JPH0240511U - - Google Patents

Info

Publication number
JPH0240511U
JPH0240511U JP11902288U JP11902288U JPH0240511U JP H0240511 U JPH0240511 U JP H0240511U JP 11902288 U JP11902288 U JP 11902288U JP 11902288 U JP11902288 U JP 11902288U JP H0240511 U JPH0240511 U JP H0240511U
Authority
JP
Japan
Prior art keywords
mold
tie rod
bush
platen
lower mold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11902288U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP11902288U priority Critical patent/JPH0240511U/ja
Publication of JPH0240511U publication Critical patent/JPH0240511U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本考案のモールドプレスの要部を示す
分解図、第2図は本考案の実施例の断面図、第3
図はモールドプレスの外観図、第4図は従来のタ
イロツドの貫通部を示す断面図、である。 図において、2A…モールド金型の上型、2B
…モールド金型の下型、3…タイロツド、4…下
型プラテン、41…ブツシユ、41a…フランジ
部、41b…隙間、61…蓋部材、62…シール
部材、である。
Figure 1 is an exploded view showing the main parts of the mold press of the present invention, Figure 2 is a sectional view of an embodiment of the present invention, and Figure 3 is a cross-sectional view of the embodiment of the present invention.
The figure is an external view of the mold press, and FIG. 4 is a sectional view showing the penetration part of a conventional tie rod. In the figure, 2A...upper mold of the mold, 2B
. . . lower die of the molding die, 3 . . . tie rod, 4 . . . lower mold platen, 41 .

Claims (1)

【実用新案登録請求の範囲】 モールド金型の下型2Bを載置して、ブツシユ
41を介して貫通するタイロツド3にガイドされ
て上下に移動する下型プラテン4を有するモール
ドプレスにおいて、 前記下型プラテン4の上面のタイロツド3貫通
部に、 前記下型プラテンのブツシユ装着穴とブツシユ
との隙間41bを覆う蓋部材61と、前記タイロ
ツド3の円周に接するシール部材62とを備えて
なることを特徴とするモールドプレス。
[Claims for Utility Model Registration] A mold press having a lower mold platen 4 on which a lower mold 2B of a mold mold is placed and moves up and down guided by a tie rod 3 penetrating through a bush 41, The tie rod 3 penetrating portion on the upper surface of the mold platen 4 is provided with a lid member 61 that covers the gap 41b between the bush mounting hole of the lower mold platen and the bush, and a seal member 62 that contacts the circumference of the tie rod 3. A mold press featuring
JP11902288U 1988-09-09 1988-09-09 Pending JPH0240511U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11902288U JPH0240511U (en) 1988-09-09 1988-09-09

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11902288U JPH0240511U (en) 1988-09-09 1988-09-09

Publications (1)

Publication Number Publication Date
JPH0240511U true JPH0240511U (en) 1990-03-20

Family

ID=31363889

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11902288U Pending JPH0240511U (en) 1988-09-09 1988-09-09

Country Status (1)

Country Link
JP (1) JPH0240511U (en)

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