JPH0245620U - - Google Patents

Info

Publication number
JPH0245620U
JPH0245620U JP12533788U JP12533788U JPH0245620U JP H0245620 U JPH0245620 U JP H0245620U JP 12533788 U JP12533788 U JP 12533788U JP 12533788 U JP12533788 U JP 12533788U JP H0245620 U JPH0245620 U JP H0245620U
Authority
JP
Japan
Prior art keywords
multilayer
stacked
multilayer capacitor
capacitors
multilayer capacitors
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12533788U
Other languages
Japanese (ja)
Other versions
JPH0614458Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988125337U priority Critical patent/JPH0614458Y2/en
Publication of JPH0245620U publication Critical patent/JPH0245620U/ja
Application granted granted Critical
Publication of JPH0614458Y2 publication Critical patent/JPH0614458Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Ceramic Capacitors (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案の一実施例を説明するための分
解斜視図、第２図は本考案の一実施例に用いられ
る１の積層コンデンサの断面図、第３図は本考案
の一実施例の積層コンデンサ集合体を回路基板上
に実装した状態の断面図である。 図において、１〜３は積層コンデンサ、６〜９
は内部電極、１０，１１は外部電極、１２，１３
は金属端子板を示す。 Fig. 1 is an exploded perspective view for explaining an embodiment of the present invention, Fig. 2 is a sectional view of a multilayer capacitor 1 used in an embodiment of the present invention, and Fig. 3 is an embodiment of the present invention. FIG. 2 is a cross-sectional view of a multilayer capacitor assembly mounted on a circuit board. In the figure, 1 to 3 are multilayer capacitors, 6 to 9
are internal electrodes, 10 and 11 are external electrodes, 12 and 13
indicates a metal terminal plate.

Claims (1)

【実用新案登録請求の範囲】 内部電極の引出されている一対の端面を揃えて
重ね合わされた複数個の積層コンデンサと、 前記積み重ねられた積層コンデンサの内部電極
の引出されている端面側において、各積層コンデ
ンサの内部電極に電気的に接続されると共に、積
層された積層コンデンサを一体化するように、前
記各端面に機械的に接合された金属端子板とを備
えることを特徴とする積層コンデンサ集合体。[Claims for Utility Model Registration] A plurality of multilayer capacitors stacked one on top of the other with a pair of end faces from which internal electrodes are drawn out aligned; A multilayer capacitor assembly comprising a metal terminal plate electrically connected to an internal electrode of the multilayer capacitor and mechanically bonded to each end face so as to integrate the stacked multilayer capacitors. body.
JP1988125337U 1988-09-26 1988-09-26 Multilayer capacitor assembly Expired - Lifetime JPH0614458Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988125337U JPH0614458Y2 (en) 1988-09-26 1988-09-26 Multilayer capacitor assembly

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988125337U JPH0614458Y2 (en) 1988-09-26 1988-09-26 Multilayer capacitor assembly

Publications (2)

Publication Number Publication Date
JPH0245620U true JPH0245620U (en) 1990-03-29
JPH0614458Y2 JPH0614458Y2 (en) 1994-04-13

Family

ID=31375855

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988125337U Expired - Lifetime JPH0614458Y2 (en) 1988-09-26 1988-09-26 Multilayer capacitor assembly

Country Status (1)

Country Link
JP (1) JPH0614458Y2 (en)

Cited By (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03245515A (en) * 1990-02-23 1991-11-01 Mitsubishi Materials Corp Terminal electrode plate for stack capacitor chip and mounting method for same
JPH04229017A (en) * 1990-04-26 1992-08-18 Northern Telecom Ltd Failed power supply opening unit
JPH058932U (en) * 1991-07-12 1993-02-05 株式会社村田製作所 Large power, large capacity capacitor
JPH10303060A (en) * 1997-04-25 1998-11-13 Marcon Electron Co Ltd Electronic components
JPH1145821A (en) * 1997-07-25 1999-02-16 Tdk Corp Composite multilayer ceramic capacitors with metal terminals
JPH1174147A (en) * 1997-06-27 1999-03-16 Tdk Corp Ceramic capacitor
JPH11219847A (en) * 1998-01-29 1999-08-10 Tdk Corp Ceramic capacitor
JPH11233373A (en) * 1998-02-16 1999-08-27 Murata Mfg Co Ltd Ceramic electronic components
JPH11251186A (en) * 1998-02-26 1999-09-17 Kyocera Corp Stack type ceramic capacitor
JPH11251176A (en) * 1998-03-02 1999-09-17 Murata Mfg Co Ltd Ceramic electronic components
JP2000223359A (en) * 1999-01-29 2000-08-11 Murata Mfg Co Ltd Ceramic electronic components
JP2002043166A (en) * 2000-07-24 2002-02-08 Matsushita Electric Ind Co Ltd Electronic components
JP2004288847A (en) * 2003-03-20 2004-10-14 Tdk Corp Electronic component
JP2015128084A (en) * 2013-12-27 2015-07-09 Tdk株式会社 Electronic components
JP2018510507A (en) * 2015-02-27 2018-04-12 エプコス アクチエンゲゼルシャフトＥｐｃｏｓ Ａｇ Electrical connection contacts for ceramic elements, ceramic elements and element systems
JP2019149570A (en) * 2019-05-10 2019-09-05 Tdk株式会社 Electronic component
JP2020004826A (en) * 2018-06-27 2020-01-09 株式会社村田製作所 Multilayer ceramic electronic components
CN116190108A (en) * 2021-11-29 2023-05-30 三星电机株式会社 Multilayer Electronic Assemblies
KR20230080177A (en) * 2021-11-29 2023-06-07 한국전자기술연구원 Vibration endurance Multilayer Ceramic Capacitor module and Multilayer Ceramic Capacitor package comprising the same
EP4428879A1 (en) * 2023-03-07 2024-09-11 Samsung Electro-Mechanics Co., Ltd. Connecting lead frame for a multilayer ceramic component
US12400796B2 (en) 2022-09-08 2025-08-26 Tdk Corporation Electronic component

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4888942U (en) * 1972-01-31 1973-10-26
JPS54184444U (en) * 1978-06-19 1979-12-27

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4888942U (en) * 1972-01-31 1973-10-26
JPS54184444U (en) * 1978-06-19 1979-12-27

Cited By (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03245515A (en) * 1990-02-23 1991-11-01 Mitsubishi Materials Corp Terminal electrode plate for stack capacitor chip and mounting method for same
JPH04229017A (en) * 1990-04-26 1992-08-18 Northern Telecom Ltd Failed power supply opening unit
JPH058932U (en) * 1991-07-12 1993-02-05 株式会社村田製作所 Large power, large capacity capacitor
JPH10303060A (en) * 1997-04-25 1998-11-13 Marcon Electron Co Ltd Electronic components
JPH1174147A (en) * 1997-06-27 1999-03-16 Tdk Corp Ceramic capacitor
JPH1145821A (en) * 1997-07-25 1999-02-16 Tdk Corp Composite multilayer ceramic capacitors with metal terminals
JPH11219847A (en) * 1998-01-29 1999-08-10 Tdk Corp Ceramic capacitor
JPH11233373A (en) * 1998-02-16 1999-08-27 Murata Mfg Co Ltd Ceramic electronic components
JPH11251186A (en) * 1998-02-26 1999-09-17 Kyocera Corp Stack type ceramic capacitor
JPH11251176A (en) * 1998-03-02 1999-09-17 Murata Mfg Co Ltd Ceramic electronic components
JP2000223359A (en) * 1999-01-29 2000-08-11 Murata Mfg Co Ltd Ceramic electronic components
JP2002043166A (en) * 2000-07-24 2002-02-08 Matsushita Electric Ind Co Ltd Electronic components
JP2004288847A (en) * 2003-03-20 2004-10-14 Tdk Corp Electronic component
JP2015128084A (en) * 2013-12-27 2015-07-09 Tdk株式会社 Electronic components
JP2018510507A (en) * 2015-02-27 2018-04-12 エプコス アクチエンゲゼルシャフトＥｐｃｏｓ Ａｇ Electrical connection contacts for ceramic elements, ceramic elements and element systems
US10395843B2 (en) 2015-02-27 2019-08-27 Epcos Ag Electrical connection contact for a ceramic component, a ceramic component, and a component arrangement
JP2019176164A (en) * 2015-02-27 2019-10-10 ティーディーケイ・エレクトロニクス・アクチェンゲゼルシャフトＴｄｋ Ｅｌｅｃｔｒｏｎｉｃｓ Ａｇ Electric element and method of manufacturing the same
US10943740B2 (en) 2015-02-27 2021-03-09 Epcos Ag Electrical connection contact for a ceramic component, a ceramic component, and a component arrangement
US11342126B2 (en) 2015-02-27 2022-05-24 Epcos Ag Electrical component and a method for producing an electrical component
JP2020004826A (en) * 2018-06-27 2020-01-09 株式会社村田製作所 Multilayer ceramic electronic components
US11527364B2 (en) 2018-06-27 2022-12-13 Murata Manufacturing Co., Ltd. Multilayer ceramic electronic component including a plurality of bodies and metal terminals connected to outer electrodes
JP2019149570A (en) * 2019-05-10 2019-09-05 Tdk株式会社 Electronic component
KR20230080177A (en) * 2021-11-29 2023-06-07 한국전자기술연구원 Vibration endurance Multilayer Ceramic Capacitor module and Multilayer Ceramic Capacitor package comprising the same
CN116190108A (en) * 2021-11-29 2023-05-30 三星电机株式会社 Multilayer Electronic Assemblies
JP2023080022A (en) * 2021-11-29 2023-06-08 サムソン エレクトロ－メカニックス カンパニーリミテッド． Multilayer electronic component
JP2024102340A (en) * 2021-11-29 2024-07-30 サムソン エレクトロ－メカニックス カンパニーリミテッド． Multilayer Electronic Components
CN116190108B (en) * 2021-11-29 2026-03-27 三星电机株式会社 Multilayer electronic components
US12614666B2 (en) 2021-11-29 2026-04-28 Samsung Electro-Mechanics Co., Ltd. Multilayer electronic component
US12400796B2 (en) 2022-09-08 2025-08-26 Tdk Corporation Electronic component
EP4428879A1 (en) * 2023-03-07 2024-09-11 Samsung Electro-Mechanics Co., Ltd. Connecting lead frame for a multilayer ceramic component
US12537133B2 (en) 2023-03-07 2026-01-27 Samsung Electro-Mechanics Co., Ltd. Electronic component

Also Published As

Publication number Publication date
JPH0614458Y2 (en) 1994-04-13

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