JPH0244023B2 - ALNOYOKYOKUSANKAHAKUMAKUOMOCHIITASHITSUDOSENSASOSHIOYOBISONOSEIZOHOHO - Google Patents
ALNOYOKYOKUSANKAHAKUMAKUOMOCHIITASHITSUDOSENSASOSHIOYOBISONOSEIZOHOHOInfo
- Publication number
- JPH0244023B2 JPH0244023B2 JP57070520A JP7052082A JPH0244023B2 JP H0244023 B2 JPH0244023 B2 JP H0244023B2 JP 57070520 A JP57070520 A JP 57070520A JP 7052082 A JP7052082 A JP 7052082A JP H0244023 B2 JPH0244023 B2 JP H0244023B2
- Authority
- JP
- Japan
- Prior art keywords
- thin film
- comb
- shaped electrodes
- sensor element
- pair
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000010409 thin film Substances 0.000 claims description 67
- 229910052751 metal Inorganic materials 0.000 claims description 28
- 239000002184 metal Substances 0.000 claims description 28
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 17
- 239000010407 anodic oxide Substances 0.000 claims description 13
- 239000010408 film Substances 0.000 claims description 12
- 239000000758 substrate Substances 0.000 claims description 12
- 230000003647 oxidation Effects 0.000 claims description 10
- 238000007254 oxidation reaction Methods 0.000 claims description 10
- 230000035699 permeability Effects 0.000 claims description 10
- 238000000034 method Methods 0.000 claims description 9
- 238000009413 insulation Methods 0.000 claims description 8
- 238000004519 manufacturing process Methods 0.000 claims description 8
- 238000007743 anodising Methods 0.000 claims description 2
- 229910052804 chromium Inorganic materials 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 229910052709 silver Inorganic materials 0.000 claims 1
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 6
- 230000007423 decrease Effects 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
- 238000013459 approach Methods 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 4
- 239000010419 fine particle Substances 0.000 description 4
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 4
- 230000035945 sensitivity Effects 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000011084 recovery Methods 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 238000004544 sputter deposition Methods 0.000 description 3
- 238000007740 vapor deposition Methods 0.000 description 3
- 238000002048 anodisation reaction Methods 0.000 description 2
- 238000009835 boiling Methods 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 230000005284 excitation Effects 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 235000006408 oxalic acid Nutrition 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 125000005037 alkyl phenyl group Chemical group 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 239000008151 electrolyte solution Substances 0.000 description 1
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 230000012447 hatching Effects 0.000 description 1
- 230000035876 healing Effects 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 239000002736 nonionic surfactant Substances 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- -1 polyoxyethylene Polymers 0.000 description 1
- 229910052573 porcelain Inorganic materials 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000007738 vacuum evaporation Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
- G01N27/02—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance
- G01N27/22—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating capacitance
- G01N27/223—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating capacitance for determining moisture content, e.g. humidity
- G01N27/225—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating capacitance for determining moisture content, e.g. humidity by using hygroscopic materials
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Non-Adjustable Resistors (AREA)
- Investigating Or Analyzing Materials By The Use Of Fluid Adsorption Or Reactions (AREA)
- Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
Description
【発明の詳細な説明】
[産業上の利用分野]
本発明は、Alの陽極酸化薄膜を用いた湿度セ
ンサ素子及びその製造方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a humidity sensor element using an anodic oxide thin film of Al and a method for manufacturing the same.
[従来の技術]
湿度センサは従来湿度観測用として一部に使用
されていたのであるが、最近に至つて家電機器等
に利用させるに至つて用途は急激に拡大された。[Prior Art] Humidity sensors have traditionally been used in some areas for humidity observation, but recently their applications have been rapidly expanded to include home appliances and the like.
Alの酸化薄膜を用いたセンサは既に幾つか公
知となつている。その代表的なものは次の通りで
ある。 Some sensors using Al oxide thin films are already known. The representative ones are as follows.
(イ) 特開昭53−9595号公報(特願昭51−83507号)
「アルミニユウムの陽極酸化薄膜を使用した含
湿量検出素子」
(ロ) 感湿素子の試作(東京都立工業技術センター
研究報告第6号;1976年、51頁〜56頁)
(ハ) 陽極化成Alの封孔処理効果(Sealing
Effects near the Barrier―Porous Layer
Interface of Anodic Aluminas;Solid State
Sience,Sep,1970)
一般的なAlの陽極酸化薄膜を用いた湿度セン
サ素子の構造及び製造法を、第1図を参照して簡
単に説明する。図は、この種のセンサ素子の平面
図であり、該図において1はセラミツク基板、2
は真空蒸着又はスパツタ法によつて形成した薄膜
状の櫛状電極である。この櫛状電極2は、Tiな
どのバルブ金属を用いて基板1の全面に亘つて蒸
着法又はスパツタ法によつて薄膜を形成した後、
この薄膜をフオトエツチングによつて所要の櫛形
に形成することにより形成される。次に、アルミ
ニユウム薄膜をマスク蒸着により、櫛状電極2の
電極部分の上に形成し、その後硫酸、蓚酸等の酸
を用いて陽極酸化法により酸化Alの薄膜すなわ
ちAlの陽極酸化薄膜3(疎斜線で示す)を形成
する。次に、センサ素子完成後に外部引出しリー
ド線5を半田付けするために、マスク蒸着法によ
りAuの端子部4を形成する。その後該素子を純
水を沸とうさせた熱湯中に30分くらい浸漬して、
いわゆる封孔処理(Sealing)を行い、最後にリ
ード線5をAuの端子部4に半田付けする。(a) Japanese Patent Application Publication No. 53-9595 (Japanese Patent Application No. 51-83507)
"Moisture content detection element using anodized thin film of aluminum" (b) Prototype of moisture sensing element (Tokyo Metropolitan Industrial Technology Center Research Report No. 6; 1976, pp. 51-56) (c) Anodized Al Sealing treatment effect
Effects near the Barrier―Porous Layer
Interface of Anodic Aluminas;Solid State
Science, Sep, 1970) The structure and manufacturing method of a humidity sensor element using a general anodic oxidation thin film of Al will be briefly explained with reference to FIG. The figure is a plan view of this type of sensor element, in which 1 is a ceramic substrate, 2 is a ceramic substrate;
is a thin film-like comb-shaped electrode formed by vacuum evaporation or sputtering. This comb-shaped electrode 2 is made by forming a thin film over the entire surface of the substrate 1 by vapor deposition or sputtering using a valve metal such as Ti.
This thin film is formed by photoetching into a desired comb shape. Next, an aluminum thin film is formed on the electrode part of the comb-shaped electrode 2 by mask vapor deposition, and then an anodic oxidation thin film 3 of Al (anodized aluminum thin film 3) is formed by anodic oxidation using an acid such as sulfuric acid or oxalic acid. (indicated by diagonal lines). Next, in order to solder the external lead wire 5 after the sensor element is completed, a terminal portion 4 of Au is formed by a mask vapor deposition method. After that, the element was immersed in boiling pure water for about 30 minutes.
A so-called sealing process is performed, and finally the lead wire 5 is soldered to the Au terminal portion 4.
[発明が解決しようとする課題]
前述のようにして作られた湿度センサ素子は、
次のような欠点を有している。[Problem to be solved by the invention] The humidity sensor element manufactured as described above is
It has the following drawbacks.
(1) 湿度に対するヒステリシスが大きい。(1) Hysteresis against humidity is large.
第1図のリード線5,5間のコンダクタンス
は湿度の上昇と共に増加する。しかしながら湿
度が減少するときのコンダクタンス値は、湿度
が上昇するときの経路(バス)とは異なる経路
を通つて減少し、その差が大きくなる。いわゆ
るヒステリシス現象を生ずる。 The conductance between the lead wires 5, 5 in FIG. 1 increases as the humidity increases. However, when the humidity decreases, the conductance value decreases through a different route (bus) than when the humidity increases, and the difference becomes large. A so-called hysteresis phenomenon occurs.
(2) 低湿度の中では、時間と共に感度が徐々に下
がる。(2) In low humidity, sensitivity gradually decreases over time.
即ちリード線5,5間の湿度に対するコンダ
クタンス値及びその変化のスロープが時間と共
に減少する。 That is, the conductance value and the slope of its change with respect to humidity between the lead wires 5 decrease with time.
(3) 高湿度の中では、感度が増加し、かつ不安定
となる。(3) Sensitivity increases and becomes unstable in high humidity.
一般的に相対湿度が80%R.H.以上の高湿度
中では、感度が次第に増加し、かつ不安定とな
る。 Generally, in high humidity environments with relative humidity of 80% RH or higher, sensitivity gradually increases and becomes unstable.
(4) 特に第1図の構造の湿度センサ素子では、入
力インピーダンスが比較的高い。(4) In particular, the humidity sensor element having the structure shown in FIG. 1 has a relatively high input impedance.
構造は第1図のものとは異なるが、前述の特開
昭53−9595号に示されていた湿度センサ素子にお
いては、入力インピーダンスを低くする工夫がな
されている。すなわちこの湿度センサ素子では一
対の薄膜電極の間にAlの陽極酸化薄膜層を挟ん
だ構造を有しており、両薄膜電極の間のインピー
ダンスを容量性にして、入力インピーダンスを低
下させている。しかしながらこの構造では、イン
ピーダンスが容量性であるために、湿度に対する
感度が少なからず低下する問題がある。 Although the structure is different from that shown in FIG. 1, the humidity sensor element shown in the above-mentioned Japanese Patent Laid-Open No. 53-9595 is designed to lower the input impedance. In other words, this humidity sensor element has a structure in which an anodic oxide thin film layer of Al is sandwiched between a pair of thin film electrodes, and the impedance between the two thin film electrodes is made capacitive to reduce input impedance. However, in this structure, since the impedance is capacitive, there is a problem that the sensitivity to humidity is considerably reduced.
本発明の目的は、櫛状電極を用いた構造の湿度
センサ素子において、入力インピーダンスの低い
Al陽極酸化薄膜を用いた湿度センサ素子を提供
することにある。 An object of the present invention is to provide a humidity sensor element with a structure using comb-like electrodes, which has low input impedance.
An object of the present invention is to provide a humidity sensor element using an Al anodized thin film.
また本発明の他の目的は、入力インピーダンス
が低い湿度センサ素子を高い歩留で製造すること
ができるAlの陽極酸化薄膜を用いた湿度センサ
素子の製造方法を提供することにある。 Another object of the present invention is to provide a method for manufacturing a humidity sensor element using an anodic oxidation thin film of Al, which can produce a humidity sensor element with low input impedance at a high yield.
[課題を解決するための手段]
本発明は、絶縁基板の上に形成された薄膜状バ
ルブ金属からなる一対の櫛状電極と、一対の櫛状
電極の電極部分上に設けられたAlの陽極酸化薄
膜とを具備してなる湿度センサ素子を対象とす
る。そして本発明では、入力インピーダンスを低
下させるために、陽極酸化薄膜を透水性を有する
導電性金属薄膜で被覆する。[Means for Solving the Problems] The present invention includes a pair of comb-shaped electrodes made of a thin valve metal formed on an insulating substrate, and an Al anode provided on the electrode portions of the pair of comb-shaped electrodes. The present invention is directed to a humidity sensor element comprising an oxide thin film. In the present invention, the anodized thin film is coated with a conductive metal thin film having water permeability in order to lower the input impedance.
本発明の製造方法では、陽極酸化薄膜を透水性
を有する導電性金属薄膜で被覆した場合に、使用
できない程度までインピーダンスが低下しないよ
うにするために、透水性を有する導電性金属薄膜
のうち一対の櫛状電極の間を短絡しまたは該一対
の櫛状電極間の絶縁抵抗を低下させている部分を
自己回復させるのに適当な電圧を一対の櫛状電極
に印加する。 In the manufacturing method of the present invention, in order to prevent the impedance from decreasing to the extent that it cannot be used when an anodized thin film is coated with a water permeable conductive metal thin film, one of the water permeable conductive metal thin films is coated with a water permeable conductive metal thin film. An appropriate voltage is applied to the pair of comb-shaped electrodes to short-circuit the comb-shaped electrodes or to self-recover the portion where the insulation resistance between the pair of comb-shaped electrodes is reduced.
[作 用]
透水性の導電性金属薄膜をAlの陽極酸化薄膜
の上に設けると、一対の櫛状電極の対向する各電
極素片間のインピーダンスが並列接続された状態
となり入力インピーダンスは低くなる。[Function] When a water-permeable conductive metal thin film is provided on an anodic oxide thin film of Al, the impedance between the opposing electrode pieces of a pair of comb-shaped electrodes is connected in parallel, and the input impedance becomes low. .
Alの陽極酸化薄膜の厚みが薄くなると、多孔
質のAlの陽極酸化薄膜の孔部を通つて透水性の
導電性金属薄膜の微粒子が櫛状電極に接近し、必
要以上にインピーダンスが低下する。一対の櫛状
電極間に適当な電圧を印加すると、櫛状電極に接
近した微粒子は一瞬にして蒸気化して、絶縁が回
復(自己回復)する。 When the thickness of the anodic oxidized Al thin film becomes thin, the fine particles of the water permeable conductive metal thin film approach the comb-shaped electrode through the pores of the porous anodic oxidized Al film, lowering the impedance more than necessary. When an appropriate voltage is applied between a pair of comb-shaped electrodes, particles that approach the comb-shaped electrodes are instantly vaporized, and the insulation is restored (self-recovery).
[実施例] 次に本発明の構成について説明する。[Example] Next, the configuration of the present invention will be explained.
第2図は本発明の一実施例の平面図である。第
2図において、第1図に示した部分と同様の部分
については同じ符号を付して説明を省略する。2
1は本発明の特徴である透水性を有する導電性金
属薄膜の一部を示す。実際には透水性を有する導
電性金属薄膜21は粗斜線で示したAlの陽極酸
化薄膜3の部分を全部覆つているのであるが、説
明の便宜上、図のように示したものである。 FIG. 2 is a plan view of one embodiment of the present invention. In FIG. 2, the same parts as those shown in FIG. 1 are given the same reference numerals and their explanation will be omitted. 2
1 shows a part of a conductive metal thin film having water permeability, which is a feature of the present invention. In reality, the conductive metal thin film 21 having water permeability completely covers the portion of the anodic oxide thin film 3 of Al shown by rough hatching, but it is shown as shown in the figure for convenience of explanation.
1のセラミツク基板は高純度のアルミナ磁器を
用い、寸法は10mm×15mm×0.6mmである。これを
充分に洗滌、乾燥する。次にこの基板1を高周波
スパツタ槽に収容し、表面にTa膜をスパツタす
る。膜厚は2000Åである。次に化学エツチングに
より櫛状電極を2を形成する。櫛状歯の幅は50μ
m、間隔は50μmとした。 The ceramic substrate 1 is made of high-purity alumina porcelain and has dimensions of 10 mm x 15 mm x 0.6 mm. Wash and dry this thoroughly. Next, this substrate 1 is placed in a high frequency sputtering bath, and a Ta film is sputtered on the surface. The film thickness is 2000 Å. Next, a comb-shaped electrode 2 is formed by chemical etching. The width of the comb teeth is 50μ
m, and the interval was 50 μm.
次に高真空中でマスク蒸着法により、Alの薄
膜3(厚さ5000Å〜7000Å)及びAuの端子部4
を形成する。次いでAlの薄膜3と端子部4との
間に、幅数mmのレンジの絶縁帯を作る。 Next, a thin Al film 3 (thickness 5000 Å to 7000 Å) and an Au terminal portion 4 were formed by mask evaporation in a high vacuum.
form. Next, an insulating band with a width of several mm is formed between the Al thin film 3 and the terminal portion 4.
次に基板1を、端子部4にコンモンにしてAl
の薄膜3の部分を希硫酸又は蓚酸の電解液中に懸
垂して陽極とする。この場合前記幅数mmのレンジ
の絶縁体の中心線付近まで浸漬する。このように
するのは陽極酸化時に表面近くに電流が集中する
のを防止し、以後の酸化が全面に亘つて均一に行
なわれるようにするためである。次に純度の高い
バルブ金属であるTa片を電解液中に懸垂して陰
極とする。前記陰陽両極間に、最初に定電流を流
して充分に化成し、次にやや高い電圧による定電
圧化成を行なつて陽極化成の工程を終る。 Next, put the board 1 in common with the terminal part 4, and
A portion of the thin film 3 is suspended in an electrolytic solution of dilute sulfuric acid or oxalic acid to serve as an anode. In this case, the insulator is immersed up to the vicinity of the center line of the range several mm wide. This is done in order to prevent current from concentrating near the surface during anodic oxidation and to ensure that subsequent oxidation is performed uniformly over the entire surface. Next, a piece of Ta, which is a highly pure valve metal, is suspended in the electrolyte to serve as a cathode. First, a constant current is passed between the negative and anode electrodes to sufficiently form the anodizing material, and then a constant voltage forming process is performed using a slightly higher voltage to complete the anodic forming process.
陽極化成時にバルブ金属を用いる必要性及び陽
極化成時の化学現象等については前記、特願昭56
−008601号(特開昭57−124401号)で詳述したの
で説明を省略する。 Regarding the necessity of using a valve metal during anodization and the chemical phenomena during anodization, please refer to the above patent application.
Since it was explained in detail in No.-008601 (Japanese Unexamined Patent Publication No. 57-124401), the explanation will be omitted.
化成終了後充分に洗滌し、300℃〜350℃の安定
化熱処理を2時間程度行なう。 After completion of chemical formation, the product is thoroughly washed and stabilized heat treated at 300°C to 350°C for about 2 hours.
次に純水の沸とう水中で充分に封孔処理
(Sealing)をする。封孔処理についても、前記、
特願昭56−008601号(特開昭57−124401号)で詳
述したので説明を省略する。 Next, seal the holes thoroughly in boiling pure water. As for the sealing treatment,
This has been explained in detail in Japanese Patent Application No. 56-008601 (Japanese Unexamined Patent Publication No. 57-124401), so the explanation will be omitted.
次に基板1のAl陽極酸化薄膜3の表面にAu透
水性を有する導電性金属薄膜21を、高真空中で
蒸着する。Auの蒸着膜の厚さと表面固有抵抗
(以下比抵抗と略称する)ρ′(Ω/□)との関係
は、実測すると第3図のようになる。それ故ρ′の
値をモニターすればその膜厚が分る。実験の結果
によるとAuの透水性を有する導電性金属薄膜の
厚さは500Å〜2000Åの範囲が好結果を与える。
特に2000Å前後がよい。最後にリード線5をAu
の端子部4に半田付けする。 Next, an Au water-permeable conductive metal thin film 21 is deposited on the surface of the Al anodized thin film 3 of the substrate 1 in a high vacuum. The relationship between the thickness of the deposited Au film and the surface resistivity (hereinafter abbreviated as specific resistance) ρ' (Ω/□) is shown in FIG. 3 when actually measured. Therefore, by monitoring the value of ρ', the film thickness can be determined. According to experimental results, good results are obtained when the thickness of the water-permeable conductive metal thin film of Au is in the range of 500 Å to 2000 Å.
Especially around 2000Å is good. Finally, connect lead wire 5 to Au
Solder it to the terminal section 4 of.
上記の実施例の湿度センサ素子によれば、下記
の効果を得ることができる。 According to the humidity sensor element of the above embodiment, the following effects can be obtained.
(1) 入力インピーダンスが低いので、該素子を用
いた湿度測定回路の標準抵抗、増幅器(以下ア
ンプと略称する)等から成る回路が安定し、か
つ価格も低廉となる。(1) Since the input impedance is low, a circuit consisting of a standard resistor, an amplifier (hereinafter abbreviated as an amplifier), etc. of a humidity measuring circuit using this element is stable and inexpensive.
(2) 本出願人と同一の出願人によつてなされた、
特願昭56−008601号(特開昭57−124401号)の
発明に係るセンサ素子は、10Hz前後の励磁周波
数で良好な特性を示したが、50Hz以上になると
特性は低下する。この湿度センサ素子は10Hz〜
100kHzの広範囲で良好な特性を示す。従つて
応用範囲が非常に大きくなる。(2) made by the same applicant as the applicant;
The sensor element according to the invention of Japanese Patent Application No. 56-008601 (Japanese Unexamined Patent Publication No. 57-124401) showed good characteristics at an excitation frequency of around 10 Hz, but the characteristics deteriorate when the excitation frequency exceeds 50 Hz. This humidity sensor element is 10Hz~
Shows good characteristics over a wide range of 100kHz. Therefore, the range of application becomes very wide.
このようにして完成した製品の絶縁抵抗を測定
すると、5―5間の端子抵抗(入力インピーダン
ス)が必要以上に低くなるものが相当製造される
場合があることが判つた。ことにAlの陽極酸化
薄膜3の厚さが小さくなるほど、この傾向は著し
い。この現象は生産の歩留りを上げるのに障害と
なる。研究の結果Alの陽極酸化薄膜3の層は、
厚さが薄いときは相当ポーラス即ち多孔質である
ことが分つた。そうすると、その酸化膜3の上に
Auを蒸着すると多孔質部をAuの分子が埋めてゆ
くことになる。即ち模型的に表わすとその断面は
第4図のような構造で表わされる。第4図におい
て1は基板、3はAlの陽極酸化薄膜の層で21
はAuの透水性を有する導電性金属薄膜の層であ
る。2a,2bは櫛状電極の相隣る2素片を表わ
す。そうすると第2図から明らかなように、端子
5―5間の抵抗を測れば結局、櫛状歯の間の抵抗
を測ることになるから、もし第4図のような構造
になつていると2a―2b間の抵抗は明らかに極
めて小となり、甚だしいときはAuの微粒子でシ
ヨートされることになる。 When measuring the insulation resistance of the products completed in this way, it was found that there were many cases in which the terminal resistance (input impedance) between 5 and 5 was lower than necessary. In particular, this tendency becomes more pronounced as the thickness of the Al anodic oxide thin film 3 becomes smaller. This phenomenon becomes an obstacle to increasing production yield. As a result of the research, the layer of Al anodized thin film 3 is
It has been found that when the thickness is thin, it is quite porous. Then, on top of the oxide film 3
When Au is deposited, the porous parts are filled with Au molecules. That is, when expressed as a model, its cross section is represented by a structure as shown in FIG. In Figure 4, 1 is the substrate, 3 is the layer of Al anodized thin film 21
is a layer of conductive metal thin film with water permeability of Au. 2a and 2b represent two adjacent pieces of a comb-shaped electrode. Then, as is clear from Figure 2, if you measure the resistance between terminals 5 and 5, you will end up measuring the resistance between the comb teeth, so if the structure is as shown in Figure 4, 2a The resistance between -2b will obviously be extremely small, and in extreme cases it will be shot by fine Au particles.
本発明者は2a―2b間に適当な電圧を印加す
れば、その電極に接近したAuの微粒子は一瞬に
して蒸気化し、従つて2a―2b間の絶縁が回復
すること、即ち自己回復(セルフヒーリング;
Self healing)させることが出来ることに気づい
た。実験の結果によるとAuの膜厚が2000Å以下
くらいであると、セルフヒーリングが極めて短時
間に終了して、絶縁が回復することが分つた。 The present inventor has discovered that if an appropriate voltage is applied between 2a and 2b, the Au fine particles that approach the electrode will vaporize in an instant, and the insulation between 2a and 2b will be restored, that is, self-recovery (self-recovery). healing;
I realized that it is possible to do self-healing. According to the experimental results, it was found that when the Au film thickness is about 2000 Å or less, self-healing ends in an extremely short time and the insulation is restored.
即ち第4図に示すAlの陽極酸化薄膜3の層の
膜厚が5000Å〜7000Åの場合、端子部4―4間に
印加する電圧、即ちセルフヒーリング電圧は
130V〜150Vが適当であること、かつセルフヒー
リング時間はAlの陽極酸化薄膜3の膜厚にもよ
るが、前記したような膜厚ならば1秒以下でよい
から、実用上は10秒も見れば充分であることを確
かめた。ともかくこのようにして歩留りの問題は
解決できることが分つた。なおセルフヒーリング
電圧は、できるだけ小さくすることが望ましい。
あまり大きくするとAlの陽極酸化薄膜3に損傷
を与え、ひいてはセンサ特性に悪影響を及ぼすか
らである。また電圧が低過ぎるとセルフヒーリン
グはしない。それ故適当な電圧は実験によつて簡
単に定めることがきる。前述のセルフヒーリング
の電圧は実験によつて定めたものである。ちなみ
にセルフヒーリングの技術は金属化紙を用いたキ
ヤパシターの製造においては古くから実用されて
いる。しかしながら本発明におけるセルフヒーリ
ングの技術の利用の態様は金属化紙キヤパシター
の場合と異なつている。 That is, when the thickness of the Al anodized thin film 3 shown in FIG.
130V to 150V is appropriate, and the self-healing time also depends on the thickness of the Al anodic oxide thin film 3, but if the film thickness is as described above, it may take less than 1 second, so in practice it can take as long as 10 seconds. I confirmed that it was sufficient. In any case, it turned out that the yield problem could be solved in this way. Note that it is desirable that the self-healing voltage be as small as possible.
This is because if the size is too large, the anodic oxide thin film 3 of Al will be damaged and the sensor characteristics will be adversely affected. Also, if the voltage is too low, self-healing will not occur. A suitable voltage can therefore be easily determined by experiment. The self-healing voltage mentioned above was determined through experiments. By the way, self-healing technology has been used in the production of capacitors using metallized paper for a long time. However, the manner in which the self-healing technique is utilized in the present invention is different from that of metallized paper capacitors.
最後にセンサとしての特性を更に安定化し、向
上させるためには非イオン性界面活性剤ポリオキ
シエチレンアルキルフエニール・エーテルを用い
て処理すればよい。その技術については本出願人
と同一の出願人による特許出願、特願昭56−
128170号(特開昭58−30101号)に詳述してある
ので省略する。 Finally, in order to further stabilize and improve the properties as a sensor, it may be treated with a nonionic surfactant polyoxyethylene alkyl phenyl ether. Regarding the technology, a patent application and a patent application filed in 1982 by the same applicant as the present applicant are disclosed.
128170 (Japanese Unexamined Patent Publication No. 58-30101), the detailed description is omitted.
セルフヒーリングの技術によつて得られる効果
について簡単にのべる。 Briefly discuss the effects obtained through self-healing techniques.
(i) セルフヒーリングの技術を開発することによ
り、透水性を有する導電性金属薄膜を設けた、
入力インピーダンスの低いセンサ素子が容易に
量産できるようになり、従つて安価に提供する
ことができる。(i) By developing self-healing technology, a conductive metal thin film with water permeability is provided.
Sensor elements with low input impedance can be easily mass-produced, and therefore can be provided at low cost.
(ii) セルフヒーリングを適当な条件のもとに実施
することにより電極間の絶縁抵抗を高く保持す
ることができるようになつた。従つてセンサ特
性を安全に保つことができる。(ii) By performing self-healing under appropriate conditions, it has become possible to maintain high insulation resistance between electrodes. Therefore, sensor characteristics can be maintained safely.
(iii) 酸化Al層の膜厚が5000Å〜7000Åであれば
セルフヒーリング電圧は130V〜150Vで充分で
あり、印加時間は実用上10秒以下でよい。(iii) If the thickness of the Al oxide layer is 5000 Å to 7000 Å, a self-healing voltage of 130 V to 150 V is sufficient, and the application time may be practically 10 seconds or less.
[発明の効果]
本発明の湿度センサ素子によれば、櫛状電極の
上にAlの陽極酸化薄膜を用いた湿度センサ素子
において、透水性の導電性金属薄膜をAlの陽極
酸化薄膜の上に設けたので、湿度の検出に影響を
与えることなく、一対の櫛状電極の対向する各電
極素片間のインピーダンスを並列接続した状態に
することができ、その結果素子の入力インピーダ
ンスを大幅に低くすることができる。[Effects of the Invention] According to the humidity sensor element of the present invention, in the humidity sensor element using an anodic oxide thin film of Al on the comb-shaped electrode, a water permeable conductive metal thin film is placed on the anodic oxide thin film of Al. As a result, the impedance between the opposing electrode pieces of a pair of comb-shaped electrodes can be connected in parallel without affecting humidity detection, and as a result, the input impedance of the element can be significantly lowered. can do.
本発明の製造方法によれば、多孔質のAlの陽
極酸化薄膜の孔部を通つて透水性の導電性金属薄
膜の微粒子が櫛状電極に接近して必要以上にイン
ピーダンスが低下した場合に、一対の櫛状電極間
に適当な電圧を印加して、櫛状電極に接近した微
粒子を蒸気化させるため、簡単に絶縁を回復させ
ることができ、製品の歩留りを大幅に向上させる
ことができる。 According to the manufacturing method of the present invention, when fine particles of a water-permeable conductive metal thin film approach a comb-shaped electrode through the pores of a porous Al anodized thin film and the impedance decreases more than necessary, By applying an appropriate voltage between a pair of comb-shaped electrodes to vaporize the fine particles that have come close to the comb-shaped electrodes, insulation can be easily restored and product yields can be greatly improved.
第1図は皮膜形(薄膜形を含む)センサ素子の
平面図、第2図は本発明に係る湿度センサ素子の
平面図、第3図はAu蒸着膜の厚さと表面固有抵
抗との関係を示すグラフ、第4図は基板、櫛状電
極素片、Alの陽極酸化薄膜層、透水性を有する
導電性金属薄膜を含む部分の断面の模型図であ
る。
1…セラミツク基板、2…櫛状電極、3…Al
の陽極酸化薄膜、4…端子部、5…リード線、2
1…透水性を有する導電性金属薄膜。
Fig. 1 is a plan view of a film type (including thin film type) sensor element, Fig. 2 is a plan view of a humidity sensor element according to the present invention, and Fig. 3 shows the relationship between the thickness of the Au deposited film and the surface resistivity. The graph shown in FIG. 4 is a schematic cross-sectional view of a portion including a substrate, a comb-shaped electrode piece, an anodic oxidation thin film layer of Al, and a conductive metal thin film having water permeability. 1... Ceramic substrate, 2... Comb-shaped electrode, 3... Al
anodized thin film, 4...terminal part, 5...lead wire, 2
1...A conductive metal thin film having water permeability.
Claims (1)
からなる一対の櫛状電極と、 前記一対の櫛状電極の電極部分上に設けられた
Alの陽極酸化薄膜とを具備してなるAlの陽極酸
化薄膜を用いた湿度センサ素子において、 前記陽極酸化薄膜を透水性を有する導電性金属
薄膜で被覆してなることを特徴とする陽極酸化薄
膜を用いた湿度センサ素子。 2 前記導電性金属薄膜は、Au,Ag,Cr,Ni
等の不銹性の金属薄膜であることを特徴とする特
許請求の範囲第1項記載のAlの陽極酸化薄膜を
用いた湿度センサ素子。 3 前記導電性金属薄膜としてAuが用いられ、
その膜厚を500Å〜2000Åとすることを特徴とす
る特許請求の範囲第2項記載のAlの陽極酸化薄
膜用いた湿度センサ素子。 4 絶縁基板の上に薄膜状バルブ金属からなる一
対の櫛状電極を形成する工程と、 前記一対の櫛状電極の電極部分上にAl薄膜を
陽極酸化することによりAlの陽極酸化薄膜を形
成する工程と、 前記Alの陽極酸化薄膜を透水性を有する導電
性金属薄膜で被覆する工程と、 前記透水性を有する導電性金属薄膜のうち前記
一対の櫛状電極の間を短絡しまたは該一対の櫛状
電極間の絶縁抵抗を低下させている部分を自己回
復させるのに適当な電圧を前記一対の櫛状電極間
に印加する工程とからなるAlの陽極酸化薄膜を
用いた湿度センサ素子の製造方法。[Claims] 1. A pair of comb-shaped electrodes made of a thin-film valve metal formed on an insulating substrate, and a pair of comb-shaped electrodes provided on the electrode portions of the pair of comb-shaped electrodes.
A humidity sensor element using an anodic oxide thin film of Al, characterized in that the anodic oxide thin film is coated with a conductive metal thin film having water permeability. Humidity sensor element using 2 The conductive metal thin film is made of Au, Ag, Cr, Ni
A humidity sensor element using an anodic oxidation thin film of Al according to claim 1, characterized in that it is a non-rusting metal thin film. 3 Au is used as the conductive metal thin film,
A humidity sensor element using an anodic oxide thin film of Al according to claim 2, characterized in that the film thickness is 500 Å to 2000 Å. 4. Forming a pair of comb-shaped electrodes made of thin film valve metal on an insulating substrate, and forming an anodic oxidation thin film of Al by anodizing the Al thin film on the electrode portions of the pair of comb-shaped electrodes. a step of covering the anodic oxidation thin film of Al with a conductive metal thin film having water permeability; short-circuiting between the pair of comb-shaped electrodes of the conductive metal thin film having water permeability; Manufacturing a humidity sensor element using an anodic oxide thin film of Al, which comprises the step of applying an appropriate voltage between the pair of comb-shaped electrodes to self-recover the portion where the insulation resistance between the comb-shaped electrodes is reduced. Method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57070520A JPH0244023B2 (en) | 1982-04-28 | 1982-04-28 | ALNOYOKYOKUSANKAHAKUMAKUOMOCHIITASHITSUDOSENSASOSHIOYOBISONOSEIZOHOHO |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57070520A JPH0244023B2 (en) | 1982-04-28 | 1982-04-28 | ALNOYOKYOKUSANKAHAKUMAKUOMOCHIITASHITSUDOSENSASOSHIOYOBISONOSEIZOHOHO |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58189548A JPS58189548A (en) | 1983-11-05 |
| JPH0244023B2 true JPH0244023B2 (en) | 1990-10-02 |
Family
ID=13433879
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57070520A Expired - Lifetime JPH0244023B2 (en) | 1982-04-28 | 1982-04-28 | ALNOYOKYOKUSANKAHAKUMAKUOMOCHIITASHITSUDOSENSASOSHIOYOBISONOSEIZOHOHO |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0244023B2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FI98861C (en) * | 1994-01-18 | 1997-08-25 | Vaisala Oy | A method of manufacturing a microporous gas-permeable electrode and a microporous gas-permeable electrode |
| US6824739B1 (en) * | 2000-11-03 | 2004-11-30 | Agere Systems Inc. | Oxidation sensor for an electrical circuit and a method of manufacture therefor |
| RU196451U1 (en) * | 2019-07-18 | 2020-03-02 | Федеральное государственное бюджетное образовательное учреждение высшего образования "Волгоградский государственный технический университет" (ВолгГТУ) | Device for the manufacture of electrets |
-
1982
- 1982-04-28 JP JP57070520A patent/JPH0244023B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58189548A (en) | 1983-11-05 |
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