JPH0242432U - - Google Patents

Info

Publication number
JPH0242432U
JPH0242432U JP1988122988U JP12298888U JPH0242432U JP H0242432 U JPH0242432 U JP H0242432U JP 1988122988 U JP1988122988 U JP 1988122988U JP 12298888 U JP12298888 U JP 12298888U JP H0242432 U JPH0242432 U JP H0242432U
Authority
JP
Japan
Prior art keywords
discharge electrode
discharge
capillary
nozzle
wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1988122988U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988122988U priority Critical patent/JPH0242432U/ja
Publication of JPH0242432U publication Critical patent/JPH0242432U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01551—Changing the shapes of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07511—Treating the bonding area before connecting, e.g. by applying flux or cleaning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped

Landscapes

  • Wire Bonding (AREA)

Description

【図面の簡単な説明】
第１図はこの考案に係るワイヤボンダの一実施
例を示す正面図である。第２図はワイヤボンデイ
ングに用いるキヤピラリの断面図、第３図は従来
のワイヤボンダの正面図である。 １……キヤピラリ、６……金属細線（アルミニ
ウム線）、９……金属ボール形成位置、１１……
放電電極、１１ａ……起立部、１２……ノズル。

Claims (1)

    【実用新案登録請求の範囲】
  1. 放電によつてキヤピラリにガイドされた金属細
    線の先端に金属ボールを形成する放電電極と、放
    電電極面に沿つて非酸化性ガスを供給するノズル
    とを有し、上記放電電極の遊端部に起立部を突設
    したことを特徴とするワイヤボンダ。
JP1988122988U 1988-09-19 1988-09-19 Pending JPH0242432U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988122988U JPH0242432U (ja) 1988-09-19 1988-09-19

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988122988U JPH0242432U (ja) 1988-09-19 1988-09-19

Publications (1)

Publication Number Publication Date
JPH0242432U true JPH0242432U (ja) 1990-03-23

Family

ID=31371430

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988122988U Pending JPH0242432U (ja) 1988-09-19 1988-09-19

Country Status (1)

Country Link
JP (1) JPH0242432U (ja)

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