JPH024243U - - Google Patents
Info
- Publication number
- JPH024243U JPH024243U JP8183788U JP8183788U JPH024243U JP H024243 U JPH024243 U JP H024243U JP 8183788 U JP8183788 U JP 8183788U JP 8183788 U JP8183788 U JP 8183788U JP H024243 U JPH024243 U JP H024243U
- Authority
- JP
- Japan
- Prior art keywords
- tool
- heating element
- thermode
- thermode tool
- tool head
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000010438 heat treatment Methods 0.000 claims description 7
- 238000007664 blowing Methods 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 claims 2
- 238000001816 cooling Methods 0.000 claims 1
- 239000000112 cooling gas Substances 0.000 claims 1
- 238000007599 discharging Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Landscapes
- Wire Bonding (AREA)
Description
第１図は本発明の斜視図、第２図は第１図のツ
ールヘツド部の斜視図、第３図は第１図のサーモ
ードツール本体部の斜視図、第４図は第１図を使
用したインナーボンテイング工程の概要図、第５
図はキヤリヤテープ２コマ分の平面図、第６図は
従来のサーモードツールの斜視図である。
１……サーモードツール本体、２……ツールヘ
ツド、３……発熱体、４ａ，ｂ……発熱体電極、
５ａ―１，２……本体電極、８……吹き付け孔、
９……吸い込み孔。
Fig. 1 is a perspective view of the present invention, Fig. 2 is a perspective view of the tool head of Fig. 1, Fig. 3 is a perspective view of the thermode tool body of Fig. 1, and Fig. 4 uses Fig. 1. Schematic diagram of the inner bonding process, Part 5
The figure is a plan view of two frames of carrier tape, and FIG. 6 is a perspective view of a conventional thermode tool. 1...Thermode tool body, 2...Tool head, 3...Heating element, 4a, b...Heating element electrode,
5a-1, 2...Body electrode, 8...Blowing hole,
9... Suction hole.
Claims (1)
ルヘツドとより成る半導体接続サーモードツール
において該ツールヘツドが、その先端部に設けた
四角形の枠状の発熱体と、サーモードツール本体
の各電極に接合し、該発熱体と一体化された発熱
体電極とより成るとともに、その発熱体の断面積
を各辺ごとにボンデイング時に吸収される熱量に
ほぼ半比例した大きさとしたことを特徴とする半
導体接続用サーモードツール。 ２ サーモードツール本体を貫通し、上記発熱体
を冷却するための冷却用気体の吹き付け孔と、発
生するスパツタを吸収し、外部に排出する吸込み
孔とを設けたことを特徴とする請求項１記載の半
導体接続用サーモードツール。[Claims for Utility Model Registration] 1. A semiconductor-connected thermode tool consisting of a thermode tool body and a tool head fitted into the tool head, in which the tool head has a rectangular frame-shaped heating element provided at its tip, and a thermode tool body. It consists of a heating element electrode bonded to each electrode of the tool body and integrated with the heating element, and the cross-sectional area of the heating element is made approximately half proportional to the amount of heat absorbed during bonding on each side. A thermode tool for semiconductor connection characterized by: 2. Claim 1, characterized in that a cooling gas blowing hole for cooling the heating element and a suction hole for absorbing generated spatter and discharging it to the outside are provided through the thermode tool main body. Thermode tool for connecting semiconductors as described.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8183788U JPH0451479Y2 (en) | 1988-06-21 | 1988-06-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8183788U JPH0451479Y2 (en) | 1988-06-21 | 1988-06-21 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH024243U true JPH024243U (en) | 1990-01-11 |
| JPH0451479Y2 JPH0451479Y2 (en) | 1992-12-03 |
Family
ID=31306607
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8183788U Expired JPH0451479Y2 (en) | 1988-06-21 | 1988-06-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0451479Y2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0583425U (en) * | 1992-04-22 | 1993-11-12 | 若井産業株式会社 | Interlocking nail tape |
| JPH0659616U (en) * | 1993-02-01 | 1994-08-19 | 兼松日産農林株式会社 | Continuous nail band |
-
1988
- 1988-06-21 JP JP8183788U patent/JPH0451479Y2/ja not_active Expired
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0583425U (en) * | 1992-04-22 | 1993-11-12 | 若井産業株式会社 | Interlocking nail tape |
| JPH0659616U (en) * | 1993-02-01 | 1994-08-19 | 兼松日産農林株式会社 | Continuous nail band |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0451479Y2 (en) | 1992-12-03 |