133...Free end 21 of V-shaped groove side wall
2, 214, 316... Yokomizo patent applicant's agent Ii 1) Yuki Go Haka 1 person: Figure 1 Figure 2 Figure 3 Figure 4 Figure 5. Figure 7

Claims (1)

【特許請求の範囲】 １、レーザダイオードを取付ける固定部と、光ファイバ
を装入した金属パイプを前記レーザダイオードの発光領
域の軸線と調心して半田づけする開放溝を有する取付け
部とを具備し、前記取付け部を半田の収縮力による歪み
を吸収するものとして成るレーザダイオードと光ファイ
バとの結合基台。 ２、前記開放溝をＵ字形のものとし、前記溝の両側壁を
十二分に薄くして成る請求項１に記載の基台、 ３、前記開放溝をＶ字形のものとし、前記溝の両側壁を
十二分に薄くして成る請求項１に記載の基台。 ４、前記Ｖ字形の溝の下方に中央空所を設け前記溝の両
側壁の一方の端部を前記中央空所内で自由端にして成る
請求項３に記載の基台。 ５、前記開放溝の下方に前記溝の長手軸線と平行する両
側面から互に対向して平行する複数列の横溝を設けて成
る請求項１に記載の基台。 ６、前記横溝に半田を充てんして成る請求項５に記載の
基台。 ７、前記取付け部を前記固定部に片持ち支持する構成と
し前記取付け部の底部に基台空所を形成して成る請求項
１に記載の基台。[Scope of Claims] 1. A fixing part for mounting a laser diode, and a mounting part having an open groove for soldering a metal pipe loaded with an optical fiber aligned with the axis of the light emitting region of the laser diode, A coupling base for a laser diode and an optical fiber, wherein the mounting portion absorbs distortion due to shrinkage force of solder. 2. The base according to claim 1, wherein the open groove is U-shaped, and both side walls of the groove are sufficiently thin. 3. The open groove is V-shaped, and the side walls of the groove are made sufficiently thin. The base according to claim 1, wherein both side walls are made sufficiently thin. 4. The base according to claim 3, wherein a central cavity is provided below the V-shaped groove, and one end of both side walls of the groove is a free end within the central cavity. 5. The base according to claim 1, further comprising a plurality of rows of parallel lateral grooves facing each other from both side surfaces parallel to the longitudinal axis of the groove below the open groove. 6. The base according to claim 5, wherein the horizontal groove is filled with solder. 7. The base according to claim 1, wherein the mounting part is cantilever-supported on the fixing part, and a base cavity is formed at the bottom of the mounting part.
JP12792189A 1989-05-23 1989-05-23 Base plate for coupling laser diode and optical fiber Pending JPH02308108A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12792189A JPH02308108A (en) 1989-05-23 1989-05-23 Base plate for coupling laser diode and optical fiber

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12792189A JPH02308108A (en) 1989-05-23 1989-05-23 Base plate for coupling laser diode and optical fiber

Publications (1)

Publication Number Publication Date
JPH02308108A true JPH02308108A (en) 1990-12-21

Family

ID=14971932

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12792189A Pending JPH02308108A (en) 1989-05-23 1989-05-23 Base plate for coupling laser diode and optical fiber

Country Status (1)

Country Link
JP (1) JPH02308108A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1298471A1 (en) * 2001-09-27 2003-04-02 Agilent Technologies, Inc. (a Delaware corporation) Apparatus for coupling optical elements in an optical module
WO2011122440A1 (en) * 2010-03-30 2011-10-06 株式会社フジクラ Laser device and method for manufacturing same
KR101436075B1 (en) * 2012-12-28 2014-09-01 한국광기술원 Laser diode package and manufacturing the same

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57138191A (en) * 1981-02-19 1982-08-26 Kokusai Denshin Denwa Co Ltd <Kdd> United structure of semiconductor laser and optical fiber

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57138191A (en) * 1981-02-19 1982-08-26 Kokusai Denshin Denwa Co Ltd <Kdd> United structure of semiconductor laser and optical fiber

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1298471A1 (en) * 2001-09-27 2003-04-02 Agilent Technologies, Inc. (a Delaware corporation) Apparatus for coupling optical elements in an optical module
WO2011122440A1 (en) * 2010-03-30 2011-10-06 株式会社フジクラ Laser device and method for manufacturing same
CN102822710A (en) * 2010-03-30 2012-12-12 株式会社藤仓 Laser device and method for manufacturing same
US8553736B2 (en) 2010-03-30 2013-10-08 Fujikura Ltd. Laser device and method for manufacturing same
JP5509317B2 (en) * 2010-03-30 2014-06-04 株式会社フジクラ Laser apparatus and manufacturing method thereof
EP2555030A4 (en) * 2010-03-30 2014-11-05 Fujikura Ltd Laser device and method for manufacturing same
CN102822710B (en) * 2010-03-30 2015-03-25 株式会社藤仓 Laser device and method for manufacturing same
KR101436075B1 (en) * 2012-12-28 2014-09-01 한국광기술원 Laser diode package and manufacturing the same

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