JPH0233433U - - Google Patents

Info

Publication number: JPH0233433U
Authority: JP; Japan
Prior art keywords: support plate; edge; semiconductor chip; terminal member; lead wire
Prior art date: 1988-08-26
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Granted

Application number

JP1988111185U

Other languages

English (en)

Japanese (ja)

Other versions

JPH0451476Y2 (da

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1988-08-26

Filing date

1988-08-26

Publication date

1990-03-02

1988-08-26 Application filed filed Critical

1988-08-26 Priority to JP1988111185U priority Critical patent/JPH0451476Y2/ja

1990-03-02 Publication of JPH0233433U publication Critical patent/JPH0233433U/ja

1992-12-03 Application granted granted Critical

1992-12-03 Publication of JPH0451476Y2 publication Critical patent/JPH0451476Y2/ja

Status Expired legal-status Critical Current

Links

Classifications

- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
- H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
- H10W72/07553—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting changes in shapes
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5366—Shapes of wire connectors the bond wires having kinks
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/537—Multiple bond wires having different shapes
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
- H10W72/931—Shapes of bond pads
- H10W72/932—Plan-view shape, i.e. in top view
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

Wire Bonding (AREA)

JP1988111185U 1988-08-26 1988-08-26 Expired JPH0451476Y2 (da)

Priority Applications (1)

Application Number	Priority Date	Filing Date	Title
JP1988111185U JPH0451476Y2 (da)	1988-08-26	1988-08-26

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP1988111185U JPH0451476Y2 (da)	1988-08-26	1988-08-26

Publications (2)

Publication Number	Publication Date
JPH0233433U true JPH0233433U (da)	1990-03-02
JPH0451476Y2 JPH0451476Y2 (da)	1992-12-03

Family

ID=31349014

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP1988111185U Expired JPH0451476Y2 (da)	1988-08-26	1988-08-26

Country Status (1)

Country	Link
JP (1)	JPH0451476Y2 (da)

1988
- 1988-08-26 JP JP1988111185U patent/JPH0451476Y2/ja not_active Expired

Also Published As

Publication number	Publication date
JPH0451476Y2 (da)	1992-12-03

Publication	Publication Date	Title
JPS596399U (ja)	1984-01-17	圧電振動子
JPH0323917U (da)	1991-03-12
JPS63114001U (da)	1988-07-22
JPH01161331U (da)	1989-11-09
JPS61203564U (da)	1986-12-22
JPS6377356U (da)	1988-05-23
JPS58135931U (ja)	1983-09-13	コンデンサ
JPS6448001U (da)	1989-03-24
JPH01119175U (da)	1989-08-11
JPS59152821U (ja)	1984-10-13	弾性表面波デバイス
JPS63181098U (da)	1988-11-22
JPH01165658U (da)	1989-11-20
JPH0270458U (da)	1990-05-29
JPS6448029U (da)	1989-03-24
JPS6252911U (da)	1987-04-02
JPS6435703U (da)	1989-03-03
JPS61173143U (da)	1986-10-28
JPS63156118U (da)	1988-10-13
JPS63138726U (da)	1988-09-13
JPS63134553U (da)	1988-09-02
JPS6397225U (da)	1988-06-23
JPS6343468U (da)	1988-03-23
JPS6457669U (da)	1989-04-10
JPS6228451U (da)	1987-02-20
JPS6159331U (da)	1986-04-21