JPH0244424U - - Google Patents
Info
- Publication number
- JPH0244424U JPH0244424U JP12360088U JP12360088U JPH0244424U JP H0244424 U JPH0244424 U JP H0244424U JP 12360088 U JP12360088 U JP 12360088U JP 12360088 U JP12360088 U JP 12360088U JP H0244424 U JPH0244424 U JP H0244424U
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- sound absorbing
- surface wave
- absorbing material
- wave device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011358 absorbing material Substances 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims 4
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Description
第１図は本考案の一実施例の断面図であり、第
３図―線に沿う部分に相当する図、第２図は
従来の表面波装置を説明するための平面図、第３
図は第１図実施例の分解斜視図、第４図は実施例
及び従来例の減衰量一時間特性を示す図である。
図において、１１は表面波基板、１２，１３は
インターデジタルトランスデユーサ、１６，１７
は吸音材、１８はキヤツプ材を示す。
FIG. 1 is a cross-sectional view of one embodiment of the present invention, FIG. 3 is a view corresponding to the part along the line, FIG.
1 is an exploded perspective view of the embodiment shown in FIG. 1, and FIG. 4 is a diagram showing the attenuation amount over time characteristics of the embodiment and the conventional example. In the figure, 11 is a surface wave board, 12, 13 are interdigital transducers, 16, 17
18 indicates a sound absorbing material, and 18 indicates a cap material.
Claims (1)
ーサを形成し、かつ基板上に吸音材を設けてなる
表面波装置において、 表面波伝搬路、インターデジタルトランスデユ
ーサの形成される領域及び吸音材を被い、かつ取
付けられた際に上記吸音材に上方から基板側に圧
縮応力を付加し得る高さの天板部を有するキヤツ
プ材を前記基板に接合したことを特徴とする表面
波装置。[Claims for Utility Model Registration] A surface wave device in which an interdigital transducer is formed on a surface wave substrate and a sound absorbing material is provided on the substrate. A cap material is bonded to the substrate, and has a top plate portion having a height capable of applying compressive stress from above to the substrate side to the sound absorbing material when attached, and covering the area and the sound absorbing material. surface wave device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12360088U JPH0244424U (en) | 1988-09-20 | 1988-09-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12360088U JPH0244424U (en) | 1988-09-20 | 1988-09-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0244424U true JPH0244424U (en) | 1990-03-27 |
Family
ID=31372595
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12360088U Pending JPH0244424U (en) | 1988-09-20 | 1988-09-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0244424U (en) |
-
1988
- 1988-09-20 JP JP12360088U patent/JPH0244424U/ja active Pending
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