JPH0242437U - - Google Patents
Info
- Publication number
- JPH0242437U JPH0242437U JP12133988U JP12133988U JPH0242437U JP H0242437 U JPH0242437 U JP H0242437U JP 12133988 U JP12133988 U JP 12133988U JP 12133988 U JP12133988 U JP 12133988U JP H0242437 U JPH0242437 U JP H0242437U
- Authority
- JP
- Japan
- Prior art keywords
- pushing
- push
- needle
- adhesive sheet
- peripheral
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 230000002093 peripheral effect Effects 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 claims 2
- 230000001070 adhesive effect Effects 0.000 claims 2
Description
第１図ａ乃至ｃは本考案の第１実施例をその作
用と共に示す断面図、第２図ａ乃至ｃは本考案の
第２実施例をその作用と共に示す断面図である。
１，１Ａ……突上げ針、２，２Ａ……周辺突上
げ部、２ａ……中空軸、２Ａａ……突上げピン、
３……半導体素子、４……シート、５……コレツ
ト、６……突上げガイド。
FIGS. 1A to 1C are sectional views showing a first embodiment of the present invention together with its operation, and FIGS. 2A to 2C are sectional views showing a second embodiment of the present invention together with its operation. 1, 1A... Push-up needle, 2, 2A... Peripheral push-up portion, 2a... Hollow shaft, 2Aa... Push-up pin,
3... Semiconductor element, 4... Sheet, 5... Collet, 6... Push-up guide.
Claims (1)
ずつ突き上げる装置において、前記半導体素子の
略中心箇所を突き上げる先端を尖らせた突上げ針
と、この突上げ針の周囲に配設して半導体素子の
周辺部に近い箇所を突き上げる周辺突上げ部とを
備え、かつ前記突上げ針と周辺突上げ部とを夫々
独立して上下移動できるように構成したことを特
徴とする半導体素子の突上げ装置。 In an apparatus for pushing up individualized semiconductor devices one by one on an adhesive sheet, a push-up needle with a sharp tip that pushes up approximately the center of the semiconductor device, and a push-up needle arranged around this push-up needle are used to push up semiconductor devices one by one on an adhesive sheet. A device for pushing up a semiconductor device, comprising: a peripheral pushing-up portion for pushing up a portion near the periphery of the device, and the pushing-up needle and the peripheral pushing-up portion are configured to be able to move up and down independently of each other. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12133988U JPH0242437U (en) | 1988-09-16 | 1988-09-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12133988U JPH0242437U (en) | 1988-09-16 | 1988-09-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0242437U true JPH0242437U (en) | 1990-03-23 |
Family
ID=31368257
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12133988U Pending JPH0242437U (en) | 1988-09-16 | 1988-09-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0242437U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010192648A (en) * | 2009-02-18 | 2010-09-02 | Canon Machinery Inc | Debonding apparatus and debonding method |
-
1988
- 1988-09-16 JP JP12133988U patent/JPH0242437U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010192648A (en) * | 2009-02-18 | 2010-09-02 | Canon Machinery Inc | Debonding apparatus and debonding method |