JPH0235404U - - Google Patents

Info

Publication number
JPH0235404U
JPH0235404U JP11347888U JP11347888U JPH0235404U JP H0235404 U JPH0235404 U JP H0235404U JP 11347888 U JP11347888 U JP 11347888U JP 11347888 U JP11347888 U JP 11347888U JP H0235404 U JPH0235404 U JP H0235404U
Authority
JP
Japan
Prior art keywords
temperature fuse
resistor
ceramic substrate
main surface
lead wires
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11347888U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP11347888U priority Critical patent/JPH0235404U/ja
Publication of JPH0235404U publication Critical patent/JPH0235404U/ja
Pending legal-status Critical Current

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Landscapes

  • Details Of Resistors (AREA)
  • Fuses (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は、本考案の一実施例の部分断面図、第
2図は、同熱収縮チユーブを施す前の状態を示す
斜視図、第3図は、従来例の構成図、第4図は、
温度ヒユーズ付抵抗器の使用回路を示す図、第5
図は、負荷溶断特性図、第6図は、負荷溶断試験
回路図である。 10……温度ヒユーズ付抵抗器、11……抵抗
素子、12……セラミツク基板、13……膜抵抗
体、14,16……リード線、15……温度ヒユ
ーズ、17……熱収縮チユーブ。
Fig. 1 is a partial sectional view of one embodiment of the present invention, Fig. 2 is a perspective view showing the state before the heat shrink tube is applied, Fig. 3 is a configuration diagram of a conventional example, and Fig. 4 is a ,
Diagram showing the circuit used for the resistor with temperature fuse, No. 5
The figure is a load fusing characteristic diagram, and FIG. 6 is a load fusing test circuit diagram. 10... Resistor with temperature fuse, 11... Resistance element, 12... Ceramic substrate, 13... Film resistor, 14, 16... Lead wire, 15... Temperature fuse, 17... Heat shrink tube.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] セラミツク基板の一方の主面に形成された膜抵
抗体の両端部からそれぞれリード線が引き出され
た抵抗素子と、前記セラミツク基板の他方の主面
に密着するように配置され両端部からそれぞれリ
ード線が引き出された温度ヒユーズと、前記抵抗
素子と温度ヒユーズを圧力をかけて被覆する熱収
縮チユーブとからなることを特徴とする温度ヒユ
ーズ付抵抗器。
A resistor element having lead wires drawn out from both ends of a film resistor formed on one main surface of the ceramic substrate, and a resistor element having lead wires drawn from both ends of the film resistor formed on one main surface of the ceramic substrate, and lead wires extending from both ends of the film resistor arranged in close contact with the other main surface of the ceramic substrate. 1. A resistor with a temperature fuse, comprising a temperature fuse from which the temperature fuse is drawn out, and a heat shrink tube that covers the resistance element and the temperature fuse under pressure.
JP11347888U 1988-08-31 1988-08-31 Pending JPH0235404U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11347888U JPH0235404U (en) 1988-08-31 1988-08-31

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11347888U JPH0235404U (en) 1988-08-31 1988-08-31

Publications (1)

Publication Number Publication Date
JPH0235404U true JPH0235404U (en) 1990-03-07

Family

ID=31353351

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11347888U Pending JPH0235404U (en) 1988-08-31 1988-08-31

Country Status (1)

Country Link
JP (1) JPH0235404U (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS502347U (en) * 1973-05-03 1975-01-10

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS502347U (en) * 1973-05-03 1975-01-10

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