JPH0242899B2 - - Google Patents
Info
- Publication number
- JPH0242899B2 JPH0242899B2 JP62253063A JP25306387A JPH0242899B2 JP H0242899 B2 JPH0242899 B2 JP H0242899B2 JP 62253063 A JP62253063 A JP 62253063A JP 25306387 A JP25306387 A JP 25306387A JP H0242899 B2 JPH0242899 B2 JP H0242899B2
- Authority
- JP
- Japan
- Prior art keywords
- target
- oxide
- optical
- thin film
- magneto
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
- C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Thin Magnetic Films (AREA)
Description
【発明の詳細な説明】
[産業上の利用分野]
本発明は、磁気光学効果の大きい強磁性化合物
の薄膜製造に用いられるターゲツトとその製造方
法に関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a target used for producing a thin film of a ferromagnetic compound having a large magneto-optical effect, and a method for producing the target.
[従来の技術]
近年、情報の処理,貯蔵,伝達の高性能化,高
密度化,高信頼化のため、光技術の重要性が増し
つつあり、光技術開発の一環として、磁気光学新
材料の研究開発が行なわれている。磁気光学材料
は磁気光学素子や、光熱磁気記録の媒体に用いら
れるものであり、前者では、高性能化とともに、
光集積回路に組みこむために集積化技術との整合
性のよい薄膜形成法の開発が重要となつている。[Conventional technology] In recent years, the importance of optical technology has been increasing to improve the performance, density, and reliability of information processing, storage, and transmission.As part of the development of optical technology, new magneto-optical materials are being developed. Research and development is underway. Magneto-optical materials are used in magneto-optical elements and photothermal magnetic recording media, and in the former, as well as improving performance,
It is important to develop thin film formation methods that are compatible with integration technology in order to incorporate them into optical integrated circuits.
光集積回路では、光部品の端面や光線路の曲部
での反射により、戻り光が発生する。戻り光は光
源であるレーザーの発振を不安定にする。磁気光
学効果を利用して、一方向にだけ光を通す光アイ
ソレーターは、戻り光をカツトする重要な光回路
部品である。さらに、入出力光を分離するサーキ
ユレーター,光回路を切り換える光スイツチ,光
の方向を一定の角度範囲で掃引する光偏向器など
は、磁気光学効果を利用して実現できる。 In optical integrated circuits, return light is generated due to reflection at end faces of optical components and curved portions of optical paths. The returned light makes the oscillation of the laser, which is the light source, unstable. Optical isolators, which use magneto-optic effects to pass light in only one direction, are important optical circuit components that cut out returning light. Furthermore, circulators that separate input and output light, optical switches that switch optical circuits, and optical deflectors that sweep the direction of light within a certain angle range can be realized using the magneto-optic effect.
磁気光学材料としては、素子長を小さくするた
めに、使用する光の波長帯域でフアラデー回転
(θF;単位は度/cm)などの磁気光学効果が大き
く、また、挿入損失の点から光吸収係数(α;単
位は1/cm)が小さいことが大切である。磁気光
学性能指数は、単位吸収当りのフアラデー回転角
(θF/α;単位は度)で定義される。 In order to reduce the element length, magneto-optic materials have large magneto-optic effects such as Faraday rotation (θ F ; units are degrees/cm) in the wavelength band of the light used, and optical absorption is important in terms of insertion loss. It is important that the coefficient (α; unit: 1/cm) is small. The magneto-optical figure of merit is defined by the Faraday rotation angle per unit absorption (θ F /α; units are degrees).
現在、実用化されている材料は、希土類鉄ガー
ネツト(R3Fe5O12;Rは希土類金属元素および
イツトリウムを表わす)系だけである。現在知ら
れている材料の中で、室温で磁気光学性能指数が
高く、光学的に等方性という条件を、一応満足し
ているのは、YIG(Y3Fe5O12)に代表される鉄ガ
ーネツトである。YIGの波長633nmにおけるθFは
+835度/cm、αは700 1/cmであり、磁気光学
性能指数は1.2度である。素子化するには、偏光
面が45度回転すればよいから、必要な光路長は、
約500μmである。しかし、光集積回路の構成要素
として扱うには、光路長をもう2桁程短縮するこ
とが必要となる。そのためにはθFが2桁程大きい
材料の開発が必要である。R3Fe5O12のRをBiで
置換した結晶は、高いθFをもつ材料として注目さ
れる。 Currently, the only material in practical use is the rare earth iron garnet (R 3 Fe 5 O 12 ; R represents a rare earth metal element and yttrium). Among currently known materials, YIG (Y 3 Fe 5 O 12 ) is a material that has a high magneto-optical figure of merit at room temperature and satisfies the requirements of being optically isotropic. It is iron garnet. θ F at a wavelength of 633 nm for YIG is +835 degrees/cm, α is 700 1/cm, and the magneto-optical figure of merit is 1.2 degrees. To create a device, the plane of polarization only needs to be rotated by 45 degrees, so the required optical path length is
It is approximately 500 μm. However, in order to treat it as a component of an optical integrated circuit, it is necessary to shorten the optical path length by about two orders of magnitude. To achieve this, it is necessary to develop a material with θ F that is about two orders of magnitude larger. Crystals in which R in R 3 Fe 5 O 12 is replaced with Bi are attracting attention as materials with high θ F .
薄膜を製造する方法であるイオンビームスパツ
タ堆積(IBS)は本質的に非熱平衡的過程であ
る。スパツタされた粒子は、数eV付近にエネル
ギー分布のピークをもつ。このエネルギーは堆積
に適しており、エツチングはほとんど起こらな
い。このエネルギーを熱エネルギーに換算すると
数万度におけるエネルギーに相当し、堆積粒子の
表面拡散や結晶化反応を促進する。その結果、膜
の密度,平滑度,付着力の向上および結晶化温度
の低温化が期待できる。 Ion beam sputter deposition (IBS), a method for producing thin films, is an inherently non-thermal equilibrium process. Sputtered particles have an energy distribution peak around several eV. This energy is suitable for deposition and little etching occurs. When converted into thermal energy, this energy corresponds to energy at tens of thousands of degrees, and promotes surface diffusion and crystallization reactions of deposited particles. As a result, it is expected that the density, smoothness and adhesion of the film will be improved and the crystallization temperature will be lowered.
IBS法は、ArやN2などの不活性ガスイオンビ
ームを、基板上に堆積しようとする物質の組成元
素を含むターゲツトに照射し、ターゲツトからス
パツタされた物質を基板上に堆積させる方法であ
る。酸化物膜を形成するには、雰囲気ガスあるい
はイオンとして酸素を供給し、堆積物と反応させ
る。 The IBS method is a method in which an ion beam of an inert gas such as Ar or N2 is irradiated onto a target containing the constituent elements of the substance to be deposited on the substrate, and the substance sputtered from the target is deposited on the substrate. . To form an oxide film, oxygen is supplied as an atmospheric gas or ions and reacts with the deposit.
IBS法で堆積する膜の組成は、膜組成原子のス
パツタ収率およびそれらの基板への付着率によつ
て決定される。スパツタ収率も付着率もともに原
子の種類に依存する。 The composition of a film deposited by the IBS method is determined by the sputtering yield of film composition atoms and their adhesion rate to the substrate. Both sputtering yield and deposition rate depend on the type of atoms.
一般に、堆積膜とターゲツトとでは組成比が異
なる。所望の組成比をもち、膜厚と組成とが均質
である膜を得るためには、スパツタされた粒子の
ビームの、組成比を最適化し、組成比および
強度を空間的にも時間的にも均一化しなければな
らない。IBSは10-5Torr台の高真空中で実施され
るため、ターゲツトと基板との距離が10〜20cm程
度では、ビーム内での原子間衝突による均質化は
期待できない。従つて、上述のの条件は、スパ
ツタされた時点でのビームの均質化が必要である
ことを要請する。 Generally, the deposited film and the target have different composition ratios. In order to obtain a film with a desired composition ratio and homogeneity in thickness and composition, the composition ratio of the sputtered particle beam must be optimized and the composition ratio and intensity adjusted spatially and temporally. It has to be equalized. IBS is performed in a high vacuum of 10 -5 Torr, so if the distance between the target and the substrate is about 10 to 20 cm, homogenization due to collisions between atoms within the beam cannot be expected. Therefore, the above conditions require that homogenization of the beam at the point of sputtering is necessary.
[発明が解決しようとする問題点]
このようなビームを得るためには、ターゲツト
の組成比の最適化とターゲツトの組成および構造
の微視的均質化をはからねばならない。しかしな
がら、このようなターゲツトは、組成金属元素単
体の混合配置もしくは合金化では実現が困難であ
るという問題点があつた。[Problems to be Solved by the Invention] In order to obtain such a beam, it is necessary to optimize the composition ratio of the target and to microscopically homogenize the composition and structure of the target. However, there is a problem in that such a target is difficult to achieve by mixing or alloying single constituent metal elements.
本発明の目的は、上述の問題点を解決し、磁気
光学効果の大きい強磁性化合物の薄膜製造に用い
られるスパツタ用ターゲツトとその製造方法を提
供することにある。 SUMMARY OF THE INVENTION An object of the present invention is to solve the above-mentioned problems and to provide a sputtering target and a method for manufacturing the same that can be used to manufacture thin films of ferromagnetic compounds with a large magneto-optical effect.
[問題点を解決するための手段]
このような目的を達成するために、本発明は、
Bi酸化物およびFe酸化物の混合粉末を原材料と
することを特徴とするBi3Fe5O12薄膜製造用ター
ゲツトと、前記Bi酸化物およびFe酸化物を各々
Bi2O3およびα―Fe2O3とし、そのモル比が3:
5〜3.5:4.5であることを特徴とする。[Means for solving the problems] In order to achieve such an object, the present invention has the following features:
A target for producing a Bi 3 Fe 5 O 12 thin film characterized by using a mixed powder of Bi oxide and Fe oxide as a raw material, and a target for producing a Bi 3 Fe 5 O 12 thin film, which is characterized by using a mixed powder of Bi oxide and Fe oxide, respectively.
Bi 2 O 3 and α-Fe 2 O 3 with a molar ratio of 3:
5-3.5:4.5.
[作用]
本発明においては、目的とする薄膜の組成金属
元素のBi酸化物およびFe酸化物の微粉末を各々
モル比が3:5〜3.5:4.5で混合することで、組
成および構造が微視的に均質化されたスパツタ用
のターゲツトを得ることができる。[Function] In the present invention, fine powders of Bi oxide and Fe oxide, which are the constituent metal elements of the target thin film, are mixed at a molar ratio of 3:5 to 3.5:4.5, so that the composition and structure are fine. A visually homogenized target for sputtering can be obtained.
[実施例]
以下、図面を参照して本発明を詳細に説明す
る。[Example] Hereinafter, the present invention will be described in detail with reference to the drawings.
第1図はターゲツト製造工程のフローチヤート
である。ターゲツトは、目的とする薄膜の組成金
属元素酸化物の混合微粉末を低温で焼結すること
によつて得られる。Bi3Fe5O12薄膜を製造するの
に用いられるターゲツトの製造工程〜を第1
図に沿つて説明する。 FIG. 1 is a flowchart of the target manufacturing process. The target is obtained by sintering a fine powder mixture of metal element oxides of the desired thin film composition at a low temperature. The manufacturing process of the target used to manufacture the Bi 3 Fe 5 O 12 thin film is described in the first step.
This will be explained along the diagram.
純度99.999%のBi2O3とα−Fe2O3の粉末を
Bi2O3とα―Fe2O3のモル比が3:5〜3.5:4.5
となるようにそれぞれ秤量し、これらを混合す
る。 Bi 2 O 3 and α-Fe 2 O 3 powder with a purity of 99.999%
The molar ratio of Bi 2 O 3 and α-Fe 2 O 3 is 3:5 to 3.5:4.5
Weigh each and mix them.
混合物を600Kg/cm2以上の圧力で円板状に圧
縮成形する。 The mixture is compression molded into a disk shape at a pressure of 600 kg/cm 2 or more.
圧縮成形物を常圧大気中で温度800〜840℃で
6時間焼成する。 The compression molded product is fired at a temperature of 800 to 840° C. for 6 hours in the atmosphere at normal pressure.
この焼成物をできる限り粉砕して微粉末とす
る。 This fired product is crushed to a fine powder as much as possible.
工程およびを繰り返す。 Repeat steps and.
工程で得られた焼結体を平行平板に加工し
て、純度99.99%の無酸素銅板に銀ペーストで
接着する。 The sintered body obtained in the process is processed into parallel flat plates and bonded to a 99.99% pure oxygen-free copper plate using silver paste.
工程において、Bi2O3とα―Fe2O3の重量の
合計が40〜50gになるように、それぞれを秤量す
ると直径が50mm,厚さが4mmのターゲツトを作製
することができる。 In the process, if Bi 2 O 3 and α-Fe 2 O 3 are weighed so that the total weight is 40 to 50 g, a target with a diameter of 50 mm and a thickness of 4 mm can be produced.
工程はセラミツク組織の微細化と均質化をは
かるための工程である。 This process is intended to refine and homogenize the ceramic structure.
工程はイオン照射によりターゲツトに供給さ
れるエネルギーが熱に変り、ターゲツト温度が上
昇することを防ぐための熱放散対策として不可欠
である。 This process is essential as a heat dissipation measure to prevent the energy supplied to the target by ion irradiation from converting into heat and increasing the target temperature.
焼成温度を800〜840℃に選んだ理由は、できる
限り高密度で、均質な微細構造をもつ焼結体がこ
の温度範囲で得られるからである。この温度より
も高温ではBi2O3とFe2O3との多様の比率の化合
物の粗大な結晶粒が成長し、このため空間的な均
質化が困難になる。また、この温度よりも低温で
は焼結が進行せず、このため低密度の焼結体しか
得られない。 The reason why the firing temperature was chosen to be 800 to 840°C is that a sintered body with the highest possible density and homogeneous microstructure can be obtained within this temperature range. Above this temperature, coarse grains of compounds of Bi 2 O 3 and Fe 2 O 3 in various ratios grow, making spatial homogenization difficult. Further, at a temperature lower than this temperature, sintering does not proceed, and therefore only a low-density sintered body can be obtained.
なお、IBS法で薄膜を製造する際に堆積膜でガ
ーネツト層が得られるターゲツトの組成範囲は、
Bi2O3/Fe2O3(モル単位)が3/5〜3.5/4.5で
あつた。また、本実施例においてはBi2O3とα―
Fe2O3とを用いたが、所定のBi/Fe比が実現でき
るものであれば、これに限るものではない。 The composition range of the target in which a garnet layer can be obtained in the deposited film when manufacturing a thin film using the IBS method is as follows:
Bi 2 O 3 /Fe 2 O 3 (mole unit) was 3/5 to 3.5/4.5. In addition, in this example, Bi 2 O 3 and α-
Although Fe 2 O 3 was used, the present invention is not limited to this as long as a predetermined Bi/Fe ratio can be achieved.
[発明の効果]
以上説明したように、本発明においては、目的
とする薄膜の組成金属元素のBi酸化物およびFe
酸化物の微粉末を各々モル比が3:5〜3.5で混
合することで、組成および構造が微視的に均質化
されたスパツタ用のターゲツトを得ることができ
る。[Effects of the Invention] As explained above, in the present invention, the compositional metal elements of the target thin film are Bi oxide and Fe.
By mixing fine oxide powders at a molar ratio of 3:5 to 3.5, a sputtering target whose composition and structure are microscopically homogenized can be obtained.
第1図はターゲツト製造工程のフローチヤート
である。
FIG. 1 is a flowchart of the target manufacturing process.
Claims (1)
してなる、Bi3Fe5O12薄膜製造用ターゲツトにお
いて、Bi酸化物およびFe酸化物の粉末はBi2O3お
よびα―Fe2O3であつてモル比が3:5〜3.5:
4.5であることを特徴とするBi3Fe5O12薄膜製造用
ターゲツト。 2 Bi酸化物およびFe酸化物の混合粉末を焼結
してなる、Bi3Fe5O12薄膜製造用ターゲツトの製
造方法において、Bi酸化物およびFe酸化物の混
合粉末を800〜840℃で焼結し、Bi酸化物および
Fe酸化物はBi2O3およびα−Fe2O3であつてモル
比が3:5〜3.5:4.5であることを特徴とする
Bi3Fe5O12薄膜製造用ターゲツトの製造方法。[Claims] 1. In a target for producing a Bi 3 Fe 5 O 12 thin film formed by sintering a mixed powder of Bi oxide and Fe oxide, the powder of Bi oxide and Fe oxide is Bi 2 O 3 and α-Fe 2 O 3 with a molar ratio of 3:5 to 3.5:
4.5 Bi 3 Fe 5 O 12 thin film production target. 2 In a method for producing a target for producing a Bi 3 Fe 5 O 12 thin film, which is obtained by sintering a mixed powder of Bi oxide and Fe oxide, the mixed powder of Bi oxide and Fe oxide is sintered at 800 to 840°C. oxide, Bi oxide and
The Fe oxide is characterized by being Bi 2 O 3 and α-Fe 2 O 3 and having a molar ratio of 3:5 to 3.5:4.5.
A method for producing a target for producing a Bi 3 Fe 5 O 12 thin film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25306387A JPH0196382A (en) | 1987-10-07 | 1987-10-07 | Manufacture of target |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25306387A JPH0196382A (en) | 1987-10-07 | 1987-10-07 | Manufacture of target |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0196382A JPH0196382A (en) | 1989-04-14 |
| JPH0242899B2 true JPH0242899B2 (en) | 1990-09-26 |
Family
ID=17245976
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP25306387A Granted JPH0196382A (en) | 1987-10-07 | 1987-10-07 | Manufacture of target |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0196382A (en) |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58164780A (en) * | 1982-03-23 | 1983-09-29 | Hitachi Metals Ltd | Formation of target for sputtering |
-
1987
- 1987-10-07 JP JP25306387A patent/JPH0196382A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0196382A (en) | 1989-04-14 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |