JPH0243670U - - Google Patents

Info

Publication number
JPH0243670U
JPH0243670U JP12241888U JP12241888U JPH0243670U JP H0243670 U JPH0243670 U JP H0243670U JP 12241888 U JP12241888 U JP 12241888U JP 12241888 U JP12241888 U JP 12241888U JP H0243670 U JPH0243670 U JP H0243670U
Authority
JP
Japan
Prior art keywords
leads
semiconductor device
measuring
characteristic measuring
measuring device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12241888U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP12241888U priority Critical patent/JPH0243670U/ja
Publication of JPH0243670U publication Critical patent/JPH0243670U/ja
Pending legal-status Critical Current

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  • Testing Of Individual Semiconductor Devices (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本考案の実施例1を示す斜視図、第2
図は本考案の動作を示す斜視図、第3図は従来の
特性測定装置を示す斜視図、第4図は従来の特性
測定装置における不具合例を示す正面図、第5図
は従来の特性測定装置における不具合例を示す側
面図、第6図は本考案によりリード曲がりを矯正
した状態を示す正面図、第7図は本考案によりリ
ード曲がりを矯正した状態を示す側面図、第8図
は本考案の実施例2を示す斜視図である。 1……半導体装置、2……リード、3……測定
触子、4……ガイド、5……ピン、6……ピン保
持具。
Fig. 1 is a perspective view showing Embodiment 1 of the present invention;
Figure 3 is a perspective view showing the operation of the present invention, Figure 3 is a perspective view showing a conventional characteristic measuring device, Figure 4 is a front view showing an example of a malfunction in the conventional characteristic measuring device, and Figure 5 is a conventional characteristic measuring device. 6 is a front view showing a state in which the lead bend has been corrected by the present invention; FIG. 7 is a side view showing the state in which the lead bend has been corrected by the present invention; FIG. 8 is a side view showing the state in which the lead bend has been corrected by the present invention; It is a perspective view showing Example 2 of the invention. DESCRIPTION OF SYMBOLS 1... Semiconductor device, 2... Lead, 3... Measuring probe, 4... Guide, 5... Pin, 6... Pin holder.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半導体装置のリードに対し測定触子を接触させ
て特性を測定する特性測定装置において、半導体
装置のリード相互間に圧入し該リードの曲がりを
矯正する治具を有することを特徴とする半導体装
置の特性測定装置。
A characteristic measuring device for measuring characteristics by bringing a measuring probe into contact with the leads of a semiconductor device, comprising a jig press-fitted between the leads of the semiconductor device to correct bending of the leads. Characteristic measuring device.
JP12241888U 1988-09-19 1988-09-19 Pending JPH0243670U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12241888U JPH0243670U (en) 1988-09-19 1988-09-19

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12241888U JPH0243670U (en) 1988-09-19 1988-09-19

Publications (1)

Publication Number Publication Date
JPH0243670U true JPH0243670U (en) 1990-03-26

Family

ID=31370332

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12241888U Pending JPH0243670U (en) 1988-09-19 1988-09-19

Country Status (1)

Country Link
JP (1) JPH0243670U (en)

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