JPH0242786U - - Google Patents
Info
- Publication number
- JPH0242786U JPH0242786U JP1988119807U JP11980788U JPH0242786U JP H0242786 U JPH0242786 U JP H0242786U JP 1988119807 U JP1988119807 U JP 1988119807U JP 11980788 U JP11980788 U JP 11980788U JP H0242786 U JPH0242786 U JP H0242786U
- Authority
- JP
- Japan
- Prior art keywords
- workpiece
- cut
- gripping device
- laser processing
- processing table
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000003028 elevating effect Effects 0.000 claims 1
Description
図面は本考案の一実施例を示し、第１図は要部
の縦断正面図、第２図は縦断側面図、第３図は斜
視図である。
図面中、１は加工テーブル、３は加工ヘツド、
４はワーク、５は把持装置、７は押え機構、１１
は昇降機構である。
The drawings show an embodiment of the present invention, with FIG. 1 being a longitudinal sectional front view of the main parts, FIG. 2 being a longitudinal sectional side view, and FIG. 3 being a perspective view. In the drawing, 1 is a processing table, 3 is a processing head,
4 is a workpiece, 5 is a gripping device, 7 is a holding mechanism, 11
is a lifting mechanism.
Claims (1)
した状態で前記ワークとレーザー加工ヘツドとを
相対移動させて前記ワークを所定の形状に切断す
るようにしたものにおいて、前記ワークの切り離
し部分を前記加工テーブル上に押え付ける押え機
構と、その押え付け状態で前記ワークを把持せる
把持装置を上昇させる昇降機構とを設けたことを
特徴とするレーザー加工装置。 The workpiece is cut into a predetermined shape by moving the workpiece and a laser processing head relative to each other while the workpiece on the processing table is gripped by a gripping device, wherein the cut-off portion of the workpiece is cut onto the processing table. 1. A laser processing device comprising: a presser mechanism that presses the workpiece; and an elevating mechanism that raises a gripping device that can grip the workpiece in the pressed state.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988119807U JPH0634071Y2 (en) | 1988-09-14 | 1988-09-14 | Laser processing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988119807U JPH0634071Y2 (en) | 1988-09-14 | 1988-09-14 | Laser processing equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0242786U true JPH0242786U (en) | 1990-03-23 |
| JPH0634071Y2 JPH0634071Y2 (en) | 1994-09-07 |
Family
ID=31365361
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988119807U Expired - Lifetime JPH0634071Y2 (en) | 1988-09-14 | 1988-09-14 | Laser processing equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0634071Y2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07214359A (en) * | 1994-01-27 | 1995-08-15 | Amada Co Ltd | Laser processing method and device |
| JPWO2020246153A1 (en) * | 2019-06-06 | 2020-12-10 |
-
1988
- 1988-09-14 JP JP1988119807U patent/JPH0634071Y2/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07214359A (en) * | 1994-01-27 | 1995-08-15 | Amada Co Ltd | Laser processing method and device |
| JPWO2020246153A1 (en) * | 2019-06-06 | 2020-12-10 | ||
| WO2020246153A1 (en) * | 2019-06-06 | 2020-12-10 | 村田機械株式会社 | Conveying device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0634071Y2 (en) | 1994-09-07 |