JPH0243670U - - Google Patents
Info
- Publication number
- JPH0243670U JPH0243670U JP12241888U JP12241888U JPH0243670U JP H0243670 U JPH0243670 U JP H0243670U JP 12241888 U JP12241888 U JP 12241888U JP 12241888 U JP12241888 U JP 12241888U JP H0243670 U JPH0243670 U JP H0243670U
- Authority
- JP
- Japan
- Prior art keywords
- leads
- semiconductor device
- measuring
- characteristic measuring
- measuring device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
Description
第1図は本考案の実施例1を示す斜視図、第2
図は本考案の動作を示す斜視図、第3図は従来の
特性測定装置を示す斜視図、第4図は従来の特性
測定装置における不具合例を示す正面図、第5図
は従来の特性測定装置における不具合例を示す側
面図、第6図は本考案によりリード曲がりを矯正
した状態を示す正面図、第7図は本考案によりリ
ード曲がりを矯正した状態を示す側面図、第8図
は本考案の実施例2を示す斜視図である。
1……半導体装置、2……リード、3……測定
触子、4……ガイド、5……ピン、6……ピン保
持具。
Fig. 1 is a perspective view showing Embodiment 1 of the present invention;
Figure 3 is a perspective view showing the operation of the present invention, Figure 3 is a perspective view showing a conventional characteristic measuring device, Figure 4 is a front view showing an example of a malfunction in the conventional characteristic measuring device, and Figure 5 is a conventional characteristic measuring device. 6 is a front view showing a state in which the lead bend has been corrected by the present invention; FIG. 7 is a side view showing the state in which the lead bend has been corrected by the present invention; FIG. 8 is a side view showing the state in which the lead bend has been corrected by the present invention; It is a perspective view showing Example 2 of the invention. DESCRIPTION OF SYMBOLS 1... Semiconductor device, 2... Lead, 3... Measuring probe, 4... Guide, 5... Pin, 6... Pin holder.
Claims (1)
て特性を測定する特性測定装置において、半導体
装置のリード相互間に圧入し該リードの曲がりを
矯正する治具を有することを特徴とする半導体装
置の特性測定装置。 A characteristic measuring device for measuring characteristics by bringing a measuring probe into contact with the leads of a semiconductor device, comprising a jig press-fitted between the leads of the semiconductor device to correct bending of the leads. Characteristic measuring device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12241888U JPH0243670U (en) | 1988-09-19 | 1988-09-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12241888U JPH0243670U (en) | 1988-09-19 | 1988-09-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0243670U true JPH0243670U (en) | 1990-03-26 |
Family
ID=31370332
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12241888U Pending JPH0243670U (en) | 1988-09-19 | 1988-09-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0243670U (en) |
-
1988
- 1988-09-19 JP JP12241888U patent/JPH0243670U/ja active Pending
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