JPH0236271U - - Google Patents

Info

Publication number
JPH0236271U
JPH0236271U JP11416488U JP11416488U JPH0236271U JP H0236271 U JPH0236271 U JP H0236271U JP 11416488 U JP11416488 U JP 11416488U JP 11416488 U JP11416488 U JP 11416488U JP H0236271 U JPH0236271 U JP H0236271U
Authority
JP
Japan
Prior art keywords
chassis frame
sub
chassis
pawl
frames
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11416488U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP11416488U priority Critical patent/JPH0236271U/ja
Publication of JPH0236271U publication Critical patent/JPH0236271U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Mounting Of Printed Circuit Boards And The Like (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

図面は全て本考案の一実施例に関し、第1図は
組み立てを説明するための概略図、第2図はプリ
ント基板取り付け位置を説明するための図、第3
図はメインシヤーシフレームの図、第4図はその
A―A′線断面図、第5図は第3図のB―B′線
断面図、第6図はサブシヤーシフレームの図、第
7図は後面板の図である。 16…16……プリント基板、10……メイン
シヤーシフレーム、12,12……サブシヤーシ
フレーム、24……第1爪、26……第1係合用
孔、14……後面板、30……第2爪、34……
第2係合用孔、46,46……円柱状突起(連結
手段)、50,50……半円筒状部(連結手段)
The drawings all relate to one embodiment of the present invention, and Fig. 1 is a schematic diagram for explaining assembly, Fig. 2 is a diagram for explaining the printed circuit board mounting position, and Fig. 3 is a schematic diagram for explaining the assembly.
The figure is a diagram of the main chassis frame, Figure 4 is a cross-sectional view taken along the line A-A', Figure 5 is a cross-sectional view taken along the line B-B' in Figure 3, Figure 6 is a diagram of the sub-chassis frame, and Figure 7 is a diagram of the sub-chassis frame. The figure is a diagram of the rear plate. 16...16...Printed circuit board, 10...Main chassis frame, 12, 12...Sub chassis frame, 24...First pawl, 26...First engagement hole, 14...Rear plate, 30... Second nail, 34...
Second engagement hole, 46, 46...Cylindrical projection (connection means), 50, 50...Semi-cylindrical part (connection means)
.

Claims (1)

【実用新案登録請求の範囲】 プリント基板を支持するシヤーシフレーム機構
であつて、 キヤビネツトの底部に取り付けられるメインシ
ヤーシフレーム10と、 このメインシヤーシフレーム10の両側に対向
して垂直に取り付けられる一対のサブシヤーシフ
レーム12,12と、 このサブシヤーシフレーム12,12に設けら
れ、前記メインシヤーシフレーム10の第1爪2
4に係合する第1係合用孔26と、 前記一対のサブシヤーシフレーム12,12間
の前記メインシヤーシフレーム10の側辺に垂直
に取り付けられる後面板14と、 この後面板14に設けられ、前記メインシヤー
シフレーム10の第2爪30に係合する第2係合
用孔34と、 この後面板14及び前記一対のサブシヤーシフ
レーム12,12に設けられ、前記第2爪30の
係合時に、この3者12,12,14を連結する
連結手段46,46,50,50と、 を備えることを特徴とするシヤーシフレーム機構
[Claims for Utility Model Registration] A chassis frame mechanism that supports a printed circuit board, comprising: a main chassis frame 10 attached to the bottom of a cabinet; a pair of sub-chassis frames 12, 12, and a first pawl 2 of the main chassis frame 10 provided on the sub-chassis frames 12, 12;
4, a rear plate 14 installed perpendicularly to the side of the main chassis frame 10 between the pair of sub-chassis frames 12, 12; , a second engagement hole 34 that engages with the second pawl 30 of the main chassis frame 10; and a second engagement hole 34 that is provided in the rear plate 14 and the pair of sub-chassis frames 12, 12 and that engages the second pawl 30. A chassis frame mechanism characterized in that it sometimes comprises connecting means 46, 46, 50, 50 for connecting these three parts 12, 12, 14.
JP11416488U 1988-08-31 1988-08-31 Pending JPH0236271U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11416488U JPH0236271U (en) 1988-08-31 1988-08-31

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11416488U JPH0236271U (en) 1988-08-31 1988-08-31

Publications (1)

Publication Number Publication Date
JPH0236271U true JPH0236271U (en) 1990-03-08

Family

ID=31354662

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11416488U Pending JPH0236271U (en) 1988-08-31 1988-08-31

Country Status (1)

Country Link
JP (1) JPH0236271U (en)

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