JPH0242436U - - Google Patents
Info
- Publication number
- JPH0242436U JPH0242436U JP1988121851U JP12185188U JPH0242436U JP H0242436 U JPH0242436 U JP H0242436U JP 1988121851 U JP1988121851 U JP 1988121851U JP 12185188 U JP12185188 U JP 12185188U JP H0242436 U JPH0242436 U JP H0242436U
- Authority
- JP
- Japan
- Prior art keywords
- collet
- electronic components
- utility
- scope
- shape
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
- H10W72/07141—Means for applying energy, e.g. ovens or lasers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
- H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Die Bonding (AREA)
- Gripping Jigs, Holding Jigs, And Positioning Jigs (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988121851U JPH0242436U (mo) | 1988-09-17 | 1988-09-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988121851U JPH0242436U (mo) | 1988-09-17 | 1988-09-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0242436U true JPH0242436U (mo) | 1990-03-23 |
Family
ID=31369239
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988121851U Pending JPH0242436U (mo) | 1988-09-17 | 1988-09-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0242436U (mo) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5515265A (en) * | 1978-07-20 | 1980-02-02 | Mitsubishi Electric Corp | Collet for assembling semiconductor device |
-
1988
- 1988-09-17 JP JP1988121851U patent/JPH0242436U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5515265A (en) * | 1978-07-20 | 1980-02-02 | Mitsubishi Electric Corp | Collet for assembling semiconductor device |