JPH0244714B2 - - Google Patents
Info
- Publication number
- JPH0244714B2 JPH0244714B2 JP59216363A JP21636384A JPH0244714B2 JP H0244714 B2 JPH0244714 B2 JP H0244714B2 JP 59216363 A JP59216363 A JP 59216363A JP 21636384 A JP21636384 A JP 21636384A JP H0244714 B2 JPH0244714 B2 JP H0244714B2
- Authority
- JP
- Japan
- Prior art keywords
- led
- comb
- base plate
- aluminum base
- led array
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000003491 array Methods 0.000 claims description 8
- 238000004519 manufacturing process Methods 0.000 claims description 4
- 238000000034 method Methods 0.000 claims description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 26
- 229910052782 aluminium Inorganic materials 0.000 description 26
- 230000002950 deficient Effects 0.000 description 8
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 239000004020 conductor Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/435—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material
- B41J2/447—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using arrays of radiation sources
- B41J2/45—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using arrays of radiation sources using light-emitting diode [LED] or laser arrays
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Health & Medical Sciences (AREA)
- General Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Dot-Matrix Printers And Others (AREA)
- Printers Or Recording Devices Using Electromagnetic And Radiation Means (AREA)
- Led Device Packages (AREA)
- Led Devices (AREA)
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明はLEDアレイを搭載したLEDプリンタ
の製造方法に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method of manufacturing an LED printer equipped with an LED array.
LEDプリンタには、複数のLEDアレイが高精
度の調整を行なわれて搭載されている。
LED printers are equipped with multiple LED arrays that are precisely calibrated.
その1例を第3図に示して説明する。 An example thereof is shown in FIG. 3 and will be explained.
第3図は従来のLEDプリンタの要部斜視図で
あり、1はLEDアレイ、2はLEDアレイ1を載
置しているアルミナ基板、3はアルミナ基板2上
に形成した配線厚膜導体、4はLEDアレイ1と
アルミナ基板2とよりなるLEDモジユール、5
はアルミベースプレート、6はアルミベースプレ
ート5に取付けた固定ネジであり、前記LEDチ
ツプ4をアルミベースプレート5上に位置決めし
て固定を行なつている。この従来例では、18個の
LEDチツプ4をアルミベースプレート5に直線
状に配置している。 FIG. 3 is a perspective view of the main parts of a conventional LED printer, in which 1 is an LED array, 2 is an alumina substrate on which the LED array 1 is mounted, 3 is a wiring thick film conductor formed on the alumina substrate 2, and 4 is a perspective view of the main parts of a conventional LED printer. 5 is an LED module consisting of an LED array 1 and an alumina substrate 2.
is an aluminum base plate, and 6 is a fixing screw attached to the aluminum base plate 5, which positions and fixes the LED chip 4 on the aluminum base plate 5. In this conventional example, 18
LED chips 4 are arranged linearly on an aluminum base plate 5.
前記のように構成されたLEDプリンタのLED
アレイ1は順次駆動される為にLEDアレイ1同
志は絶縁されている。また、LEDアレイ1の相
対位置も数十ミクロン以内に調整する必要があ
る。前記した従来例では各LEDアレイ1の間隔
は約20μmである。 LED of an LED printer configured as above
Since the array 1 is driven sequentially, the LED arrays 1 are insulated from each other. Furthermore, the relative position of the LED array 1 must also be adjusted to within several tens of microns. In the conventional example described above, the interval between each LED array 1 is about 20 μm.
しかしながら、LEDアレイ1はパワーのバラ
ツキやその他の不良原因で配置された18個の
LEDモジユール4中の何個かの交換が不可欠な
ために、その交換作業において隣接するLEDモ
ジユール4の破損発生率が高くなるという欠点が
ある。
However, LED array 1 has 18 LEDs arranged due to power variations or other defects.
Since it is necessary to replace some of the LED modules 4, there is a drawback that the probability of damage to adjacent LED modules 4 increases during the replacement work.
そこで本発明は、LEDプリンタの製造方法を
改良して不良LEDチツプ4の交換を容易にする
と共に、LEDアレイ1の位置合わせも容易にす
るものである。 Therefore, the present invention improves the manufacturing method of an LED printer to facilitate the replacement of defective LED chips 4 and also facilitates alignment of the LED array 1.
前記した問題点を解決するために、本発明は
LEDアレイの奇数番目と偶数番目とを分離して
予じめ所定精度の基に搭載できるように、ベース
プレートを櫛型のベースプレートに2分すること
としている。
In order to solve the above-mentioned problems, the present invention
The base plate is divided into two comb-shaped base plates so that the odd-numbered and even-numbered LED arrays can be separated and mounted with a predetermined accuracy.
〔作用〕
前記した手段によれば、両櫛型ベースプレート
の櫛歯上に予じめ所定の精度でLEDアレイを搭
載した後、両櫛型ベースプレートを結合する前に
LEDアレイの動作特性を確認し、不良LEDアレ
イが存在すればその交換を行なうことができる。
また、両櫛型ベースプレートを結合してLEDア
レイの配列を一体化した後に不良LEDアレイが
発見された場合には両櫛型ベースプレートを分離
した後に、その交換を行なうことができる。[Operation] According to the above-mentioned means, after the LED array is mounted in advance on the comb teeth of both comb-shaped base plates with a predetermined precision, and before the two comb-shaped base plates are combined,
You can check the operating characteristics of the LED array and replace any defective LED arrays.
Furthermore, if a defective LED array is discovered after the two comb-shaped base plates have been combined to integrate the LED array arrangement, it can be replaced after the two comb-shaped base plates have been separated.
以下に、本発明の一実施例を図面に基づいて説
明する。
An embodiment of the present invention will be described below based on the drawings.
第1図は本発明の一実施例による結合前の櫛型
アルミベースプレートの斜視図、第2図は結合後
の櫛型アルミベースプレートの斜視図であり、1
はLEDアレイ、2はアルミナ基板、3は配線厚
膜導体、4はLEDモジユール、6は固定ネジで
あり、これらは前記従来例と同様の部品なので従
来例と同一の符号で示してある。 FIG. 1 is a perspective view of a comb-shaped aluminum base plate before being combined according to an embodiment of the present invention, and FIG. 2 is a perspective view of a comb-shaped aluminum base plate after being combined.
2 is an LED array, 2 is an alumina substrate, 3 is a wiring thick film conductor, 4 is an LED module, and 6 is a fixing screw. These are the same parts as in the conventional example, so they are indicated by the same symbols as in the conventional example.
7aは奇数番用の櫛型アルミベースプレート、
7bは偶数番用の櫛型アルミベースプレートであ
る。 7a is a comb-shaped aluminum base plate for odd numbers,
7b is a comb-shaped aluminum base plate for even numbers.
本実施例ではLEDモジユール4を搭載するア
ルミベースプレートを、配列されるLEDチツプ
4の奇数番目と偶数番目とを分離して搭載できる
ように櫛型アルミベースプレート7a,7bと
し、この両者を結合、分離できるようにしたもの
であり、櫛型アルミベースプレート7a,7bの
櫛歯上にそれぞれLEDモジユール4を規定位置
に高精度で固定ネジ6により固定し、櫛型アルミ
ベースプレート7a,7bを結合する前に、搭載
したLEDアレイ1の動作特性を充分に確認し、
もし不良LEDアレイ1があつた場合には、この
段階でそのLEDモジユール4を交換する。従つ
て、この交換されるLEDチツプ4の両隣りには
他のLEDモジユール4は存在しないので、他の
LEDモジユール4を損傷することはない。 In this embodiment, the aluminum base plate on which the LED module 4 is mounted is a comb-shaped aluminum base plate 7a, 7b so that the odd numbered and even numbered LED chips 4 to be arranged can be mounted separately, and the two are combined and separated. The LED module 4 is fixed on the comb teeth of the comb-shaped aluminum base plates 7a, 7b with high precision at a specified position using the fixing screws 6, and before the comb-shaped aluminum base plates 7a, 7b are combined. , Thoroughly check the operating characteristics of the installed LED array 1,
If there is a defective LED array 1, replace the LED module 4 at this stage. Therefore, since there are no other LED modules 4 on either side of the LED chip 4 to be replaced,
It will not damage the LED module 4.
このようにして、櫛型アルミベースプレート7
a,7bには良好な特性のLEDアレイ1のみを
搭載した後に、両者を第2図に示すように結合す
る。この櫛型アルミベースプレート7a,7bを
結合した状態で、再びLEDアレイ1の動作特性
を確認し、交換の必要なLEDモジユール4が発
見された場合には、櫛型アルミベースプレート7
a,7bを分離して、各LEDモジユール4が隣
接しない状態で、不良LEDチツプ4の交換を行
なう。 In this way, the comb-shaped aluminum base plate 7
After mounting only the LED array 1 with good characteristics on a and 7b, both are connected as shown in FIG. With the comb-shaped aluminum base plates 7a and 7b combined, check the operating characteristics of the LED array 1 again, and if any LED module 4 that requires replacement is found, replace the comb-shaped aluminum base plate 7.
A and 7b are separated and the defective LED chip 4 is replaced in a state where the LED modules 4 are not adjacent to each other.
なお、櫛型アルミベースプレート7a,7b
は、結合された時に搭載した奇数番目のLEDア
レイ1と偶数番目のLEDアレイ1とが直線状で、
かつ適正間隔で配置され、スムーズな結合、分離
が行なえるよう高精度に加工されていることはい
うまでもない。 In addition, the comb-shaped aluminum base plates 7a, 7b
When combined, the odd-numbered LED array 1 and the even-numbered LED array 1 are in a straight line,
Needless to say, they are arranged at appropriate intervals and processed with high precision to ensure smooth connection and separation.
本発明は、以上説明したように奇数番目と偶数
番目のLEDアレイが分離されて予じめ所定の精
度の基に搭載されるようにアルミベースプレート
を2分し、結合、分離が可能となるように櫛型の
アルミベースプレートとしたので、この櫛型アル
ミベースプレートに搭載されたLEDアレイは櫛
型アルミベースプレートの結合前に動作特性の確
認を行なつて不良LEDチツプの交換を行なえる。
すなわち、不良LEDチツプの両側には他のLED
チツプが隣設していない交換作業となるので他の
LEDチツプを損傷させない効果がある。また、
櫛型アルミベースプレートの結合後に不良LED
チツプを発見した場合にも櫛型アルミベースプレ
ートは分離できるので、この場合にも前記同様の
LEDチツプの交換作業を行なうことができる。
As explained above, the present invention divides the aluminum base plate into two parts so that the odd-numbered and even-numbered LED arrays are separated and mounted on a predetermined precision basis, so that they can be combined and separated. Since a comb-shaped aluminum base plate is used, the operating characteristics of the LED array mounted on this comb-shaped aluminum base plate can be checked before the comb-shaped aluminum base plate is connected, and defective LED chips can be replaced.
In other words, there are other LEDs on both sides of the defective LED chip.
Since the replacement work is not done with chips installed next to each other, other
It has the effect of not damaging the LED chip. Also,
Defective LED after combining comb-shaped aluminum base plate
The comb-shaped aluminum base plate can be separated even if a chip is found, so in this case, the same procedure as above should be carried out.
LED chips can be replaced.
そして、LEDアレイの位置合わせにおいても、
櫛型アルミベースプレートを結合する前の各
LEDチツプの間隔が広い状態で行なうことがで
きるので、その作業状態は従来の密に配列されて
いる作業状態に比べて作業性を大いに向上させる
効果も有している。 Also, when aligning the LED array,
Each before joining the comb-shaped aluminum base plate
Since the LED chips can be spaced widely apart, this working condition has the effect of greatly improving work efficiency compared to the conventional working condition in which they are closely arranged.
第1図は本発明の一実施例による結合前の櫛型
アルミベースプレートの斜視図、第2図はその結
合後の櫛型アルミベースプレートの斜視図、第3
図は従来のLEDプリンタの要部斜視図である。
1……LEDアレイ、4……LEDモジユール、
7a,7b……櫛型アルミベースプレート。
FIG. 1 is a perspective view of a comb-shaped aluminum base plate before being combined according to an embodiment of the present invention, FIG. 2 is a perspective view of a comb-shaped aluminum base plate after being combined, and FIG.
The figure is a perspective view of the main parts of a conventional LED printer. 1...LED array, 4...LED module,
7a, 7b... Comb-shaped aluminum base plate.
Claims (1)
プレート上に搭載したLEDプリンターの製造方
法において、前記複数のLEDアレイの奇数番目
と偶数番目とを分離して搭載できるように前記ベ
ースプレートを櫛型ベースプレートに2分し、該
両ベースプレートの櫛歯上に所定精度の基に
LEDアレイを搭載し、その各LEDアレイの特性
を確認した後に両櫛型ベースプレートを結合して
LEDアレイの配列を一体化することを特徴とし
たLEDプリンタの製造方法。1. In a method for manufacturing an LED printer in which a plurality of LED arrays are mounted on a base plate based on a predetermined accuracy, the base plate is formed into a comb-shaped base plate so that odd-numbered and even-numbered LED arrays can be mounted separately. Divide into two and place on the comb teeth of both base plates based on the specified accuracy.
After installing the LED array and checking the characteristics of each LED array, the two comb-shaped base plates are combined.
A method of manufacturing an LED printer characterized by integrating an arrangement of LED arrays.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59216363A JPS6194775A (en) | 1984-10-17 | 1984-10-17 | Manufacture of led printer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59216363A JPS6194775A (en) | 1984-10-17 | 1984-10-17 | Manufacture of led printer |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6194775A JPS6194775A (en) | 1986-05-13 |
| JPH0244714B2 true JPH0244714B2 (en) | 1990-10-04 |
Family
ID=16687393
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59216363A Granted JPS6194775A (en) | 1984-10-17 | 1984-10-17 | Manufacture of led printer |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6194775A (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0284354A (en) * | 1988-09-21 | 1990-03-26 | Fuji Xerox Co Ltd | Device for forming of electrostatic latent image |
| US7038706B1 (en) | 1999-04-07 | 2006-05-02 | Ricoh Company Ltd. | Optical write apparatus including a plurality of substrates |
| CN107170773B (en) * | 2017-05-23 | 2019-09-17 | 深圳市华星光电技术有限公司 | Micro- LED display panel and preparation method thereof |
-
1984
- 1984-10-17 JP JP59216363A patent/JPS6194775A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6194775A (en) | 1986-05-13 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5950067A (en) | Method of fabricating a thermoelectric module | |
| US6452115B2 (en) | Circuit pattern for multi-layer circuit board for mounting electronic parts | |
| DE3990986C2 (en) | LED print head | |
| EP0538003B1 (en) | Method of manufacturing inversion type ICs and IC module using same | |
| US4942405A (en) | Light emitting diode print head assembly | |
| DE112014001534T5 (en) | image sensor | |
| EP0125632B1 (en) | Light emitting diode array and method of producing the same | |
| US5275897A (en) | Precisely aligned lead frame using registration traces and pads | |
| JPH0244714B2 (en) | ||
| EP0713776B1 (en) | Module for an ink printing head | |
| US6683323B2 (en) | Semiconductor chip | |
| JPS61205154A (en) | Method for aligning light emitting element module in optical printing head | |
| JPS61205153A (en) | Optical printing head | |
| US4300146A (en) | Electrostatic write head | |
| JP2003312048A (en) | Printer head and method of manufacturing the same | |
| JPS58125879A (en) | Solid element and solid element array | |
| JP3581919B2 (en) | Peltier module positioning member and Peltier module assembly method | |
| DE102008051044A1 (en) | Optoelectronic component | |
| JP3609822B2 (en) | LED print head | |
| JPS61209175A (en) | Led print head | |
| JPH0443434B2 (en) | ||
| JPH05532A (en) | Optical printing head | |
| JPS59145580A (en) | Array of solid-state element | |
| JPS6226875A (en) | Light-emitting diode unit | |
| JPS6295250A (en) | Thermal printing head apparatus |