JPH024248U - - Google Patents

Info

Publication number
JPH024248U
JPH024248U JP8181088U JP8181088U JPH024248U JP H024248 U JPH024248 U JP H024248U JP 8181088 U JP8181088 U JP 8181088U JP 8181088 U JP8181088 U JP 8181088U JP H024248 U JPH024248 U JP H024248U
Authority
JP
Japan
Prior art keywords
package
semiconductor device
penetrating
cavity
utility
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8181088U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP8181088U priority Critical patent/JPH024248U/ja
Publication of JPH024248U publication Critical patent/JPH024248U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Description

【図面の簡単な説明】
第１図は本考案の一実施例の斜視図、第２図は
第１図の平面図、第３図は第２図のＤ−Ｄ′間の
縦断面図、第４図は本考案の他の実施例である。

Claims (1)

    【実用新案登録請求の範囲】
  1. 半導体装置用パツケージの表面から裏面に貫通
    する穴（空洞）を有することを特徴とする半導体
    装置用パツケージ。
JP8181088U 1988-06-20 1988-06-20 Pending JPH024248U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8181088U JPH024248U (ja) 1988-06-20 1988-06-20

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8181088U JPH024248U (ja) 1988-06-20 1988-06-20

Publications (1)

Publication Number Publication Date
JPH024248U true JPH024248U (ja) 1990-01-11

Family

ID=31306580

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8181088U Pending JPH024248U (ja) 1988-06-20 1988-06-20

Country Status (1)

Country Link
JP (1) JPH024248U (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011096696A (ja) * 2009-10-27 2011-05-12 Mitsubishi Electric Corp 半導体装置
JP2016136604A (ja) * 2015-01-23 2016-07-28 三菱電機株式会社 半導体装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011096696A (ja) * 2009-10-27 2011-05-12 Mitsubishi Electric Corp 半導体装置
JP2016136604A (ja) * 2015-01-23 2016-07-28 三菱電機株式会社 半導体装置

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