JPH0242466U - - Google Patents
Info
- Publication number
- JPH0242466U JPH0242466U JP12245688U JP12245688U JPH0242466U JP H0242466 U JPH0242466 U JP H0242466U JP 12245688 U JP12245688 U JP 12245688U JP 12245688 U JP12245688 U JP 12245688U JP H0242466 U JPH0242466 U JP H0242466U
- Authority
- JP
- Japan
- Prior art keywords
- transparent substrate
- cog
- cutting
- substrate
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structure Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12245688U JPH0242466U (de) | 1988-09-19 | 1988-09-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12245688U JPH0242466U (de) | 1988-09-19 | 1988-09-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0242466U true JPH0242466U (de) | 1990-03-23 |
Family
ID=31370407
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12245688U Pending JPH0242466U (de) | 1988-09-19 | 1988-09-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0242466U (de) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08160406A (ja) * | 1994-11-29 | 1996-06-21 | Korea Electron Telecommun | 側面接合を利用した大面積の平板ディスプレーの製造方法 |
| JP2015026719A (ja) * | 2013-07-26 | 2015-02-05 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法 |
-
1988
- 1988-09-19 JP JP12245688U patent/JPH0242466U/ja active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08160406A (ja) * | 1994-11-29 | 1996-06-21 | Korea Electron Telecommun | 側面接合を利用した大面積の平板ディスプレーの製造方法 |
| JP2015026719A (ja) * | 2013-07-26 | 2015-02-05 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法 |
| US10032745B2 (en) | 2013-07-26 | 2018-07-24 | Renesas Electronics Corporation | Method of manufacturing semiconductor device |
| US10192851B2 (en) | 2013-07-26 | 2019-01-29 | Renesas Electronics Corporation | Method of manufacturing semiconductor device |
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