JPH0241209A - Dividing method for substrate of semiconductor or the like - Google Patents

Abstract

PURPOSE:To satisfactorily perform the division of a substrate by so placing a thin plate that the face formed with the cut grooves of the substrate is opposed to a thin plate having specific Young's modulus, and pressing the cut groove top not formed with the cut groove of the substrate by a pressing member. CONSTITUTION:Many chips 2 are formed in an arranging manner, and an adhesive tape 6 adheres to the other main face having no cut groove 3 of a wafer 1 formed with lateral and longitudinal cut grooves 3 on one main face. Then, the wafer 1 is so disposed that the main face with the grooves 3 is disposed at a protective sheet 5 side through the sheet 5 on a thin plate 12 having 6X10<11> dyn/cm<2> or more of Young's modulus and the direction of the grooves 3 coincide with the extending direction of a roller 15. When the roller 15 is rotatably moved on the upper face of the tape 6, the wafer 1 is bent at a thin part 8 as a fulcrum, and collapsed at this part. The wafer 1 is rotated at 90 deg., and the roller 15 is moved. Then, the wafer 1 can be divided into many chips 2.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a method for forming kerfs in a semiconductor substrate, ceramic substrate, etc. and dividing the substrate along the kerfs.

[Conventional technology]

In manufacturing a semiconductor device, first a semiconductor substrate (C wafer) 1 shown in FIG. 6 is prepared. A p-type image area and an n-type image area are formed in the urchin/% j by diffusion or the like, and a large number of semiconductor elements C (hereinafter referred to as chips) 2 are arranged vertically and horizontally. The main surface of the sword of Uet 1 is divided into sections by vertical and horizontal kerfs 3 in the shape of a base. A cut groove 3 is provided along the step 2, and by cutting the wafer 1 with this cut #I#3, the wafer cloth is divided into a large number of chips 2VC.

FIG. 4 shows a conventional method of dividing the wafer 1. First, a protective paper 5 is placed on a rubber mud stage 4 having an elasticity of 1 as shown in FIG. Note that the adhesive tape 6 is adhered in advance to the main surface of the wafer 1 on which the cut 11$3 is not provided. Next, the roller 7 is rotated on the adhesive tape 6 in the direction of the horizontal cut #13. At this time, the roller 7 holds the adhesive tape 6, the wafer 1. The protective paper 5 is moved while being pressed against the rubber mat states 4. This j-1 [
Accordingly, the wafer 1 is cut into strips by the length t''Lfc of the longitudinal cutting grooves 3, and is divided into ? Nokiri 1113
move in the direction of As a result, the wafer 1 is broken at a portion t'' where the lateral kerf 3 is provided.

As described above, the wafer 1 can be divided into a large number of chips 2.

To explain the above method of dividing the wafer 1 in more detail, the roller 7 made of a cylindrical bar extending in the direction of the cut groove 3 of the wafer 1 is placed squarely on the part of the wafer 1 where the cut #l13 is provided. When positioned, the wafer 1 sinks into the rubber mud stage 4 as instructed.

The kerf 3 located at the bottom of the roller 7 is pushed out and the thin wall portion 8 is bent. I refuse.

[Problem to be solved by the invention]

However, with the above method, it is difficult to reliably cut the wafer 1 along the kerfs 3, and some cracks may remain, especially when the chip 2 has a small area. Although the reason for this is not necessarily clear, it can be assumed that Vc:4 is linear. That is, by being pressed by the roller 7, the rubber mud stage 4
The lower part of the roller 7 must sink as shown. This is considered to be because the breaking force is dispersed to the part to be broken located at the lower part of the roller 7 and the kerf 3 portion around it.

SUMMARY OF THE INVENTION An object of the present invention is to solve the above-mentioned problems and provide a method for reliably and efficiently dividing raw conductor substrates, ceramic substrates, etc.

[Means to solve the problem]

i! ! The present invention provides a method for dividing the substrate into a plurality of strips by forming kerfs at predetermined intervals on 10,000 main surfaces of the substrate and breaking the substrate along the kerfs. , Young's modulus is 6 x 10” dy
Prepare a substrate dividing device on which a thin plate with a diameter of 7 cm or more is installed, and place the substrate on the thin plate so that the surface of the substrate on which the groove is formed faces the thin plate. , the upper part of the kerf on the surface of the substrate where the kerf is not formed is pressed by a pressing member, and the kerf is pressed along the kerf.
The present invention relates to a method for dividing a substrate, which is characterized by cutting the substrate into one piece.

[For production]

The constructed thin plate according to the eighth aspect of the invention has the function of concentrating the pressing force from a pressing member such as a roller on a part of the kerf and L. Therefore, it becomes possible to couple the divisions of the substrate well.

〔Example〕

Next, a wafer dividing method according to an embodiment of the present invention will be explained with reference to FIGS. 1 to 3.

The wafer dividing device 11 used in this embodiment shown in the first example includes a thin stainless steel plate 1112 for forming a stage, and a thin plate construction device 13 for the stage.

It has a mounting table 14 and a roller 15 as a pressing member. The stage thin plate construction device 13 consists of four support columns 16 fixed to the mounting tables 14, and a rod-shaped member 17 for attaching the thin plate, which is placed between the two support columns 16 and arranged opposite to each other. Both ends of the stage thin film 1!112 are attached to the rod-like members 17, and stretched between the rod-like members 17 above the stage 14. The roller 15 has a circular cross section, and its diameter is about 1.5 to 6 times the distance between adjacent kerfs 3 on the wafer 1. Moreover, the roller 15 is a-
It is rotatably attached to the two support body 18. The roller support 18 is guided by the groove 19 of the mounting table 14 in the direction of arrow 2.
It is movable in the direction indicated by 0. In addition.

The height of the roller 15 from the ± surface of the mounting table 14 is equal to the height of the thin plate 12.
It is located at a lower height than the height position of both ends. To ensure this, the thin plate 12 is pressed downward at the portion where the roller 15 is located. However, since both ends of the thin plate 12 are fixed to the rod-shaped member 17, the thin plate 12 will not bend between the portion pressed by the roller 15 and both ends.

Next, a wafer 1 is prepared in which a large number of chips 2 are formed in an array in the same way as in the prior art, and furthermore, vertical and horizontal grooves 3 are formed on one main surface side. Cut groove 3 is made using the well-known two-dicing method, N
It is formed by bringing a peripheral blade that rotates at high speed into contact with the wafer 1. next.

An adhesive tape 6 is attached to the main surface of the wafer 1 on which the kerf 3 is not formed.

Next, the Uninow 11 is placed on the thin plate 12 with the protective paper 5 interposed therebetween. In addition, the sea urchin/) 1 is arranged so that the main surface of the sea urchin 1 on which the kerf 3 is formed is on the protective paper 5 side. Further, the sea urchin (1) is arranged so that the direction of the longitudinally extending kerf 3 substantially coincides with the direction in which the roller 15 extends. When arranging the wafer 1 provided with the protective paper 5 and the adhesive tape 6, the roller 15 is positioned close to the rod-shaped member 17, and the protective paper 5 and the adhesive tape 11 are positioned approximately at the center of the thin plate 12.

Next, the roller 15 is rotated on the upper surface of the adhesive tube A. At this time, the roller 15 extends in the direction of the vertical kerf 6 of the wafer 1, and the roller 15 extends in the direction of the lateral kerf 6 of the wafer 1.
move it in the direction of The height position of the roller 15 from the top surface of the thin plate 12 is always constant;
It is lower than the height position of both ends. therefore,
Adhesive tape 6, wafer 1. Protective paper5. When the thin plate 12 is pressed down by the roller 15, this portion hangs down as shown in FIG. As a result, sticky cheese 6, wafer 1. Protective paper5. Thin 8 [12 is bent using the portion pressed by roller 15 as a fulcrum. The roller 15 is the thin wall s8 of the wafer 1
When positioned squarely, the wafer 1 bends using the thin portion 8 as a fulcrum. As a result, the wafer 1 is reliably broken at this thin portion 8. Note that the portion where the kerf 3 is not formed, that is, the portion corresponding to the tip 2, is thicker than the thin portion 8, so that no cranking or the like occurs due to the pressure of the roller 15. Roller 15 to wafer 1
By moving from one end to the other, the roller 15 presses against all the thin sections 8 formed by the longitudinal grooves 3 of the sea urchin/% 1. As a result, the wafer 1 is broken at the longitudinal grooves 3 and divided into strips.

Next, the wafer 1 is rotated 90 degrees and placed on the thin plate 12 in order to cut the wafer 1 along the kerf 3 extending laterally. That is, the direction of the groove 6 extending in the horizontal direction is the direction of the roller 1.
The wafer 1 is arranged so as to substantially match the extending direction of the wafer 5.

Note that the wafer 1 divided into strips is covered with an adhesive tape 6.
Since the wafer 1 is affixed to the wafer 1, the arrangement will not be disrupted even if the wafer 1 is rotated as described above. The roller 15 extends in the direction of the lateral cut @3 of the wafer 1, and extends in the direction of the longitudinal cut groove 3 of the wafer 1 (strictly speaking, since the wafer 1 has already been broken in the longitudinal direction, it extends in the direction of the break line). ]. Adhesive tape 6, Unino 1, protective paper 5. Thin plate 1
2 is pressed by the roller 15 in the same manner as described above, and is bent using the lower part of the roller 15 as a fulcrum. The rollers 15 move along the thin section 8 formed by the lateral kerf 3 of the wafer 1.
When the wafer 1 is positioned in the opposite direction, the wafer 1 is bent using the thin portion 8 as a fulcrum and is reliably broken. By moving the roller 15 and pressing all the thin parts 8 in the lateral direction, the sea urchin 11 can be divided into a large number of steps 2. Note that the large number of chips 2 attached to the adhesive tape 6Vc can be easily peeled off by stretching the adhesive tape 6.

This embodiment has the following effects.

fil The wafer 1 can be divided reliably, favorably, and easily. That is, the thin plate 12 of this embodiment has a Young's modulus of about 1.
9'x IQ"dyn/cm' stainless steel plate material: C
There is substantially no shrinkage of the thin plate 12 in the thickness direction due to the pressing force of the roller 15. For this reason.

The conventional roller 11 shown in FIG. 4 sinks into the stage 4 and the pressing force from the roller 7 is dispersed.
! The pressing force can be applied more intensively to the thin portion 8 to be broken than shown in the second □□□.

(2) The thin plate 12 is a thin plate with a purity of about 100 μm, and its thickness is 172 mm or less of the thickness of the wafer 1. Furthermore, since both ends of the thin plate 12 are fixed to the erection device 13, when pushed by the rollers 15.

Tension is applied to the thin plate 12 in this extending direction.

Therefore, the thin plate 12 does not bend from the fulcrum to both ends, as shown in FIG. 2, and does not curve significantly near the fulcrum. Therefore, the wafer 1 that has come into contact with the thin layer a12 via the protective paper 5 can be bent well using the thin portion 8 pressed by the roller 15 as a fulcrum.

As a result of the above, the wafer 1 can be reliably divided along the kerf 3, and no cracks remain as in the conventional method.

(31 As mentioned above, the wafer 1 does not sink into the thin layer a12, so the shearing force unlike the conventional example does not occur in the thin wall portion 8 of the non-breakable portion. Therefore, the wafer 1 can be cut well. .

(The thin plate 12 has elastic force, and the hanging portion of the thin plate 112 rises after the roller 15 moves.

Therefore, since the fulcrum portion of the bending of the wafer 1 follows the movement of the roller 15, the wafer 1 can be easily divided by moving the roller 15.

[Modified example]

The present invention is not limited to the embodiments described above.

For example, the following transformations are possible.

(II In the embodiment, the angle θ of the thin plate 12 with respect to the virtual tangent line touching the fulcrum of the thin plate 12 was approximately 5 degrees.

However, this angle is the plane size of step 2, g-cut groove 3
This is not the case because the optimum value changes depending on the distance between the wafers 1 and the thickness of the wafer 1, etc. However, it has been confirmed that when the angle θ is set to 2 to 10 degrees, the frequency of remaining cracks in the wafer 1 is small.

(2) In the embodiment, the diameter of the roller 15 was set to 1.5 to 6 times the interval between the grooves 3, but by setting the diameter to 1 to 10 times, the wafer 1 can be reliably divided.

(31 The material of the thin plate 12 is not limited to stainless steel. However, it is desirable that the thin plate 12 satisfy the following conditions.

(a+ The wafer 1 does not substantially sink during pressing.

(bl The C fulcrum part, where the angle θ with respect to the tangent line can be made acute, does not curve significantly).

tc+ There is no bending between the fulcrum and both ends (and a nearly straight state can be maintained).

The Young's modulus is set to 6.0 to fully satisfy the following conditions. O
X 10 dyn/cm' or more, even 10.0X
It is desirable to form the stage thin plate 12 with a coverage of 10 dyn/cm' or more. Further, the thickness of the thin plate 12 is preferably 300 μm or less, preferably 150 μm or less (less than wafer wear, preferably 172 mm or less of wafer thickness). However, in order to obtain sufficient strength, the lower limit is preferably 50 μm or more.

(The above bending angle θ may be determined by bringing the fulcrum of the thin plate 12 into contact with the upper surface of the mounting table 14 when pressing 41.

(51) The present invention is effective not only for dividing fast conductor wafers but also for dividing ceramic substrates on which resistors and capacitors are arranged in an array.

(The 61 roller 15 may press the wafer 1 intermittently. For example, the wafer 1 may be pressed with one kerf 3, the pressure released, the roller 15 moved, and the wafer 1 pressed again with the primary kerf 3. good.

〔Effect of the invention〕

As mentioned above, according to one aspect of the present invention, the substrate can be made in good condition.

And it can certainly be divided more easily.

[Brief explanation of the drawing]

FIG. 1 shows a dividing device according to an embodiment of the present invention.
1 2nd rI! J is an enlarged longitudinal section of a part of FIG. 1. FIG. 3 is a perspective view of the wafer viewed from the kerf side. FIG. 4 is a longitudinal section showing a conventional dividing device. 1... Wafer 2... Chip, 3... Cut groove, 6...
...adhesive tape, 11...dividing device, 12...thin plate for stage.

Claims (1)

[Claims] A method of dividing the substrate into a plurality of strips by forming kerfs at predetermined intervals on one main surface of the substrate and breaking the substrate along the kerfs, comprising: rate is 6×10
Prepare a substrate dividing device on which a thin plate of ^1^1 dyn/cm^2 or more is installed, and place the substrate on the thin plate so that the surface of the substrate where the kerf is formed faces the thin plate. A method for dividing a substrate, comprising: placing the substrate on the substrate, and pressing an upper part of the kerf on a surface of the substrate where the kerf is not formed with a pressing member to break the substrate along the kerf.