JPH0238132U - - Google Patents
Info
- Publication number
- JPH0238132U JPH0238132U JP11611488U JP11611488U JPH0238132U JP H0238132 U JPH0238132 U JP H0238132U JP 11611488 U JP11611488 U JP 11611488U JP 11611488 U JP11611488 U JP 11611488U JP H0238132 U JPH0238132 U JP H0238132U
- Authority
- JP
- Japan
- Prior art keywords
- view
- cutting
- land portion
- perspective
- taper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 claims 1
Landscapes
- Shearing Machines (AREA)
- Accessories And Tools For Shearing Machines (AREA)
- Punching Or Piercing (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図はこの考案の一実施例を示す拡大断面図
、第２図は従来装置の全体斜視図、第３図は従来
装置の部分斜視図、第４図は従来のカツトダイの
斜視図、第５図は第４図のＡ部拡大斜視図、第６
図は従来の動作状態を示す部分斜視図、第７図は
そのＢ部拡大断面図である。
図中、６はカツトパンチ、７はカツトダイ、７
ａはランド部、７ｂは逃げ部、７ｃはテーパ部、
１３はカツト屑である。なお、図中、同一符号は
同一、又は相当部分を示す。
Fig. 1 is an enlarged sectional view showing an embodiment of this invention, Fig. 2 is an overall perspective view of a conventional device, Fig. 3 is a partial perspective view of a conventional device, Fig. 4 is a perspective view of a conventional cut die, and Fig. 4 is a perspective view of a conventional cut die. Figure 5 is an enlarged perspective view of section A in Figure 4;
The figure is a partial perspective view showing the conventional operating state, and FIG. 7 is an enlarged sectional view of section B thereof. In the figure, 6 is a cut punch, 7 is a cut die, 7
a is a land portion, 7b is a relief portion, 7c is a tapered portion,
13 is cut scraps. In addition, in the figures, the same reference numerals indicate the same or equivalent parts.
Claims (1)
導体用金型において、カツトダイのランド部に下
方に向つて拡大したテーパを設けた事を特徴とす
る半導体製造装置用金型。 A mold for semiconductor manufacturing equipment for cutting unnecessary parts of a semiconductor lead frame, characterized in that a land portion of a cutting die is provided with a taper that expands downward.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11611488U JPH0238132U (en) | 1988-09-01 | 1988-09-01 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11611488U JPH0238132U (en) | 1988-09-01 | 1988-09-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0238132U true JPH0238132U (en) | 1990-03-14 |
Family
ID=31358357
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11611488U Pending JPH0238132U (en) | 1988-09-01 | 1988-09-01 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0238132U (en) |
-
1988
- 1988-09-01 JP JP11611488U patent/JPH0238132U/ja active Pending