JPH0238476Y2 - - Google Patents

Description

[Detailed Description of the Invention] (Industrial Application Field) The present invention relates to a lead bending mechanism for an electronic component fixing device.

More specifically, the present invention relates to a lead bending mechanism of an electronic component fixing device that fixes the electronic component to the printed film board by bending the lead of the electronic component that is inserted into the mounting hole of the printed film board and protrudes toward the side opposite to the insertion surface. It is something.

(Prior Art) An electronic component fixing device that fixes the electronic component to the printed circuit board by bending the leads of the electronic component inserted into a mounting hole penetrated through a printed circuit board and protruding toward the side opposite to the insertion surface is conventional. Various types have been developed in the field, but all of them are used for thick rigid substrates such as printed bakelite substrates, and thin flexible substrates made of films with patterns printed on them are used. It could not be adopted in the case of printed film substrates.

That is, the conventional electronic component fixing device, as shown in FIG.
Since the lead 4 of the electronic component 3 inserted into the board is pushed by the movable cutter 5 and bent toward the bottom side of the board 1 using the edge of the hole 2 as a fulcrum, the printed board 1 is supported by the peripheral edge of the bottom side. Even if it is possible and can be adopted in the case of a thick rigid board such as a printed Bakelite board with a strong edge of the mounting hole 2, it can be used in the case of a thin flexible printed film board whose bottom surface needs to be fully supported. In some cases, it could not be adopted.

Therefore, in the case of a printed film board, the lower surface of the printed film board is fully supported by a support table that has recesses for holding parts on its support surface, and the electronics with leads inserted upward into the mounting holes of this board are used. setting the component in the recess,
An operator used an appropriate processing tool to bend and fix the leads protruding toward the top of the board one by one, but this type of bending resulted in low work efficiency and also caused problems with the direction of bending and the position of the bent leads relative to the board. The pressure contact state was not constant, which was unfavorable in terms of quality.

Therefore, the present inventors began developing an automatic fixing device to automate the manual lead bending described above, and after intensively studying various aspects of the bending mechanism suitable for this purpose, they found that it was easy and It has been discovered that if the grooved roller is moved via a pinion mechanism to bend the lead, the bending direction and the pressure contact state of the bending lead against the board can be kept constant at all times. However, in this method, the grooved roller was moved while rotating over the printed film substrate, so the printed film substrate was easily damaged during the movement, and an improvement was needed in this respect.

(Problems to be Solved by the Invention) The present invention focuses on these points, and as a result of intensive study from various aspects in order to improve this, the invention bends the grooved roller by moving it along the inclined guide surface. They discovered that if they were constructed according to the model, it would be possible to bend the printed film substrate without damaging it.

(Means for Solving the Problems) That is, the lead bending mechanism of the electronic component fixing device according to the present invention bends the leads of the electronic component inserted into the mounting hole of the printed film board and protruding toward the side opposite to the insertion surface. In a lead bending mechanism of an electronic component fixing device that fixes the electronic component to the printed film board by bending, an upper end thereof is fixed to a first vertical shaft connected to a piston rod of a fluid pressure actuator and a lower end of the first vertical shaft. a second vertical shaft mounted on the support so as to be movable up and down and prevented from coming off;
The upper surface of the comb-shaped fork section from the comb-shaped fork section provided with a slit for inserting the lead, and the upper end surface of the comb-shaped fork section opposite to the lower end surface that contacts the substrate surface from which the lead is protruded. a substrate holding shoe fixed to the lower end of the second vertical shaft and having a guide surface inclined toward the direction; and a shaft support rotatably supporting a grooved roller for bending the lead. The roller is characterized in that it is provided with a bracket and a leaf spring for pressing the grooved roller, one end of which is fixed to the shaft support bracket and the other end of which is fixed to the support, against the guide surface. be.

(Example) Below, a more specific explanation will be given based on the drawings.
In FIG. 1, which is a perspective view of the lead bending mechanism, 10 is a first vertical axis, 11 is a second vertical axis, 12 is a first support, 13 is a second support, 14 is an intermediate support, 15 is a compression coil spring, and 16 17 is a substrate holding shoe, 17 is a shaft support bracket, 18 is a leaf spring, the first support 12 is fixed near the upper end of the first vertical shaft 10, and the second support 13 is fixed to the lower end thereof, and, The second vertical shaft 11 is supported by both supports 12 and 13 so as to be able to move up and down, and an intermediate support 14 located between the first support 12 and the second support 13 is fixed to the second vertical shaft 11. and supports the first vertical shaft 10 so as to be movable up and down, and a compression coil spring 15 is provided around the second vertical shaft 11 and interposed between the first support 12 and the intermediate support 14. .

On the other hand, the substrate holding shoe 16 is fixed to the lower end of the second vertical shaft 11;
The second vertical shaft 11 is attached to the hole 16a shown in the figure.
A comb-like fork portion 16 into which the lower end of the fork is inserted and fixed, and a slit 16b is provided therein.
c and a guide surface 16d are formed, and this guide surface 16d is connected to the upper end surface 16f on the opposite side to the lower end surface 16e.
It is inclined from the top surface 16g toward the upper surface 16g of the comb-like fork portion 16c, and is provided with an appropriate radius of curvature R.

Further, the pivot bracket 17 is connected to the second support 1
3, one end of which is fixed to the lower end of a leaf spring 18, on which a grooved roller 19 is rotatably supported as shown in FIG. The attached roller 19 is attached to the leaf spring 1
8 to the guide surface 26d. In addition, 20 shown in FIG. 1 is a shaft joint, and the upper end of the first vertical shaft 10 and the piston rod 21 of the fluid pressure actuator are connected via this joint.

According to the lead bending mechanism configured in this way, the fluid pressure actuator is attached to an appropriate means (for example, attached to an articulated robot) and suspended above a printed film substrate supported by a support table. In this state, the intermediate support 14 is in contact with the second support 13 to prevent the second vertical shaft 11 from coming off, and the grooved roller 19 is located at the upper end of the guide surface 16d. There is.

Next, when bending the lead, the piston rod 21 of the hydraulic actuator is projected toward the substrate below.

As shown in FIG. 4, the lower surface of the printed film board is fully supported by a vacuum box type support table 22, and the leads 4 of the electronic components 3 are attached to the printed film board 23.
is inserted into the mounting hole and protrudes toward the top surface of the board. Note that the electronic component 3 is inserted and set in a component holding recess 22a provided on the support surface of the support table 22.

Therefore, when the piston rod 21 of the fluid pressure actuator is projected, the entire lead bending mechanism moves downward, and the substrate holding shoe 16 of this mechanism comes into contact with the upper surface of the printed film board 23, and the substrate holding shoe 16 is moved downward. Comb-like fork part 16c
The electronic component 3 is placed in the slit 16b provided in the slit 16b.
Lead 4 is inserted.

When the second support 13 is further extended, the second support 13 moves downward and is separated from the intermediate support 14, as shown in FIG.
The stopper 24 is fixed at a predetermined position. At the same time, the shaft support bracket 17 is pushed by the leaf spring 18 and the grooved roller 1 is pushed.
9 is rotated and moved toward the comb-like fork portion 16c of the substrate holding shoe 16.

For this reason, as shown in Figure 5,
Grooved roller 1 moved to comb-like fork portion 16c
9 pushes the leads 4 of the electronic component 3 inserted into the slit 16b and bends them inward (in the direction facing each other).

At this time, the grooved roller 19 jumps over the tip 16h of the comb-like fork portion 16c and moves onto the bent lead 4, further pressing the lead against the substrate surface. Since the movement of the printed film board 23 is restricted and strong contact is prevented, the printed film board 23 is not damaged.
Moreover, the bending direction can be kept constant at all times, and the pressure contact of the bent lead with respect to the substrate can also be kept constant at all times.

Further, since the downward movement of the second support 13 is restricted by the stopper 24, the grooved roller 19 is prevented from moving excessively and jumping over the tip of the bent lead 4. Since the part to be bent is locally nipped with the board holding shoe 16 while the air inside the table is forcibly extracted from the exhaust port 22b, the leads can be bent while keeping the printed film board 23 in a tensioned state.

Then, when the bending is completed, the piston rod 21 of the hydraulic actuator is recessed, and the entire lead bending mechanism is moved to its original position, that is, above the printed film substrate 23.

Although the most preferred embodiment of the lead bending mechanism according to the present invention has been described above, the present invention may be provided in other embodiments.

For example, the first support 12 and the compression coil spring 15 may be omitted from the lead bending mechanism in the embodiment described above.
The compression coil spring 15 is omitted, and the intermediate support 14 is replaced with a second one so as not to support the first vertical shaft 10.
It may also be provided in a form that is simply fixed to the vertical shaft 11.

Note that the first vertical shaft 10 or the second vertical shaft 11 is provided with a shaft rotation prevention means, for example, in order to prevent the grooved roller 19 from shifting with respect to the slit 16b.
It is preferable to install splines or parallel keys, etc. Furthermore, a plurality of slits 16b may be provided and the same number of grooved rollers may be installed.
The lead bending mechanism can be mounted in various ways in a suspended state.

That is, when the support table 22 supporting the printed film board 23 is mounted so that it can rotate in a horizontal plane and move in both the X and Y axes directions perpendicular to each other, an appropriate fixed frame structure is required. It is sufficient to provide a lead bending mechanism so that the mounting position on the body remains unchanged when viewed from above.On the other hand, if the support table 22 is mounted so that it cannot be moved, it can be used on a robot or the like. It is sufficient to install a lead bending mechanism so that the lead bending mechanism can be freely moved. By mounting in this manner, leads arranged in multiple directions can be bent by one bending mechanism.

Note that the grooved rollers may also be provided not only in a circular shape but also in a square shape, and when provided in this manner, the leads can be bent in an arc shape with respect to the substrate.

(Effects of the invention) As described above, according to the invention, when bending and fixing the lead of an electronic component to a thin flexible printed film board, the lead of an electronic component is not damaged, and the direction of the bending and the direction of the board are fixed. A lead bending mechanism is obtained which can always keep the pressure contact state of the bending leads constant.

[Brief explanation of the drawing]

1 to 5 show an embodiment of the present invention, FIG. 1 is a perspective view of the lead bending mechanism, FIG. 2 is a perspective view of the substrate holding shoe, and FIG. 3 is a perspective view showing the shaft support mode of the grooved roller. FIG. 4 is a vertical sectional view of the support table, FIG. 5 is a vertical sectional view showing a lead bending mode, and FIG. 6 is a vertical sectional view showing a conventional lead bending mode. 3...Electronic component, 4...Lead, 10...1st
Vertical axis, 11...Second vertical axis, 13...Second support, 14...Intermediate support, 16...Substrate holding shoe, 16b...Slit, 16c...Comb-shaped fork portion, 16d...Guide surface, 17... Pivot bracket, 18... Leaf spring, 19... Grooved roller,
21...Piston rod of fluid pressure actuator, 23...Printed film board.

Claims (1)

[Scope of utility model registration request] In a lead bending mechanism of an electronic component fixing device that fixes the electronic component to the printed film board by bending the lead of the electronic component that is inserted into the mounting hole of the printed film board and protrudes toward the side opposite to the insertion surface, the upper end thereof is bent. a first vertical shaft connected to a piston rod of a fluid pressure actuator; a support fixed to the lower end of the first vertical shaft; and a second vertical shaft attached to the support so as to be movable up and down and prevented from coming off. a shaft, a comb-like fork portion provided with a slit for inserting the lead, and the comb-like fork from the upper end surface opposite to the lower end surface that comes into contact with the substrate surface from which the lead is protruded. a substrate holding shoe fixed to the lower end of the second vertical shaft, and a grooved roller for bending the leads, each having a guide surface inclined toward the upper surface of the second vertical shaft; and a leaf spring for pressing the grooved roller, one end of which is fixed to the shaft support bracket and the other end of which is fixed to the support, against the guide surface. Lead bending mechanism for electronic component fixing devices.