JPH0243361A - Target for sputtering - Google Patents

Abstract

PURPOSE:To easily form the target from hardly moldable materials by molding a powder material by using an org. binder, thereby molding the target for sputtering. CONSTITUTION:The materials to be sputtered are made into a powder state and are mixed with a proper ratio of the org. binder. The mixture is molded to the target having a suitable shape. An epoxy resin, vinyl acetate resin, polyvinyl alcohol, acrylic resin, etc., are usable for the org. binder. The mixing ratios thereof are not particularly required to be limited. Even the high melting point and high strength materials which are heretofore hardly usable or materials which cannot be sintered and molded are easily utilized as the target in this way and are adequate for use as the target particularly for ECR plasma sputtering.

Description

Detailed Description of the Invention (Field of Industrial Application) The present invention relates to a sputtering target, that is, a target formed by molding a powder material using an organic binder, and a method for manufacturing the same. ) Targets suitable for use in plasma sputtering.

BACKGROUND OF THE INVENTION Recently, various sputtering methods have been used to deposit metal and other films onto substrates. Sputtering is a process in which metals and other substances ejected by the sputtering phenomenon are deposited as a thin film on a substrate in a high-vacuum container on a substrate made of any material. It is possible to precipitate the following substances. The material used for film formation is called terquesol 1-, and its shape is processed into discs, squares, spheres, cylinders, etc., to suit the sputtering equipment used, and the target forming method is based on metal. In the case of non-metals, methods such as rolling at room temperature or high temperature, vacuum melt rolling, or casting are used, and in the case of non-metals, methods such as pressurization and sintering are used. A method of molding metal powder has also been attempted, but the powder adsorbs impure gases and the surface may be oxidized.
It is only used for special substances because it reduces purity and is undesirable.

As described above, the target forming method requires special operations such as rolling, casting, or sintering, so only materials that can be machined can be used as targets, and the processing is time-consuming and the composition of It is difficult to vary the targets in various ways or to manufacture many types of targets, and the targets are expensive. Especially E
Since CR plasma sputtering targets are cylindrical, they have the disadvantage that only metals that can be machined or materials that can be sintered can be used for the target.The present invention eliminates the drawbacks of conventional target manufacturing techniques, and Since it can be easily molded into any shape, it can be used in any sputtering device, and it provides a target molding method that allows any material to be used as a target.Since it can be easily formed into a cylindrical shape, it is particularly suitable for E.
The present invention provides a target suitable for use as a target for CR plasma sputtering.

(Means and effects for solving the problem) Conventionally, there has been a method of molding metal powder to form a target/nod, but this method has the drawbacks mentioned above.
It was only used for special and difficult-to-process materials. The present inventors focused on the use of powder as a target, and as a result of various studies, the material to be sputtered was made into powder, mixed with an appropriate amount of organic binder, molded into an appropriate shape, and used as a target. By doing so,
Unlike conventional targets, special processing is not required and any material can be molded into any shape, so it is easy to obtain various targets with different compositions, and it is It was found that the produced thin film had the same performance as conventional thin films. That is, the present application provides a target in which the material to be sputtered is powdered, mixed with an appropriate amount of organic binder, and molded into the desired shape.By this method, materials with high melting point and high strength, which have been difficult to use in the past, or Even materials that cannot be sintered can be easily used as targets, making it easier to create cougettes and expanding the range of materials that can be used as targets. The composition of the target material used in this method is selected in the conventional manner depending on the required film composition. Although it is desirable that the powder used be as fine and homogeneous in particle size as possible, it is not particularly limited. The organic binder used is
Adhesive resins such as epoxy resins, vinyl acetate resins, polyvinyl alcohol, polyvinyl butyrate, acrylic resins, polyurethane, cellulose resins, ethylene vinyl acetate copolymers, and conventional organic adhesives such as gum arabic, tralant, and glycerin. In adhesives used as adhesives, the organic binder becomes gaseous by mixing an appropriate amount of oxygen gas with the spankling gas and is evacuated. Although epoxy resins can also be used, epoxy resins are preferred. The mixing ratio of the organic binder and the powder is not particularly limited as long as it can mold the target into a predetermined shape.

For example, when using an epoxy resin as a binder, it is generally about 0.2 to 0.7, preferably about 0.5 to the powder.
It is. In this way, the powder and organic binder are uniformly mixed, molded into a predetermined shape, and used as a target. For this reason, targets of any shape can be easily molded, and in addition, the binder becomes gaseous due to the appropriate amount of oxygen present in the spunter gas and is evacuated, so it does not get mixed into the formed film, so the formed film has the same properties as those obtained by conventional methods.

EXAMPLES The present invention will be specifically described below with reference to Examples.

Embodiment FIG. 1 is an example of a target manufacturing method according to the present invention.

Mixed powder of Y2O3, Bad, and Cu2O was converted into Y:Ba:
Mix Cu so that the molar ratio is 1:2:3, thoroughly mix the powder and epoxy resin at a ratio of 2:1, and apply it to the inner wall of a hollow cylindrical copper backup ring l. to make layer 2. The reason why the hack up ring 1 is made of copper is because it has high thermal conductivity, so even if the target is heated by plasma, it can be easily cooled down by water cooling the target holder. This is because copper is included as an impurity in the film, so even if it is mixed into the film as an impurity, no problem will occur. Using the target manufactured by the above method, RF power for target bias was 700 W, vacuum degree was 1.4 x 10-'Tor.
r, Ar90%-〇210% mixed gas (flow rate 5QcJ
/min). In particular, the thin film deposited on the unheated substrate (Y-stabilized Zr0z) was amorphous. It was confirmed from the analysis results using an energy dispersive X-ray spectrometer that the Y:Ba:Cu chemical composition ratio of this amorphous thin film almost matched the composition ratio of each component in the target. Furthermore, this amorphous film was heated to 900°C110
Orthorhombic YB
azCu307-x was obtained.

This crystallized thin film was observed to start superconducting at 90 years of age, and became completely superconductive at 30 years of age.

(Effects) According to the method of the present invention, even substances that are difficult to form into targets can be easily formed into targets, and even substances whose compositions have slightly changed can be easily formed into many types of targets. This expands the scope of use of sputtering, and the properties of thin films obtained using the target obtained by this method are the same as those obtained using conventional targets.

[Brief explanation of the drawing]

FIG. 1 is a diagram of a bank amplifier used in the embodiment of the present application. 1---------Copper backup ring, 2------
---Target (Y2O2, BaO, Cu, O mixture + epoxy resin) Agent: Hideaki Kuwahara, patent attorney

Claims (2)

[Claims] (1) A sputtering target and a method for producing the same, characterized in that a powder material is molded using an organic binder. (2) The target according to claim 1, wherein the sputtering is electron cyclotron resonance plasma sputtering.