JPH0244423U - - Google Patents
Info
- Publication number
- JPH0244423U JPH0244423U JP12359988U JP12359988U JPH0244423U JP H0244423 U JPH0244423 U JP H0244423U JP 12359988 U JP12359988 U JP 12359988U JP 12359988 U JP12359988 U JP 12359988U JP H0244423 U JPH0244423 U JP H0244423U
- Authority
- JP
- Japan
- Prior art keywords
- surface wave
- cap material
- interdigital transducer
- electrode pad
- outside
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims description 5
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims 2
Landscapes
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Description
第１図は本考案の一実施例の表面波装置の断面
図、第２図は第１図実施例に用いられる表面波素
子の平面図、第３図はキヤツプ材を取付けた状態
を示す平面図、第４図は実装工程を説明するため
の断面図、第５図ははんだ隆起部の高さが低い場
合の問題点を説明するための断面図である。
図において、１は表面波基板、２，３はインタ
ーデジタルトランスデユーサ、４ａ，４ｂ，５ａ
，５ｂは接続用電極パツド、８はキヤツプ材、１
４ａ，１４ｂ，１５ａ，１５ｂははんだ隆起部を
示す。
Fig. 1 is a sectional view of a surface wave device according to an embodiment of the present invention, Fig. 2 is a plan view of a surface wave element used in the embodiment of Fig. 1, and Fig. 3 is a plan view showing a state in which a cap material is attached. 4 are cross-sectional views for explaining the mounting process, and FIG. 5 is a cross-sectional view for explaining problems when the height of the solder protrusion is low. In the figure, 1 is a surface wave board, 2 and 3 are interdigital transducers, 4a, 4b, 5a
, 5b is a connection electrode pad, 8 is a cap material, 1
4a, 14b, 15a, and 15b indicate solder protrusions.
Claims (1)
サを形成し、前記インターデジタルトランスデユ
ーサ及び表面波伝搬路上に空洞を設けるために、
インターデジタルトランスデユーサ及び表面波伝
搬路を囲むようにキヤツプ材を設け、前記キヤツ
プ材の外側において基板上に外部との接続用電極
パツトを形成し、前記電極パツド上に、キヤツプ
材よりも高く盛上げられたはんだ隆起部を設けた
ことを特徴とする表面波装置。 In order to form an interdigital transducer on the surface wave substrate and provide a cavity on the interdigital transducer and the surface wave propagation path,
A cap material is provided so as to surround the interdigital transducer and the surface wave propagation path, and an electrode pad for connection with the outside is formed on the substrate on the outside of the cap material, and a height higher than the cap material is formed on the electrode pad. A surface wave device characterized by having a raised solder protrusion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12359988U JPH0244423U (en) | 1988-09-20 | 1988-09-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12359988U JPH0244423U (en) | 1988-09-20 | 1988-09-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0244423U true JPH0244423U (en) | 1990-03-27 |
Family
ID=31372593
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12359988U Pending JPH0244423U (en) | 1988-09-20 | 1988-09-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0244423U (en) |
-
1988
- 1988-09-20 JP JP12359988U patent/JPH0244423U/ja active Pending
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