JPH0245670U - - Google Patents
Info
- Publication number
- JPH0245670U JPH0245670U JP12455988U JP12455988U JPH0245670U JP H0245670 U JPH0245670 U JP H0245670U JP 12455988 U JP12455988 U JP 12455988U JP 12455988 U JP12455988 U JP 12455988U JP H0245670 U JPH0245670 U JP H0245670U
- Authority
- JP
- Japan
- Prior art keywords
- metal wiring
- thick film
- circuit board
- insulating coating
- film metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 5
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims description 2
- 239000000919 ceramic Substances 0.000 description 1
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
Description
第１図は本考案の第１実施例の要部の断面図、
第２図は本考案の第２実施例の要部の断面図、第
３図は従来構造の一部の断面図である。
１……セラミツク基板、１ａ……凹部、２……
厚膜金属配線、２ａ……金属配線端部、３……絶
縁コート膜、４……鉛錫半田。
FIG. 1 is a sectional view of the main parts of the first embodiment of the present invention,
FIG. 2 is a sectional view of a main part of a second embodiment of the present invention, and FIG. 3 is a sectional view of a part of a conventional structure. 1... Ceramic substrate, 1a... Concave portion, 2...
Thick film metal wiring, 2a...metal wiring end, 3...insulating coating film, 4...lead tin solder.
Claims (1)
田が取着される厚膜金属配線を絶縁基板上に形成
してなる回路基板において、前記絶縁コート膜の
端部における厚膜金属配線の膜厚を他の部分より
も厚く形成したことを特徴とする厚膜金属配線回
路基板。 In a circuit board formed by forming thick film metal wiring on an insulating substrate, a part of which is covered with an insulating coating film and another part of which is attached with solder, the thick film metal wiring at the end of the insulating coating film is A thick film metal wiring circuit board characterized by having a film thicker than other parts.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12455988U JPH0245670U (en) | 1988-09-22 | 1988-09-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12455988U JPH0245670U (en) | 1988-09-22 | 1988-09-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0245670U true JPH0245670U (en) | 1990-03-29 |
Family
ID=31374400
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12455988U Pending JPH0245670U (en) | 1988-09-22 | 1988-09-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0245670U (en) |
-
1988
- 1988-09-22 JP JP12455988U patent/JPH0245670U/ja active Pending